JPH033744U - - Google Patents
Info
- Publication number
- JPH033744U JPH033744U JP6444689U JP6444689U JPH033744U JP H033744 U JPH033744 U JP H033744U JP 6444689 U JP6444689 U JP 6444689U JP 6444689 U JP6444689 U JP 6444689U JP H033744 U JPH033744 U JP H033744U
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- holding
- processed surface
- jig
- set temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 2
Description
第１図と第２図はそれぞれ本考案の一実施例の
ガラス基板治具における加熱前と設定温度到達時
の状態を示す要部断面図、第３図と第４図はそれ
ぞれ従来のガラス基板治具における加熱前と加熱
時の状態を示す要部断面図である。
１……ガラス基板、１ａ……加工表面、２０…
…ガラス基板治具、２１……治具背板、２２……
治具外枠、２２ａ……保持部。
Figures 1 and 2 are cross-sectional views of main parts of a glass substrate jig according to an embodiment of the present invention before heating and when the set temperature is reached, respectively, and Figures 3 and 4 are sectional views of a conventional glass substrate jig, respectively. FIG. 3 is a cross-sectional view of a main part showing the state of the jig before and during heating. 1... Glass substrate, 1a... Processed surface, 20...
...Glass substrate jig, 21...Jig back plate, 22...
Jig outer frame, 22a...holding part.
Claims (1)
基板を保持するガラス基板治具において、 前記ガラス基板の加工表面の周辺部分を接触保
持する保持部を備え、該保持部を、加工時の設定
温度で前記ガラス基板の加工表面に接触し、かつ
該設定温度以下で前記ガラス基板の加工表面から
所定角度を持つて離れるように記憶させた形状記
憶合金で形成したことを特徴とするガラス基板治
具。[Claims for Utility Model Registration] A glass substrate jig for holding a glass substrate used in a heated state in a chamber, comprising a holding part for contacting and holding a peripheral part of a processed surface of the glass substrate, the holding part is made of a shape memory alloy that is memorized to be in contact with the processed surface of the glass substrate at a set temperature during processing, and to separate from the processed surface of the glass substrate at a predetermined angle below the set temperature. Characteristic glass substrate jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6444689U JPH033744U (en) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6444689U JPH033744U (en) | 1989-06-01 | 1989-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033744U true JPH033744U (en) | 1991-01-16 |
Family
ID=31595404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6444689U Pending JPH033744U (en) | 1989-06-01 | 1989-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033744U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134725A (en) * | 2002-08-09 | 2004-04-30 | Fuji Electric Device Technology Co Ltd | Semiconductor wafer holding fixture and manufacturing method for semiconductor element |
-
1989
- 1989-06-01 JP JP6444689U patent/JPH033744U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004134725A (en) * | 2002-08-09 | 2004-04-30 | Fuji Electric Device Technology Co Ltd | Semiconductor wafer holding fixture and manufacturing method for semiconductor element |