JPH0332488U - - Google Patents
Info
- Publication number
- JPH0332488U JPH0332488U JP9381689U JP9381689U JPH0332488U JP H0332488 U JPH0332488 U JP H0332488U JP 9381689 U JP9381689 U JP 9381689U JP 9381689 U JP9381689 U JP 9381689U JP H0332488 U JPH0332488 U JP H0332488U
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- housing
- inner conductor
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381689U JPH0332488U (es) | 1989-08-09 | 1989-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381689U JPH0332488U (es) | 1989-08-09 | 1989-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332488U true JPH0332488U (es) | 1991-03-29 |
Family
ID=31643179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9381689U Pending JPH0332488U (es) | 1989-08-09 | 1989-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332488U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (ja) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | 回路基板モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器 |
-
1989
- 1989-08-09 JP JP9381689U patent/JPH0332488U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098287A (ja) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | 回路基板モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器 |
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