JPH0337566B2 - - Google Patents

Info

Publication number
JPH0337566B2
JPH0337566B2 JP58213353A JP21335383A JPH0337566B2 JP H0337566 B2 JPH0337566 B2 JP H0337566B2 JP 58213353 A JP58213353 A JP 58213353A JP 21335383 A JP21335383 A JP 21335383A JP H0337566 B2 JPH0337566 B2 JP H0337566B2
Authority
JP
Japan
Prior art keywords
resin
weight
adsorption
parts
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58213353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60106826A (ja
Inventor
Masatoshi Ichi
Masayuki Kobayashi
Shinichiro Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP21335383A priority Critical patent/JPS60106826A/ja
Publication of JPS60106826A publication Critical patent/JPS60106826A/ja
Publication of JPH0337566B2 publication Critical patent/JPH0337566B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP21335383A 1983-11-15 1983-11-15 半導体装置封止用エポキシ樹脂組成物 Granted JPS60106826A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21335383A JPS60106826A (ja) 1983-11-15 1983-11-15 半導体装置封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21335383A JPS60106826A (ja) 1983-11-15 1983-11-15 半導体装置封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS60106826A JPS60106826A (ja) 1985-06-12
JPH0337566B2 true JPH0337566B2 (cs) 1991-06-06

Family

ID=16637756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21335383A Granted JPS60106826A (ja) 1983-11-15 1983-11-15 半導体装置封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS60106826A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997006199A1 (fr) * 1995-08-04 1997-02-20 Asahi Denka Kogyo Kabushiki Kaisha Composition solidifiable de resine epoxy
WO1997006198A1 (fr) * 1995-08-04 1997-02-20 Asahi Denka Kogyo Kabushiki Kaisha Composition de resine epoxy durcissable permettant d'obtenir un article flexible solidifie

Also Published As

Publication number Publication date
JPS60106826A (ja) 1985-06-12

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