JPH0334079Y2 - - Google Patents
Info
- Publication number
- JPH0334079Y2 JPH0334079Y2 JP1984069720U JP6972084U JPH0334079Y2 JP H0334079 Y2 JPH0334079 Y2 JP H0334079Y2 JP 1984069720 U JP1984069720 U JP 1984069720U JP 6972084 U JP6972084 U JP 6972084U JP H0334079 Y2 JPH0334079 Y2 JP H0334079Y2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- frame
- holding
- substrate
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 46
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 22
- 239000010970 precious metal Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Resistance Heating (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案はガス検知装置又は湿度センサー等に使
用される半導体センサーの加熱用発熱体等の発熱
体基板を保持するためのフレームの構造に関す
る。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to the structure of a frame for holding a heating element substrate such as a heating element for heating a semiconductor sensor used in a gas detection device or a humidity sensor.
（従来の技術）
従来、この種の発熱体基板としては発熱体層を添
着した耐熱性絶縁基板が使用されるが、その発熱
体基板の保持構造としては第４図及び第５図に示
されるようなものが知られている。(Prior Art) Conventionally, a heat-resistant insulating substrate to which a heat generating layer is attached is used as a heat generating body substrate of this type, and the holding structure for the heat generating body substrate is shown in FIGS. 4 and 5. Something like this is known.
すなわち、第４図に示されるものは発熱体基板
ａがステムｂに装着されたリードピンｃにリード
線ｄを用いて懸垂保持される構造であり、リード
線ｄとしては径100μm程度の貴金属線が使用され
るが、この貴金属線自体の機械的強度が小さいた
め、装置に落下、振動等の衝撃が加わつた場合断
線し易く、又、発熱体基板自体熱伝導が悪いため
局所的に高温部が発生し、発熱体基板全体を均一
な温度分布に加熱することは困難である。 That is, in the structure shown in FIG. 4, a heating element board a is suspended and held by a lead pin c attached to a stem b using a lead wire d, and the lead wire d is a noble metal wire with a diameter of about 100 μm. However, because the mechanical strength of this precious metal wire itself is low, it is easily broken if the device is subjected to shocks such as drops or vibrations, and the heating element board itself has poor thermal conductivity, so it may cause local high-temperature parts. It is difficult to heat the entire heating element substrate to a uniform temperature distribution.
又、第５図ａに示されるものは実開昭55−
119962号明細書に開示されるもので、ステムｂに
装着されたリードピンｃに複数のフレームe1，e2
を固着し、中央のフレームe1に発熱体基板ａを保
持し、該基板の端子（図示せず）とフレームe1，
e2をリード線ｄで接続する構造である。フレーム
e1，e2の構造は第５図ｂに平面図で示したよう
に、中央のフレームe1は発熱体基板ａに比し細巾
で、一様な巾を有し、そのほぼ中間部に発熱体基
板ａの係止保持部e3を設けて構成され、又、フレ
ームe1，e2には導電性を付与するため全面に貴金
属メツキが施こされている。 Also, the one shown in Figure 5a is from the U.S.
119962, a plurality of frames e 1 , e 2 are connected to a lead pin c attached to a stem b.
The heating element board a is held in the central frame e1 , and the terminals (not shown) of the board and the frame e1 ,
This structure connects e 2 with lead wire d. flame
As shown in the plan view in Fig. 5b, the structure of e 1 and e 2 is that the central frame e 1 is narrower and has a uniform width than the heating element substrate a, and the approximately middle part thereof is narrower than the heating element substrate a. The frame e 1 and e 2 are provided with a locking and holding portion e 3 for the heating element substrate a, and the entire surfaces of the frames e 1 and e 2 are plated with precious metal to provide conductivity.
しかし、発熱体基板ａのフレームとして上記のフ
レームを使用した場合には、フレームe1，e3の巾
が発熱体基板ａの縦横の巾よりかなり細巾である
ため発熱体基板ａをフレームe1とe3の交差部に乗
せた場合、発熱体基板ａにフレームe1，e3と接触
しない部分が生じ、又、フレーム全面に貴金属メ
ツキが施こされているため、フレーム自体に低熱
伝導性の金属を用いたとしてもフレームe1，e3は
熱伝導性が良好となり、従つて発熱体基板ａ内の
温度分布は均一とならず、さらにフレームを介し
ての熱伝導による熱損失も大きいという欠点があ
る。However, when the above frame is used as a frame for heat generating board a, the widths of frames e 1 and e 3 are much narrower than the vertical and horizontal widths of heat generating board a, so heat generating board a is used as frame e. When placed at the intersection of 1 and e 3 , there will be a part of the heating element board a that does not come into contact with the frames e 1 and e 3 , and since the entire frame is plated with precious metal, the frame itself will have low thermal conductivity. The frames e 1 and e 3 have good thermal conductivity even if they are made of high-temperature metals, and therefore the temperature distribution within the heating element substrate a is not uniform, and furthermore, heat loss due to heat conduction through the frames is low. It has the disadvantage of being large.
（考案が解決しようとする問題点）
本考案は、従来の発熱体基板保持構造の上記の欠
点に着目してなされたもので、発熱体基板からの
熱損失が少なく、しかも発熱体基板内における温
度分布が均一で、半導体センサー等を均一かつ熱
効率よく加熱し得る発熱体基板の保持フレームを
提供することを目的とする。(Problems to be Solved by the Invention) The present invention was developed by focusing on the above-mentioned drawbacks of the conventional heating element substrate holding structure. It is an object of the present invention to provide a holding frame for a heating element substrate that has a uniform temperature distribution and can heat a semiconductor sensor etc. uniformly and thermally efficiently.
（問題点を解決するための手段）
以下に本考案を実施例を示す図面に基づいて説明
する。(Means for Solving the Problems) The present invention will be described below based on drawings showing embodiments.
第１図に本考案に係る発熱体基板保持フレームの
平面図を示し、第２図に第１図に示すフレームを
用いて発熱体基板を加締め固定した状態を平面図
で示した。FIG. 1 shows a plan view of a heating element substrate holding frame according to the present invention, and FIG. 2 shows a plan view of a state in which the heating element substrate is crimped and fixed using the frame shown in FIG. 1.
図において本考案の発熱体基板保持フレームは発
熱体基板５の平面とほぼ同一の面積及び形状を有
する基板保持部１と、該基板保持部１の対向する
側縁に連設されるリード線接続部２と、該リード
線接続部２に細径の腕部３を介して連結されるフ
レーム固着部４とから構成され、金属好ましくは
低熱伝導性の金属で一体成型されるものである。In the figure, the heating element substrate holding frame of the present invention includes a substrate holding part 1 having almost the same area and shape as the plane of the heating element board 5, and a lead wire connection connected to the opposite side edges of the substrate holding part 1. 2 and a frame fixing part 4 connected to the lead wire connecting part 2 via a small-diameter arm part 3, and is integrally molded of a metal, preferably a metal with low thermal conductivity.
しかして、基板保持部１は発熱体基板５を保持す
る部分で、発熱体基板５の平面とほぼ同一の面積
及び形状を有し、両側縁に必要に応じ発熱体基板
５の加締め保持部１′が形成される。発熱体基板
５の加締め保持部１′で加締めて保持してもよい
が、接着等の手段で基板保持部１に固定してもよ
い。Thus, the substrate holding part 1 is a part that holds the heating element substrate 5, and has almost the same area and shape as the plane of the heating element substrate 5, and has a crimping holding part for the heating element substrate 5 on both side edges as necessary. 1' is formed. It may be held by caulking with the caulking holding part 1' of the heating element substrate 5, but it may also be fixed to the substrate holding part 1 by adhesive or other means.
リード線接続部２は発熱体基板１の発熱体層を加
熱するためのリード線（図示せず）が接続される
部分で、これが連設される基板保持部１の巾に比
し細巾に形成され、又、その表面には貴金属メツ
キが施こされる。The lead wire connecting portion 2 is a portion to which a lead wire (not shown) for heating the heat generating layer of the heat generating substrate 1 is connected, and is narrower than the width of the substrate holding portion 1 to which it is connected. The surface is plated with precious metal.
次にフレーム固着部４は、これを図示しないステ
ムのリードピン等に固着して発熱体基板５を基板
保持部１等と共に保持するための部分で、本考案
のフレームにおいては上記のリード線接続部２と
フレーム固着部４とを連結する腕部３はリード線
保持部２の巾より更に細巾に形成される。Next, the frame fixing part 4 is a part for holding the heating element board 5 together with the board holding part 1 etc. by fixing it to a lead pin of a stem (not shown), etc. In the frame of the present invention, the above lead wire connection part is used. The arm portion 3 connecting the lead wire holding portion 2 and the frame fixing portion 4 is formed to be narrower than the width of the lead wire holding portion 2.
（作用）
次に本考案のフレームの作用について説明する
と、基板保持部１上に保持された発熱体基板５は
リード線接続部２に接続されたリード線（図示せ
ず）を介して通電され加熱されるが、この場合、
基板保持部１は発熱体基板５の平面とほぼ同一の
面積、形状において直接接触しているため、発熱
体基板５からの熱伝導は非常に良好であり、基板
保持部１はいわゆる熱伝導板として作用すること
により、これに接触する発熱体基板５内の温度ム
ラが著しく改善される。(Function) Next, the function of the frame of the present invention will be explained. The heating element board 5 held on the board holder 1 is energized via a lead wire (not shown) connected to the lead wire connection part 2. is heated, but in this case,
Since the substrate holding part 1 is in direct contact with the plane of the heating element substrate 5 in almost the same area and shape, heat conduction from the heating element substrate 5 is very good, and the substrate holding part 1 is a so-called heat conductive plate. By acting as such, the temperature unevenness within the heating element substrate 5 that comes into contact with the heating element substrate 5 is significantly improved.
又、発熱体基板５から基板保持部１に伝導した
熱はリード線接続部２、腕部３、フレーム固着部
４の順に伝導して行くことになるが、リード線接
続部２から腕部３への熱伝導速度は腕部３の巾が
細く形成されているため極めて遅くなり、その結
果、腕部３においてフレーム固着部４に対する実
質的な断熱作用が行なわれる。又、貴金属メツキ
はリード線接続部２にのみ施こされているから、
従来の全面貴金属メツキしたフレームに比し熱伝
導及び熱損失が少ない。 Furthermore, the heat conducted from the heating element board 5 to the board holding part 1 is conducted in the order of the lead wire connection part 2, the arm part 3, and the frame fixing part 4. Since the width of the arm portion 3 is narrow, the rate of heat conduction to the frame fixing portion 4 is extremely slow, and as a result, the arm portion 3 has a substantial heat insulating effect on the frame fixing portion 4. Also, since precious metal plating is applied only to the lead wire connection part 2,
There is less heat conduction and heat loss compared to conventional frames that are entirely plated with precious metals.
第６図ａに本考案のフレーム（基板保持部の
巾：リード線接続部の巾＝１：1/6）を使用し、
第６図ｂに第５図に示される従来のフレームを使
用した場合について、同一の発熱体基板を固定
し、同一電力を印加して加熱させた発熱体基板の
温度分布を測定した結果を示した。この結果によ
れば従来のフレームを使用した場合には温度分布
は十字形となり、又、上昇温度も相対的に低く、
明らかにフレームからの熱の伝導損失が認められ
る。これに対し、本考案のフレームを使用した発
熱体基板においては第６図ａから明らかなように
温度分布が均一であり、上昇温度も高く保持され
る。この理由は、本考案のフレームにあつては前
述したように基板保持部１における均一な熱伝導
作用と相俟つて腕部３における実質的な断熱作用
に基づくものと推察される。 Using the frame of the present invention (width of the board holding part: width of the lead wire connection part = 1:1/6) in Fig. 6a,
Figure 6b shows the results of measuring the temperature distribution of the same heating element board fixed and heated by applying the same power when using the conventional frame shown in Figure 5. Ta. The results show that when a conventional frame is used, the temperature distribution becomes cross-shaped, and the temperature rise is also relatively low.
There is clearly heat conduction loss from the frame. On the other hand, in the heat generating substrate using the frame of the present invention, the temperature distribution is uniform, as is clear from FIG. 6a, and the temperature rise is also maintained at a high level. The reason for this is presumed to be that in the frame of the present invention, as described above, the uniform heat conduction effect in the substrate holding part 1 and the substantial heat insulation effect in the arm part 3 are combined.
（他の実施例）
第３図は本考案のフレームの他の実施例であ
り、ａはその平面図、ｂはその側面図を示す。(Other Embodiments) FIG. 3 shows another embodiment of the frame of the present invention, in which a shows a plan view thereof and b shows a side view thereof.
第３図に示す実施例のフレームは、平面形状は
第１図の実施例と同様であるが、腕部３の厚みを
その他のフレーム部分よりも薄く形成したもので
ある。従ってこの実施例のフレームでは腕部３の
断面積が更に減少されることになり実質的な断熱
効果が一層向上される。 The frame of the embodiment shown in FIG. 3 has the same planar shape as the embodiment of FIG. 1, but the arm portion 3 is formed thinner than the other frame parts. Therefore, in the frame of this embodiment, the cross-sectional area of the arm portion 3 is further reduced, and the substantial heat insulation effect is further improved.
（考案の効果）
以上説明したように本考案によれば、以下の効
果を奏する。(Effects of the invention) As explained above, the invention provides the following effects.
基板保持部を発熱体基板平面の面積、形状に
ほぼ合わせたから、発熱体基板内の温度の伝導
が良くなり、温度分布が均一に保持できる。 Since the substrate holding portion is approximately matched to the area and shape of the plane of the heating element substrate, the temperature conduction within the heating element substrate is improved and the temperature distribution can be maintained uniformly.
保持フレーム全体を低熱伝導性の金属で一体
成形していること、及び、基板保持部とフレー
ム固着部間をつなぐ腕部は細径であることか
ら、基板保持部の伝導による熱損失が最小限に
抑えられる。そのため、発熱体基板の加熱に際
しての熱効率が大幅に改善される。 The entire holding frame is integrally molded from metal with low thermal conductivity, and the arms that connect the board holding part and the frame fixing part have a small diameter, so heat loss due to conduction in the board holding part is minimized. can be suppressed to Therefore, the thermal efficiency in heating the heat generating substrate is greatly improved.
基板保持部に連設されたリード線接続部を貴
金属でメツキしたので、リード線の接続が容易
になる。 Since the lead wire connection portion connected to the substrate holding portion is plated with precious metal, connection of the lead wire is facilitated.
基板保持部と発熱体基板との接触面積が大き
いので、両者間の固定力が向上し、振動を受け
た場合等の発熱体基板のガタツキが少なくな
る。したがつて、リード線と発熱体基板との接
続も安定する。また、リード線と発熱体基板と
の接続時の作業性が向上する。 Since the contact area between the substrate holder and the heating element substrate is large, the fixing force between the two is improved, and wobbling of the heating element substrate when subjected to vibrations is reduced. Therefore, the connection between the lead wire and the heating element board is also stable. Further, workability when connecting the lead wire and the heating element board is improved.
以上の各効果によつて、ガス検知装置または湿
度センサー等に使用される金属酸化物等からなる
半導体センサーの加熱用発熱体基板の保持フレー
ムとして、極めて好ましい特性を有するものであ
る。 Due to the above-mentioned effects, it has extremely preferable characteristics as a holding frame for a heating element substrate of a semiconductor sensor made of metal oxide or the like used in a gas detection device or a humidity sensor.
第１図は本考案の保持フレームの平面図、第２
図は本考案の保持フレームに発熱体基板を固定装
着した状態を示す平面図、第３図ａは本考案の保
持フレームの他の実施例を示す平面図、第３図ｂ
は第３図ａの側面図、第４図及び第５図ａは従来
の発熱体基板の保持構造を示す斜視図、第５図ｂ
は第５図ａの保持構造に使用されるフレームの平
面図、第６図ａは本考案の保持フレームを使用し
た場合の発熱体基板の熱分布曲線、第６図ｂは従
来の保持フレームを使用した場合の同基板の熱分
布曲線を示す。
１……基板保持部、２……リード線接続部、３
……腕部、４……フレーム固着部、５……発熱体
基板。
Figure 1 is a plan view of the holding frame of the present invention;
The figure is a plan view showing the heating element board fixedly attached to the holding frame of the present invention, Fig. 3a is a plan view showing another embodiment of the holding frame of the present invention, and Fig. 3b
is a side view of FIG. 3a, FIGS. 4 and 5a are perspective views showing a conventional holding structure for a heating element board, and FIG. 5b is a side view of FIG.
is a plan view of the frame used in the holding structure of Fig. 5a, Fig. 6a is a heat distribution curve of the heating element substrate when the holding frame of the present invention is used, and Fig. 6b is a plan view of the frame used in the holding structure of the conventional holding frame. The heat distribution curve of the same board when used is shown. 1... Board holding part, 2... Lead wire connection part, 3
...Arm part, 4...Frame fixing part, 5...Heating element board.
Claims (1)
れる発熱体基板の保持フレームにおいて、 発熱体基板の平面とほぼ同一の面積及び形状を
有する基板保持部と、該基板保持部の側縁に連設
され、局部的に貴金属メツキされたリード線接続
部と、ステムのリードピンに固着されるフレーム
固着部と、前記リード線接続部とフレーム固着部
間を接続する細径の腕部とからなり、全体が低熱
伝導性の金属で一体成形されたことを特徴とする
発熱体基板の保持フレーム。[Scope of Claim for Utility Model Registration] In a holding frame for a heating element substrate connected to a plurality of lead pins provided on a stem, a substrate holding part having an area and shape that is almost the same as the plane of the heating element substrate, and a substrate holding part that is connected to a plurality of lead pins provided on a stem. A lead wire connection part that is connected to the side edge of the stem and is locally plated with a precious metal, a frame fixation part that is fixed to the lead pin of the stem, and a small diameter part that connects the lead wire connection part and the frame fixation part. A holding frame for a heating element board, comprising an arm part, and the entire body is integrally molded from a metal with low thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6972084U JPS60181884U (en) | 1984-05-15 | 1984-05-15 | Holding frame for heating element board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6972084U JPS60181884U (en) | 1984-05-15 | 1984-05-15 | Holding frame for heating element board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60181884U JPS60181884U (en) | 1985-12-03 |
| JPH0334079Y2 true JPH0334079Y2 (en) | 1991-07-18 |
Family
ID=30605661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6972084U Granted JPS60181884U (en) | 1984-05-15 | 1984-05-15 | Holding frame for heating element board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60181884U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632267B2 (en) * | 1985-02-20 | 1994-04-27 | リコ−精器株式会社 | Electric heater |
| JPH0799361B2 (en) * | 1986-12-23 | 1995-10-25 | フイガロ技研株式会社 | Gas sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120526Y2 (en) * | 1979-02-20 | 1986-06-20 |
-
1984
- 1984-05-15 JP JP6972084U patent/JPS60181884U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60181884U (en) | 1985-12-03 |
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