JPH0331076Y2 - - Google Patents
Info
- Publication number
- JPH0331076Y2 JPH0331076Y2 JP10597181U JP10597181U JPH0331076Y2 JP H0331076 Y2 JPH0331076 Y2 JP H0331076Y2 JP 10597181 U JP10597181 U JP 10597181U JP 10597181 U JP10597181 U JP 10597181U JP H0331076 Y2 JPH0331076 Y2 JP H0331076Y2
- Authority
- JP
- Japan
- Prior art keywords
- tantalum
- thin film
- gold
- integrated circuit
- lower layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 229910052715 tantalum Inorganic materials 0.000 claims description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000010408 film Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10597181U JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10597181U JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5812942U JPS5812942U (ja) | 1983-01-27 |
| JPH0331076Y2 true JPH0331076Y2 (US06633600-20031014-M00021.png) | 1991-07-01 |
Family
ID=29900488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10597181U Granted JPS5812942U (ja) | 1981-07-16 | 1981-07-16 | 薄膜集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5812942U (US06633600-20031014-M00021.png) |
-
1981
- 1981-07-16 JP JP10597181U patent/JPS5812942U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5812942U (ja) | 1983-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0331076Y2 (US06633600-20031014-M00021.png) | ||
| JPS6334281Y2 (US06633600-20031014-M00021.png) | ||
| JPH0238462Y2 (US06633600-20031014-M00021.png) | ||
| JPH0310670Y2 (US06633600-20031014-M00021.png) | ||
| JPS6063943U (ja) | 半導体ウエハ用マウントフレ−ム | |
| JPH0225251Y2 (US06633600-20031014-M00021.png) | ||
| JPH03276788A (ja) | 集積回路搭載用セラミックス基板 | |
| JP2522094B2 (ja) | 半導体パッケ―ジのリ―ドカット方法 | |
| JPS587338U (ja) | 半導体装置用グランドチツプ | |
| JPH0423142U (US06633600-20031014-M00021.png) | ||
| JPH02148569U (US06633600-20031014-M00021.png) | ||
| JPS5883147U (ja) | 半導体装置 | |
| JPH0189722U (US06633600-20031014-M00021.png) | ||
| JPS6244465U (US06633600-20031014-M00021.png) | ||
| JPS593941A (ja) | 混成集積回路 | |
| JPS59192851U (ja) | 半導体装置 | |
| JPS5978637U (ja) | 混成集積回路装置 | |
| JPS5853160U (ja) | 非晶質半導体装置 | |
| JPS5858354U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS5834739U (ja) | 半導体装置 | |
| JPS6127302U (ja) | タンタル薄膜抵抗配線基板 | |
| JPH0187549U (US06633600-20031014-M00021.png) | ||
| JPS63149546U (US06633600-20031014-M00021.png) | ||
| JPS5889946U (ja) | 半導体装置 | |
| JPS59117149U (ja) | ビ−ムリ−ド型半導体装置 |
