JPH0336756A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent an electrode terminal from being deformed upon screwing an electrode to be connected to the electrode terminal, and hence secure the screwing by providing a fixed piece facing to the inside of an outer casing and fixed by sealing resin, to the tip end of an external connection electrode. CONSTITUTION:Fixed pieces 11, 12, 13 are integrally formed and protruded on the tip ends of external connection parts 5a, 6a, 7a in electrode terminals 5, 6, 7, and folded by 90 deg. inwardly of a casing 3. First, the electrode terminals 5, 6, 7 are connected onto an insulating circuit board 1 joined with a substrate 2, and then the casing 3 is bonded onto the substrate 2. Further, the external connection parts 5a, 6a, 7a of the respective electrode terminals 5, 6, 7 are folded by 90 deg. at the electrode terminal support part 3b of the casing 3, the the respective fixed pieces 11, 12, 13 are folded by 90 deg. inwardly of the casing 3. After the folding of the electrode terminals 5, 6, 7 has been completed, a chip coating material 8 and a resin molding material 9 are injected from an opening 3c in the casing 3 into the casing in order, and the resin molding material 9 is heated and cured to complete the assembling of the semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device such as a power module, and particularly to an electrode terminal structure of a package.

[Conventional technology]

Conventionally, some semiconductor devices such as power modules are equipped with external connection electrode terminals to which terminals of external devices are connected by screwing. A conventional semiconductor device of this type will be explained with reference to FIGS. 4 to 6 (a) to (c).

FIG. 4 is a front view showing a conventional semiconductor device of this type, and FIG.
The figure is a sectional view taken along the line V-V in Figure 4, and Figures 6(a) to 6(c) are views showing the electrode terminal portion of a conventional semiconductor device. ) is (a) Vl-VI in the figure
A cross-sectional view taken along a line ``---'' in the figure (a). In these figures, I is an insulated circuit board on which a semiconductor chip (not shown) is mounted, a given electric circuit is formed on this insulated circuit board 1 by a wiring pattern, and a given electric circuit is formed on the board 2 by a wiring pattern. They are joined by solder or brazing metal. At this time, the electric circuit is electrically insulated from the substrate 2 by the insulated circuit board 1.

Reference numeral 3 denotes a case that surrounds the insulated circuit board 1 and supports electrode terminals, which will be described later. This case 3 is integrally formed of epoxy resin or the like, and has a frame portion that is adhered to the side edge of the board 2 over its entire circumference. 3a, and an electrode terminal support portion 3b integrally provided on the upper side of the frame portion 3a, and an opening portion 3c for injecting a resin molding material to be described later is formed on the upper side of the frame portion 3a. There is. Further, the electrode terminal support portion 3b is provided with a hole 3d into which an electrode terminal connection screw of an external device (not shown) is inserted.
A Nand 4 to which the electrode terminal connecting screw is tightened is inserted into the opening d. 5, 6.7 is an external device (
(not shown) is an electrode terminal connected to the electrode terminal 5,
6.7 has its base connected to the wiring pattern of the insulated circuit board l by solder, brazing material, etc., and the external connection parts 5a, 6a7a formed at the tips thereof are provided on the electrode terminal support part 3b of the case 3. It passes through the takeout hole 3e and projects out of the case 3. Further, the external connection parts 5a, 6a, 7a have electrode terminal connection screw insertion holes 5b,
6b, 7b are bored, and these insertion holes 5b, 6b,
7b is bent 90'' on the electrode terminal supporting part 3b so that it is placed on the nut 4. 8 is a chip coating material made of silicone gel, etc., and 9 is a resin molding material, and these are used to form a semiconductor chip. is sealed with resin.

Next, a procedure for assembling a conventional semiconductor device configured as described above will be explained. First, a semiconductor chip is bonded onto an insulated circuit board 1 on which a given electric circuit is formed, and a circuit is formed by connecting the electrodes of the semiconductor chip and the wiring pattern of the insulated circuit board 1 by wire bonding. Then, after connecting the electrode terminals 5, 6, 7 with solder, brazing material, etc. on the insulated circuit board l which is bonded to the substrate 2 with solder, brazing material, etc., the case 3 is bonded to the substrate 2. On this occasion,
The external connection portions 5a, 6a, 7a of each electrode terminal 5, 6.7 are as shown by the two-dot chain lines in FIGS. 6(b) and 6(c),
It passes through the takeout hole 3e of the case 3 and is projected out of the case 3. Next, the chip coating material 8 and the resin molding material 9 are sequentially injected into the case 3 from the opening 3c of the case 3, and the resin molding material 9 is heated and hardened. Thereafter, the external connection parts 5a, 6a+7a of the electrode terminals 5, 6.7 are bent at 90 degrees on the case 3, and the assembly of this semiconductor device is completed.

When connecting a conventional semiconductor device assembled in this way to a power source as a switching circuit component such as an inverter, connect the power supply side bus bar (not shown), which is the electrode terminal of the external device, to the electrode terminal connection screw. 4 and then screwed to the external connection parts 5a, 6a, and 7a.

[Problem to be solved by the invention]

However, in the conventional semiconductor device configured as described above, if the electrode terminal connection screws are tightened too strongly when screwing the power supply side bus bar to the electrode terminals 5, 6, 7, each electrode terminal 5, 6.7 external connection parts 5a, 6a, 7a
may be twisted and deformed, causing misalignment. For this reason, there was a problem in that screw tightening could not be performed reliably.

[Means to solve the problem]

In the semiconductor device according to the present invention, at the tip of the external connection electrode,
A fixing piece is provided that faces inside the outer case and is fixed with a sealing resin.

[For production]

By fixing the fixing piece with the sealing resin, the screwed portion of the external connection electrode is supported at two locations.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

FIG. 1 is a front view showing a semiconductor device according to the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, and FIGS. 3(a) to (c) are electrode terminals of the semiconductor device according to the present invention. The figure (a) is a front view, the figure (b) is a cross-sectional view taken along the line mm in the figure (a), and the figure (c) is a cross-sectional view taken along the line IV-IV in the figure (a). It is. In these figures, the same or equivalent members as those explained in FIGS. 4 to 6 are given the same reference numerals, and detailed explanations will be omitted here. In FIGS. 1 to 3, 1L12.13 indicates each electrode terminal 5, 6.
A fixing piece for fixing the tip of 7 to case 3,
The fixing pieces 11, 12.13 are integrally provided at the tips of the external connection parts 5a, 6a, 7a of each electrode terminal 5, 6.7, respectively, and are provided at the electrode terminal support part 3b of the case 3. The fixing piece 11. is bent 90'' on the inside, in other words, on the semiconductor chip side.
12. The width dimension of 13 is the external connection part 5a, 6a, ? The length is set to be smaller than that of the case 3, and its length is set such that when it is bent by the electrode terminal support portion 3b of the case 3, its tip faces into the opening 3c of the case 3.

In order to assemble a semiconductor device using the electrode terminals 5, 6.7 provided with the fixing pieces 11, 12, 13 in this way, first, the insulated circuit board is bonded to the substrate 2 in the same manner as before. Connect the electrode terminals 5, 6.7 on this group! Glue case 3 onto 2. At this time, the external connection portions 5a, 6a, 7a of each electrode terminal 5, 6.7 and the fixing pieces 11, 12, 13 are as shown by two-dot chain lines in FIGS. 3(b) and 3(c). Each electrode terminal 5,
6.7 external connection parts 5a, 6a, ? a by 90° with the electrode terminal support part 3b of the case 3, and then each fixing piece 11, 12, 13 is bent 90 degrees toward the inside of the case 3.
Process by bending. At this time, the tips of the fixing pieces 11, 12, and 13 are inserted into the opening 3c of the case 3. After the bending process of the electrode terminals 5, 6.7 is completed, the chip coating material 8 and the resin molding material 9 are sequentially injected into the case 3 from the opening 3c of the case 3.
The semiconductor device is assembled by heating and curing.

Therefore, the tip of each fixing piece 11, 12, 13 is buried in the resin molded material 9, and is thereby fixed to the case 3, so that the electrode terminal 5
．． 6.7, its external connection portion 5a+6a.

7a is supported at two locations: the base side and the distal end side.

〔Effect of the invention〕

As explained above, in the semiconductor device according to the present invention, the fixing piece facing inside the outer case and being fixed by the sealing resin is provided at the tip of the external connection electrode, so that the fixing piece is fixed by the sealing resin. As a result, the screw-fastened portion of the external connection electrode is supported at two locations. Therefore, when screwing the connected side electrode to the electrode terminal, the electrode terminal is less likely to be deformed, and the screw can be reliably tightened, so that the reliability of the connecting portion can be improved.

Further, in carrying out the present invention, it is sufficient to simply provide the fixing piece integrally with the electrode terminal, so there is also the effect that the present invention can be carried out at low cost.

[Brief explanation of drawings]

FIG. 1 is a front view showing a semiconductor device according to the present invention, FIG. 2 is a sectional view taken along line nn in FIG. 1, and FIGS. 3(a) to (c) are electrode terminals of the semiconductor device according to the present invention. The figure (a) is a front view, the figure (b) is a cross-sectional view taken along line mm in figure (a), and the figure (c) is a cross-sectional view taken along line ■-IV in figure (a). , FIG. 4 is a front view showing a conventional semiconductor device, and FIG. 5 is a front view of a conventional semiconductor device.
6(a) to 6(c) are diagrams showing the electrode terminal portion of a conventional semiconductor device, and FIG. 6(a) is a front view, and FIG. 6(b) is a front view of FIG. A sectional view taken along the line VI-Vl, and FIG. 1... Insulated circuit board, 2... Board, 3...
Case, 4...Nut, 5, 6.7...Electrode terminal, 8...Chip coating material, 9...Resin molding material, 11゜12, 13...Fixing piece .

Claims (1)

[Claims] A semiconductor chip mounted on a substrate is sealed in an outer case with a sealing resin, and an external connection electrode is connected to the semiconductor chip within the outer case and connected to a connected electrode by tightening a screw. A semiconductor device disposed on the surface of the outer case, characterized in that a fixing piece facing inside the outer case and fixed by a sealing resin is provided at the tip of the external connection electrode. Device.