JPH0334911Y2 - - Google Patents
Info
- Publication number
- JPH0334911Y2 JPH0334911Y2 JP2271984U JP2271984U JPH0334911Y2 JP H0334911 Y2 JPH0334911 Y2 JP H0334911Y2 JP 2271984 U JP2271984 U JP 2271984U JP 2271984 U JP2271984 U JP 2271984U JP H0334911 Y2 JPH0334911 Y2 JP H0334911Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- conductor pattern
- chip
- signal conductor
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 56
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- 230000000694 effects Effects 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271984U JPS60136145U (ja) | 1984-02-20 | 1984-02-20 | Ｉｃチツプ用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2271984U JPS60136145U (ja) | 1984-02-20 | 1984-02-20 | Ｉｃチツプ用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60136145U JPS60136145U (ja) | 1985-09-10 |
| JPH0334911Y2 true JPH0334911Y2 (US06650917-20031118-M00005.png) | 1991-07-24 |
Family
ID=30515276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2271984U Granted JPS60136145U (ja) | 1984-02-20 | 1984-02-20 | Ｉｃチツプ用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136145U (US06650917-20031118-M00005.png) |
-
1984
- 1984-02-20 JP JP2271984U patent/JPS60136145U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60136145U (ja) | 1985-09-10 |
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