JPH0331076Y2 - - Google Patents
Info
- Publication number
- JPH0331076Y2 JPH0331076Y2 JP10597181U JP10597181U JPH0331076Y2 JP H0331076 Y2 JPH0331076 Y2 JP H0331076Y2 JP 10597181 U JP10597181 U JP 10597181U JP 10597181 U JP10597181 U JP 10597181U JP H0331076 Y2 JPH0331076 Y2 JP H0331076Y2
- Authority
- JP
- Japan
- Prior art keywords
- tantalum
- thin film
- gold
- integrated circuit
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 229910052715 tantalum Inorganic materials 0.000 claims description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000010408 film Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10597181U JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10597181U JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5812942U JPS5812942U (ja) | 1983-01-27 |
JPH0331076Y2 true JPH0331076Y2 (US20110009641A1-20110113-C00185.png) | 1991-07-01 |
Family
ID=29900488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10597181U Granted JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812942U (US20110009641A1-20110113-C00185.png) |
-
1981
- 1981-07-16 JP JP10597181U patent/JPS5812942U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5812942U (ja) | 1983-01-27 |
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