JPH0336133U - - Google Patents
Info
- Publication number
- JPH0336133U JPH0336133U JP1989097853U JP9785389U JPH0336133U JP H0336133 U JPH0336133 U JP H0336133U JP 1989097853 U JP1989097853 U JP 1989097853U JP 9785389 U JP9785389 U JP 9785389U JP H0336133 U JPH0336133 U JP H0336133U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- bonding
- wire
- external lead
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48455—Details of wedge bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図ａは本考案のキヤピラリーの一実施例の
縦断面図、第１図ｂは一実施例の圧着面の形状を
示す図、第１図ｃは一実施例の外部リード側ワイ
ヤーボンデイング形状を示す図、第２図ａ，ｂ，
ｃは従来のキヤピラリーを説明するための図、第
３図ａ，ｂ，ｃは本考案の他の実施例を説明する
ための図である。 １……キヤピラリー本体、２……内側の圧着部
、３……外側の圧着部、４……圧着部（従来のも
の）、５……外側のキヤピラリー。
縦断面図、第１図ｂは一実施例の圧着面の形状を
示す図、第１図ｃは一実施例の外部リード側ワイ
ヤーボンデイング形状を示す図、第２図ａ，ｂ，
ｃは従来のキヤピラリーを説明するための図、第
３図ａ，ｂ，ｃは本考案の他の実施例を説明する
ための図である。 １……キヤピラリー本体、２……内側の圧着部
、３……外側の圧着部、４……圧着部（従来のも
の）、５……外側のキヤピラリー。
Claims (1)
- 半導体ペレツトと、外部リードとをワイヤーに
より接続するためのボンデイングに用いるキヤピ
ラリーにおいて、先端の圧着部を二重の円筒形と
することを特徴とするワイヤーボンデイング用キ
ヤピラリー。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989097853U JPH0336133U (ja) | 1989-08-21 | 1989-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989097853U JPH0336133U (ja) | 1989-08-21 | 1989-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336133U true JPH0336133U (ja) | 1991-04-09 |
Family
ID=31646980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989097853U Pending JPH0336133U (ja) | 1989-08-21 | 1989-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336133U (ja) |
-
1989
- 1989-08-21 JP JP1989097853U patent/JPH0336133U/ja active Pending