JPS62124850U - - Google Patents

Info

Publication number
JPS62124850U
JPS62124850U JP1986013423U JP1342386U JPS62124850U JP S62124850 U JPS62124850 U JP S62124850U JP 1986013423 U JP1986013423 U JP 1986013423U JP 1342386 U JP1342386 U JP 1342386U JP S62124850 U JPS62124850 U JP S62124850U
Authority
JP
Japan
Prior art keywords
electric torch
thin metal
spark
tip
generates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986013423U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986013423U priority Critical patent/JPS62124850U/ja
Publication of JPS62124850U publication Critical patent/JPS62124850U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の第１実施例を示す要部斜視
図、第２図は同じく第２実施例を示す要部斜視図
、第３図は同じく第３実施例を示す要部断面図、
第４図ａ〜ｃは同じく第４実施例を示す要部断面
図、第５図は従来の電気トーチの要部斜視図、第
６図は第５図の電気トーチを用いて金ボールを形
成する場合の動作説明図である。 図中、１１は電気トーチ、１３は金線（金属細
線）、１４，１５，２１，２２，２３は凸部であ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属細線の先端との間でスパークを発生させる
    部位に凸部を設けたことを特徴とするワイヤボン
    デイング用電気トーチ。
JP1986013423U 1986-01-30 1986-01-30 Pending JPS62124850U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986013423U JPS62124850U (ja) 1986-01-30 1986-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986013423U JPS62124850U (ja) 1986-01-30 1986-01-30

Publications (1)

Publication Number Publication Date
JPS62124850U true JPS62124850U (ja) 1987-08-08

Family

ID=30802470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986013423U Pending JPS62124850U (ja) 1986-01-30 1986-01-30

Country Status (1)

Country Link
JP (1) JPS62124850U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759446B2 (ja) * 1974-09-20 1982-12-15 Hiroshi Teramachi
JPS58103145A (ja) * 1981-12-16 1983-06-20 Hitachi Ltd ボンデイング用ワイヤのボ−ル形成方法
JPS6059532B2 (ja) * 1978-09-27 1985-12-25 株式会社日立製作所 分光光度計
JPS61194736A (ja) * 1985-02-25 1986-08-29 Hitachi Ltd ボンデイング装置及びそれに用いる放熱用電極

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5759446B2 (ja) * 1974-09-20 1982-12-15 Hiroshi Teramachi
JPS6059532B2 (ja) * 1978-09-27 1985-12-25 株式会社日立製作所 分光光度計
JPS58103145A (ja) * 1981-12-16 1983-06-20 Hitachi Ltd ボンデイング用ワイヤのボ−ル形成方法
JPS61194736A (ja) * 1985-02-25 1986-08-29 Hitachi Ltd ボンデイング装置及びそれに用いる放熱用電極

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