JPH0460363U - - Google Patents
Info
- Publication number
- JPH0460363U JPH0460363U JP10014090U JP10014090U JPH0460363U JP H0460363 U JPH0460363 U JP H0460363U JP 10014090 U JP10014090 U JP 10014090U JP 10014090 U JP10014090 U JP 10014090U JP H0460363 U JPH0460363 U JP H0460363U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hot plate
- support frame
- board
- preheating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000008187 granular material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は、本考案の基板予熱装置を示す側断面
図、第2図は、従来の基板予熱装置を示す側面図
である。
1……基板予熱装置、2……ホツトプレート、
3……支持枠体、4……粒状物、30……基板、
31……部品。
FIG. 1 is a side sectional view showing a substrate preheating device of the present invention, and FIG. 2 is a side view showing a conventional substrate preheating device. 1...Substrate preheating device, 2...Hot plate,
3...Support frame body, 4...Particles, 30...Substrate,
31...Parts.
Claims (1)
用いて後付け作業する際に、該基板を予熱する基
板予熱装置において、 熱源としてのホツトプレート2と、 該ホツトプレート上に設けられる支持枠体3と
、 熱容量が大きく球状に形成されて該支持枠体内
に積載され、前記基板の片面全面に接触する粒状
物4と、 を具備したことを特徴とする基板予熱装置。[Claims for Utility Model Registration] A board preheating device for preheating a board 30 having a large heat capacity when a component 31 is retrofitted using solder, comprising: a hot plate 2 as a heat source; and a hot plate on the hot plate. A substrate preheating device comprising: a support frame 3 provided in a substrate; and granules 4 having a large heat capacity, formed into a spherical shape, loaded in the support frame, and in contact with the entire surface of one side of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990100140U JP2515883Y2 (en) | 1990-09-27 | 1990-09-27 | Substrate preheating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990100140U JP2515883Y2 (en) | 1990-09-27 | 1990-09-27 | Substrate preheating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0460363U true JPH0460363U (en) | 1992-05-25 |
JP2515883Y2 JP2515883Y2 (en) | 1996-10-30 |
Family
ID=31842560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990100140U Expired - Lifetime JP2515883Y2 (en) | 1990-09-27 | 1990-09-27 | Substrate preheating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2515883Y2 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
-
1990
- 1990-09-27 JP JP1990100140U patent/JP2515883Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
Also Published As
Publication number | Publication date |
---|---|
JP2515883Y2 (en) | 1996-10-30 |
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