JPS6324440Y2 - - Google Patents
Info
- Publication number
- JPS6324440Y2 JPS6324440Y2 JP1978104963U JP10496378U JPS6324440Y2 JP S6324440 Y2 JPS6324440 Y2 JP S6324440Y2 JP 1978104963 U JP1978104963 U JP 1978104963U JP 10496378 U JP10496378 U JP 10496378U JP S6324440 Y2 JPS6324440 Y2 JP S6324440Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- frames
- insulating substrate
- resistant insulating
- gas detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 238000001514 detection method Methods 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Description
【考案の詳細な説明】
本考案は、ガス検知装置、特に耐熱性絶縁基板
で構成したガス検知素子の各電極とステムのリー
ドピンとの改良された結合構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a gas detection device, and particularly to an improved coupling structure between each electrode of a gas detection element constructed of a heat-resistant insulating substrate and a lead pin of a stem.
一般にこの種の装置は第１図および第２図に示
すように、耐熱性絶縁基板２の一面にガス検知層
３および該検知層３に通電するためのガス検知層
用電極４、その他面にガス検知層３を加熱するた
めの加熱体層５および該加熱体層５に通電するた
めの加熱体層用電極６を各々形成して素子基板１
を構成し、該基板１のガス検知層用電極４および
スルーホール７を中介した加熱体層用電極６の
各々にリード線８を接続し、該リード線８をステ
ム９のリードピン１０に直接接続するようにして
いる。ところで上記装置においては、リード線８
により素子基板１の電極４，６とリードピン１０
とを電気的に接続するとゝもに、上明基板１を中
空に保持するようにしているため、該基板１の重
みや印加振動などによりリード線８の断線が発生
し易い。反面上記基板１の重みや印加振動などに
十分耐え得るようにリード線８を太くすることが
考えられるが、リード線８を太くすると熱伝導が
良くなつて、リードピン１０への放熱が大きくな
り、上記基板１の加熱体層５の容量を大きくしな
ければそのガス検知層３を所定の温度に維持する
ことができないという問題があり、またリード線
８を熱容量の大きいリードピン１０に直接接続し
ているため、その作業に多大の時間と手間を要
し、組立作業が能率的でないという問題がある。 Generally, this type of device has a gas detection layer 3 on one surface of a heat-resistant insulating substrate 2, an electrode 4 for the gas detection layer for supplying electricity to the detection layer 3, and a gas detection layer electrode 4 on the other surface, as shown in FIGS. 1 and 2. A heating layer 5 for heating the gas detection layer 3 and a heating layer electrode 6 for supplying current to the heating layer 5 are formed to form the element substrate 1.
A lead wire 8 is connected to each of the electrode 4 for the gas detection layer of the substrate 1 and the electrode 6 for the heating body layer via the through hole 7, and the lead wire 8 is directly connected to the lead pin 10 of the stem 9. I try to do that. By the way, in the above device, the lead wire 8
Therefore, the electrodes 4 and 6 of the element substrate 1 and the lead pin 10
Since the upper substrate 1 is held in the air while electrically connecting the two, the lead wires 8 are likely to break due to the weight of the substrate 1, applied vibrations, etc. On the other hand, it is conceivable to make the lead wires 8 thicker so that they can sufficiently withstand the weight of the substrate 1 and applied vibrations, etc.; however, making the lead wires 8 thicker improves heat conduction and increases heat radiation to the lead pins 10. There is a problem in that the gas detection layer 3 cannot be maintained at a predetermined temperature unless the capacity of the heating layer 5 of the substrate 1 is increased, and the lead wire 8 is connected directly to the lead pin 10 having a large heat capacity. Therefore, there is a problem that the work requires a lot of time and effort, and the assembly work is inefficient.
本考案は上記問題を解決するために、リードピ
ンに固着する端子用フレームを低熱伝導性の金属
薄板で構成し、該フレームの少なくとも１つに基
板保持部を伸長形成し、上記基板を該保持部に保
持するとともに、上記基板の各電極と上記両フレ
ームとをリード線で接続し、上記リードピンに上
記両フレームを固着することにより、基板の保持
と電気接続とを分離して上記基板を強固にかつ確
実に結合するとゝもに、その組立工程を簡略化し
てその作業能率を向上するようにしたガス検知装
置を提供することを目的とするものである。 In order to solve the above-mentioned problems, the present invention comprises a terminal frame fixed to a lead pin made of a thin metal plate with low thermal conductivity, a substrate holding section extending from at least one of the frames, and a substrate holding section extending from at least one of the frames. At the same time, by connecting each electrode of the board and both frames with lead wires and fixing both frames to the lead pins, holding the board and electrical connection are separated and the board is strengthened. It is an object of the present invention to provide a gas detection device which can be connected reliably and which simplifies the assembly process and improves work efficiency.
以下添附図面に基づいて本考案の一実施例を詳
述する。 An embodiment of the present invention will be described in detail below based on the accompanying drawings.
第３図乃至第５図において、１はガス検知素子
基板を示し、耐熱性絶縁基板２の一面にはZnO，
SnO2，Fe2O3などの金属酸化物半導体からなる
ガス検知層３、および該検知層３に通電するため
のガス検知層電極４、その他面にはガス検知層３
を加熱するための抵抗体層５、および該抵抗体層
５に通電するための抵抗体層用電極６が各形成さ
れている。 3 to 5, reference numeral 1 indicates a gas detection element substrate, and one surface of a heat-resistant insulating substrate 2 includes ZnO,
A gas detection layer 3 made of a metal oxide semiconductor such as SnO 2 or Fe 2 O 3 , a gas detection layer electrode 4 for supplying electricity to the detection layer 3, and a gas detection layer 3 on other surfaces.
A resistor layer 5 for heating the resistor layer 5 and a resistor layer electrode 6 for supplying current to the resistor layer 5 are formed.
またガス検知層用電極４が形成されていない基
板２の一面には、上記抵抗体層電極６と導通状態
にある補助電極１１がガス検知層用電極４と対向
して形成されている。 Further, on one surface of the substrate 2 on which the gas detection layer electrode 4 is not formed, an auxiliary electrode 11 that is in electrical continuity with the resistor layer electrode 6 is formed facing the gas detection layer electrode 4.
また、ステム９のリードピン１０に固着するた
めの端子用フレーム１２は、たとえばコバール板
などの低熱伝導性の金属薄板をプレスなどで打抜
き加工して形成されている。また端子用フレーム
１２は複数個で一単位とされており、その端子用
フレームの一つはそのフレームの伸長方向上面の
一部を前記基板下面の一部が載置される支承面と
され、この支承面内の領域で上記フレームの伸長
方向に対して両側へほぼ直交方向に一体的に突出
する保持部を有するように形成されており、この
保持部を折曲して基板の両側を挟持して固着する
ようにされている。具体的には、第４図に示すよ
うに一単位のフレームの内一つにはその先端部に
折り曲げて上記基板１を保持するためのほゞＴ字
状の保持部１３が伸長形成されている。 Further, the terminal frame 12 for fixing to the lead pin 10 of the stem 9 is formed by punching a thin metal plate with low thermal conductivity, such as a Kovar plate, using a press or the like. Further, a plurality of terminal frames 12 are made into one unit, and one of the terminal frames has a part of the upper surface in the extension direction of the frame as a support surface on which a part of the lower surface of the board is placed, It is formed to have a holding part that integrally projects in a direction substantially orthogonal to both sides with respect to the extension direction of the frame in the region within this supporting surface, and this holding part is bent to hold both sides of the board. It is made to stick. Specifically, as shown in FIG. 4, one of the frames of one unit has a substantially T-shaped holding part 13 formed at its tip to hold the substrate 1 by bending it. There is.
また、たとえば金線などからなるリード線８
は、ガス検知層用電極４および抵抗体層５とを導
通状態にある補助電極１１と、端子用フレーム１
２とに各接続されている。 Further, a lead wire 8 made of, for example, a gold wire, etc.
The auxiliary electrode 11 is electrically connected to the gas detection layer electrode 4 and the resistor layer 5, and the terminal frame 1
2 are connected to each other.
尚、１４は素子基板１の組立完了後に切除され
る部分である。 Note that 14 is a portion that is removed after the assembly of the element substrate 1 is completed.
上記構成において、本案装置の組立を説明す
る。まず、端子用フレーム１２の少なくともひと
つの先端部に形成したほぼＴ字状の保持端部１３
の両端部を各々上方へ折曲げてガス検知素子基板
１の側部対象位置に按接して端子用フレーム１２
のＴ字状保持部全体で基板保持するとゝもに、上
記基板１のガス検知層用電極４および抵抗体層５
の補助電極１１と、端子用フレーム１２とをリー
ド線８で各接続し、ステム９のリードピン１０の
自由端頂面に端子用フレーム１２を固着し、そし
て切除部分１４を切除することにより上記基板１
の組立を完了することがができる。 In the above configuration, assembly of the present device will be explained. First, a substantially T-shaped holding end 13 formed at at least one tip of the terminal frame 12
Terminal frame 12 is formed by bending both ends of the terminal upward and attaching it to the target position on the side of gas detection element substrate 1.
The entire T-shaped holding part holds the substrate, and the electrode 4 for the gas detection layer and the resistor layer 5 of the substrate 1 are held together.
The auxiliary electrode 11 and the terminal frame 12 are connected with the lead wires 8, the terminal frame 12 is fixed to the top surface of the free end of the lead pin 10 of the stem 9, and the cutout part 14 is cut out. 1
The assembly can be completed.
しかして本考案は、低熱伝性の金属薄板で構成
される端子用フレーム１２の保持部１３にガス検
知素子基板１を結合して保持して平面形状に支承
するとともにとゝに、該基板１のガス検知層用電
極４および抵抗体層５の補助電極１１と、端子用
フレーム１２とをリード線８で各接続し、上記フ
レーム１２をステム９のリードピン１０に各固着
することにより、上記ガス検知素子基板１の保持
と電気接続とを分離して該基板１を確実にかつ強
固に保持することができるとともに、上記基板１
の重みや印加振動などによるリード線８の断線の
発生を防止することができる。従つて、線径の細
いリード線８の使用を可能とし、リードピン１０
への放熱を極小にすることができ、かつガス検知
層３を加熱するための抵抗体層５の小容量にして
ガス検知層３を所定の温度に維持することがで
き、消費電力の極めて少ないものとすることがで
きる。 Therefore, the present invention connects and holds the gas detection element substrate 1 to the holding portion 13 of the terminal frame 12 made of a thin metal plate with low thermal conductivity, and supports the substrate 1 in a planar shape. The gas detection layer electrode 4 and the auxiliary electrode 11 of the resistor layer 5 are connected to the terminal frame 12 by lead wires 8, and the frames 12 are fixed to the lead pins 10 of the stem 9, thereby detecting the gas. The holding of the sensing element substrate 1 and the electrical connection can be separated, and the substrate 1 can be held securely and firmly.
It is possible to prevent the lead wire 8 from being disconnected due to the weight of the lead wire, applied vibration, or the like. Therefore, it is possible to use the lead wire 8 with a small wire diameter, and the lead pin 10 can be used.
The heat dissipation to the gas detection layer 3 can be minimized, and the capacity of the resistor layer 5 for heating the gas detection layer 3 can be made small to maintain the gas detection layer 3 at a predetermined temperature, resulting in extremely low power consumption. can be taken as a thing.
また、ガス検知素子基板１の電極４，１１と端
子用フレーム１２とをリード線８で各接続し、上
記端子用フレーム１２をステム９のリードピン１
０に各固着することにより、電極４，１１と端子
用フレーム１２との接続および該端子用フレーム
１２とリードピン１０との固着の各組立作業を同
一平面においてすることができ、その作業に多大
の時間を要することなく、組立てることができ、
その作業能率を著しく向上することができる。 Further, the electrodes 4 and 11 of the gas detection element substrate 1 and the terminal frame 12 are connected with lead wires 8, and the terminal frame 12 is connected to the lead pin 1 of the stem 9.
By fixing the electrodes 4 and 11 to the terminal frame 12 and fixing the terminal frame 12 and the lead pin 10 on the same plane, the assembly work can be done on the same plane, and the work requires a lot of effort. Can be assembled in no time,
The work efficiency can be significantly improved.
以上詳述したように本考案は、耐熱性絶縁基板
で構成したガス検知素子基板の保持と電気接続と
を分離することにより、上記基板を中空状態で確
実強固に保持することができるとともに、線径の
細いリード線の使用を可能にしてリードピンへの
放熱を極小にすることができ、装置を耐久的にし
てその検知性能を安定向上することができ、また
組立工程を簡略化して未熟練者にも容易に組立て
ることができ、量産性に富んだ装置とすることが
できるなどの実用上秀れた効果がある。 As described in detail above, the present invention separates the holding and electrical connection of the gas sensing element substrate made of a heat-resistant insulated substrate, thereby making it possible to reliably and firmly hold the substrate in a hollow state, and to This makes it possible to use lead wires with a small diameter, minimizing heat radiation to the lead pins, making the device durable and stably improving its detection performance, and simplifying the assembly process, making it easier for unskilled workers. It has excellent practical effects, such as being easily assembled and making it possible to create a device with high mass productivity.
第１図Ａ，Ｂ，Ｃは従来のガス検知素子基板を
示す平面図、断面図、底面図、第２図は従来のガ
ス検知素子基板の取付状態を示す斜視図、第３図
は本考案のガス検知素子基板を示す平面図、断面
図、底面図、第４図は本考案に用いるフレームの
平面図、第５図は本考案のガス検知素子の取付状
態を示す斜視図である。
１……ガス検知素子基板、２……絶縁基板、３
……ガス栓知層、４……ガス検知層用電極、５…
…抵抗体層、６……抵抗体層用電極、８……リー
ド線、９……ステム、１０……リードピン、１２
……端子用フレーム、１３……基板保持部。
Figures 1A, B, and C are a plan view, cross-sectional view, and bottom view showing a conventional gas sensing element board; Figure 2 is a perspective view showing the mounting state of the conventional gas sensing element board; and Figure 3 is the present invention. FIG. 4 is a plan view of a frame used in the present invention, and FIG. 5 is a perspective view showing the mounting state of the gas detection element of the present invention. 1...Gas detection element substrate, 2...Insulating substrate, 3
...Gas detection layer, 4...Electrode for gas detection layer, 5...
... Resistor layer, 6 ... Resistor layer electrode, 8 ... Lead wire, 9 ... Stem, 10 ... Lead pin, 12
... Terminal frame, 13 ... Board holding part.
Claims (1)
体から成るガス検知層およびガス検知層に通電す
るためのガス検知層用電極とガス検知層を加熱す
るための抵抗体層および抵抗体層に通電するため
の抵抗体層用電極とを形成するとともに、低熱伝
導性の金属薄板に複数個を一単位とする端子用フ
レームをプレス成型等により連続して形成し、こ
の一単位における複数個の端子用フレームの一つ
にそのフレームの伸長方向上面の一部を上記耐熱
性絶縁基板下面の一部が載置される支承面とし、
この支承面内の領域で上記フレームの伸長方向に
対して両側へほぼ直交方向に一体的に突出する保
持部を形成し、この保持部を折曲し上記耐熱性絶
縁基板の両側を挟持して耐熱性絶縁基板を上記フ
レーム上面に固着し、かつ耐熱性絶縁基板のガス
検知層用電極と抵抗体層用電極と上記一単位を成
す複数個のフレームとに各々リード線を接続して
電気線路を形成し、かかる複数個のフレームを上
記金属薄板から各々分離した状態でステムから突
出する複数個のリードピンの自由端頂面に各々固
着し、このとき複数個のフレームと上記耐熱性絶
縁基板とをほぼ同じ高さ位置で平面形状に支承す
ることを特徴とするガス検知装置。 A gas sensing layer made of a metal oxide semiconductor on the upper and lower surfaces of the heat-resistant insulating substrate, an electrode for the gas sensing layer for energizing the gas sensing layer, a resistor layer for heating the gas sensing layer, and energizing the resistor layer. At the same time, a plurality of terminal frames are successively formed into one unit on a thin metal plate with low thermal conductivity by press molding, etc., and a plurality of terminal frames in one unit are formed. A part of the upper surface in the extension direction of one of the frames for use as a support surface on which a part of the lower surface of the heat-resistant insulating substrate is placed,
A holding part is formed in the region within this support surface and integrally projects on both sides in a direction substantially orthogonal to the extension direction of the frame, and this holding part is bent to sandwich both sides of the heat-resistant insulating substrate. A heat-resistant insulating substrate is fixed to the upper surface of the frame, and lead wires are connected to the electrodes for the gas detection layer and the electrodes for the resistor layer of the heat-resistant insulating substrate, and to the plurality of frames forming one unit, respectively, to form electrical lines. The plurality of frames are each separated from the thin metal plate and fixed to the top surfaces of the free ends of the plurality of lead pins protruding from the stem, and at this time, the plurality of frames and the heat-resistant insulating substrate are connected to each other. A gas detection device characterized in that the gas detection device is supported in a planar shape at approximately the same height position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978104963U JPS6324440Y2 (en) | 1978-08-01 | 1978-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978104963U JPS6324440Y2 (en) | 1978-08-01 | 1978-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5522630U JPS5522630U (en) | 1980-02-14 |
| JPS6324440Y2 true JPS6324440Y2 (en) | 1988-07-05 |
Family
ID=29046779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978104963U Expired JPS6324440Y2 (en) | 1978-08-01 | 1978-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324440Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249094A (en) * | 1975-10-16 | 1977-04-19 | Matsushita Electric Ind Co Ltd | Gas detecting device |
-
1978
- 1978-08-01 JP JP1978104963U patent/JPS6324440Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249094A (en) * | 1975-10-16 | 1977-04-19 | Matsushita Electric Ind Co Ltd | Gas detecting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5522630U (en) | 1980-02-14 |
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