JPH0337232Y2 - - Google Patents
Info
- Publication number
- JPH0337232Y2 JPH0337232Y2 JP11543085U JP11543085U JPH0337232Y2 JP H0337232 Y2 JPH0337232 Y2 JP H0337232Y2 JP 11543085 U JP11543085 U JP 11543085U JP 11543085 U JP11543085 U JP 11543085U JP H0337232 Y2 JPH0337232 Y2 JP H0337232Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- outer ring
- metal outer
- airtight terminal
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 26
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 238000007789 sealing Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543085U JPH0337232Y2 (US20020051482A1-20020502-M00012.png) | 1985-07-26 | 1985-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11543085U JPH0337232Y2 (US20020051482A1-20020502-M00012.png) | 1985-07-26 | 1985-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6223450U JPS6223450U (US20020051482A1-20020502-M00012.png) | 1987-02-13 |
| JPH0337232Y2 true JPH0337232Y2 (US20020051482A1-20020502-M00012.png) | 1991-08-07 |
Family
ID=30999075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11543085U Expired JPH0337232Y2 (US20020051482A1-20020502-M00012.png) | 1985-07-26 | 1985-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337232Y2 (US20020051482A1-20020502-M00012.png) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100409046B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서의 절연체 구조 |
| KR100409045B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 간극조정 구조 |
| KR100409043B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공센서의 전극판 제조방법 |
| KR100409044B1 (ko) * | 2001-03-07 | 2003-12-11 | (주)케이브이씨인스트루먼트 | 커패시턴스 진공 센서구조 |
| CN104909585B (zh) | 2009-04-16 | 2017-12-08 | 艾默生电气公司 | 气密玻璃至金属密封组件及其制造方法 |
-
1985
- 1985-07-26 JP JP11543085U patent/JPH0337232Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6223450U (US20020051482A1-20020502-M00012.png) | 1987-02-13 |
