JPH0334258U - - Google Patents
Info
- Publication number
- JPH0334258U JPH0334258U JP1989094568U JP9456889U JPH0334258U JP H0334258 U JPH0334258 U JP H0334258U JP 1989094568 U JP1989094568 U JP 1989094568U JP 9456889 U JP9456889 U JP 9456889U JP H0334258 U JPH0334258 U JP H0334258U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead wire
- emitting diode
- reflective wall
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989094568U JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989094568U JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0334258U true JPH0334258U (US06262066-20010717-C00315.png) | 1991-04-04 |
| JPH0741170Y2 JPH0741170Y2 (ja) | 1995-09-20 |
Family
ID=31643889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989094568U Expired - Lifetime JPH0741170Y2 (ja) | 1989-08-11 | 1989-08-11 | 発光ダイオードランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741170Y2 (US06262066-20010717-C00315.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103388U (US06262066-20010717-C00315.png) * | 1972-12-27 | 1974-09-05 | ||
| JPS5571569U (US06262066-20010717-C00315.png) * | 1978-11-07 | 1980-05-16 | ||
| JPS5621471U (US06262066-20010717-C00315.png) * | 1979-07-24 | 1981-02-25 | ||
| JPS5839063U (ja) * | 1981-09-08 | 1983-03-14 | 三洋電機株式会社 | 全色発光半導体装置 |
| JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
| JPS6151763U (US06262066-20010717-C00315.png) * | 1984-09-10 | 1986-04-07 | ||
| JPS61179003A (ja) * | 1985-02-04 | 1986-08-11 | スタンレー電気株式会社 | 車両用灯具の光源 |
| JPS624380A (ja) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | 発光ダイオ−ド装置 |
| JPH0192684U (US06262066-20010717-C00315.png) * | 1987-12-10 | 1989-06-16 | ||
| JPH01157577A (ja) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | 半導体発光装置 |
-
1989
- 1989-08-11 JP JP1989094568U patent/JPH0741170Y2/ja not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49103388U (US06262066-20010717-C00315.png) * | 1972-12-27 | 1974-09-05 | ||
| JPS5571569U (US06262066-20010717-C00315.png) * | 1978-11-07 | 1980-05-16 | ||
| JPS5621471U (US06262066-20010717-C00315.png) * | 1979-07-24 | 1981-02-25 | ||
| JPS5839063U (ja) * | 1981-09-08 | 1983-03-14 | 三洋電機株式会社 | 全色発光半導体装置 |
| JPS60102775A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 発光表示装置 |
| JPS6151763U (US06262066-20010717-C00315.png) * | 1984-09-10 | 1986-04-07 | ||
| JPS61179003A (ja) * | 1985-02-04 | 1986-08-11 | スタンレー電気株式会社 | 車両用灯具の光源 |
| JPS624380A (ja) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | 発光ダイオ−ド装置 |
| JPH0192684U (US06262066-20010717-C00315.png) * | 1987-12-10 | 1989-06-16 | ||
| JPH01157577A (ja) * | 1987-12-14 | 1989-06-20 | Mini Pairo Denki:Kk | 半導体発光装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741170Y2 (ja) | 1995-09-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |