JPH0460363U - - Google Patents

Info

Publication number
JPH0460363U
JPH0460363U JP10014090U JP10014090U JPH0460363U JP H0460363 U JPH0460363 U JP H0460363U JP 10014090 U JP10014090 U JP 10014090U JP 10014090 U JP10014090 U JP 10014090U JP H0460363 U JPH0460363 U JP H0460363U
Authority
JP
Japan
Prior art keywords
substrate
hot plate
support frame
board
preheating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10014090U
Other languages
Japanese (ja)
Other versions
JP2515883Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990100140U priority Critical patent/JP2515883Y2/en
Publication of JPH0460363U publication Critical patent/JPH0460363U/ja
Application granted granted Critical
Publication of JP2515883Y2 publication Critical patent/JP2515883Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の基板予熱装置を示す側断面
図、第2図は、従来の基板予熱装置を示す側面図
である。 1……基板予熱装置、2……ホツトプレート、
3……支持枠体、4……粒状物、30……基板、
31……部品。
FIG. 1 is a side sectional view showing a substrate preheating device of the present invention, and FIG. 2 is a side view showing a conventional substrate preheating device. 1...Substrate preheating device, 2...Hot plate,
3...Support frame body, 4...Particles, 30...Substrate,
31...Parts.

Claims (1)

【実用新案登録請求の範囲】 熱容量の大きな基板30上に部品31を半田を
用いて後付け作業する際に、該基板を予熱する基
板予熱装置において、 熱源としてのホツトプレート2と、 該ホツトプレート上に設けられる支持枠体3と
、 熱容量が大きく球状に形成されて該支持枠体内
に積載され、前記基板の片面全面に接触する粒状
物4と、 を具備したことを特徴とする基板予熱装置。
[Claims for Utility Model Registration] A board preheating device for preheating a board 30 having a large heat capacity when a component 31 is retrofitted using solder, comprising: a hot plate 2 as a heat source; and a hot plate on the hot plate. A substrate preheating device comprising: a support frame 3 provided in a substrate; and granules 4 having a large heat capacity, formed into a spherical shape, loaded in the support frame, and in contact with the entire surface of one side of the substrate.
JP1990100140U 1990-09-27 1990-09-27 Substrate preheating device Expired - Lifetime JP2515883Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990100140U JP2515883Y2 (en) 1990-09-27 1990-09-27 Substrate preheating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990100140U JP2515883Y2 (en) 1990-09-27 1990-09-27 Substrate preheating device

Publications (2)

Publication Number Publication Date
JPH0460363U true JPH0460363U (en) 1992-05-25
JP2515883Y2 JP2515883Y2 (en) 1996-10-30

Family

ID=31842560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990100140U Expired - Lifetime JP2515883Y2 (en) 1990-09-27 1990-09-27 Substrate preheating device

Country Status (1)

Country Link
JP (1) JP2515883Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426476A (en) * 1977-07-29 1979-02-28 Fujitsu Ltd Reflow solder dipping device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5426476A (en) * 1977-07-29 1979-02-28 Fujitsu Ltd Reflow solder dipping device

Also Published As

Publication number Publication date
JP2515883Y2 (en) 1996-10-30

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