JPH0329905A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0329905A JPH0329905A JP16495189A JP16495189A JPH0329905A JP H0329905 A JPH0329905 A JP H0329905A JP 16495189 A JP16495189 A JP 16495189A JP 16495189 A JP16495189 A JP 16495189A JP H0329905 A JPH0329905 A JP H0329905A
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- optical fiber
- wiring board
- fiber cable
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 claims abstract description 28
- 230000003287 optical effect Effects 0.000 abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、光通信装置に適する印刷配線板に関し、特に
、光素子などの電子部品を搭載できる印刷配線板に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board suitable for optical communication devices, and particularly to a printed wiring board on which electronic components such as optical elements can be mounted.
（従来の技術）
従来、光素子などの電子部品を搭載する印刷配線板とし
て、絶縁板と、該絶縁板に形成されている複数の配線路
と、それぞれが対応する前記絶縁板面に重ね合わされ、
前記絶縁板面を覆−５１対の絶縁膜とを備えるものがあ
る。(Prior Art) Conventionally, as a printed wiring board on which electronic components such as optical elements are mounted, an insulating plate and a plurality of wiring paths formed on the insulating plate are stacked on the corresponding insulating plate surface. ,
Some devices include 51 pairs of insulating films covering the insulating plate surface.
（発明が解決しようとする課題）
複数の電子部品を印刷配線板に実装するときには、印刷
配線板に取り付けられるひとつの電子部品の光出力端子
と他の電子部品の光入力端子とは光ファイバケーブルで
接続されるから、光ファイバケーブルを布設し、固定部
材で印刷配線板上に固定する必要がある。その結果、印
刷配線板上の部品の実装スペースが制限され、また、光
ファイバケーブルの布設作業に手間が掛る。(Problem to be Solved by the Invention) When multiple electronic components are mounted on a printed wiring board, the optical output terminal of one electronic component and the optical input terminal of another electronic component attached to the printed wiring board are connected using an optical fiber cable. Therefore, it is necessary to lay an optical fiber cable and fix it on the printed wiring board with a fixing member. As a result, the mounting space for components on the printed wiring board is limited, and the installation work of the optical fiber cable is time-consuming.
また、光ファイバケーブルの布設作業中または他の部品
の実装中、光ファイバケーブルを他の部品に接触させ、
損傷させることがあり、製品の不良化を招く。Also, during the installation of optical fiber cables or the mounting of other parts, do not allow the optical fiber cables to come into contact with other parts,
It may cause damage and result in defective products.
本発明の目的は、電子部品の実装スペースを制約せず、
また、光素子などの電子部品の搭載を容易にする印刷配
線板を提供することにある。An object of the present invention is to avoid restricting the mounting space of electronic components;
Another object of the present invention is to provide a printed wiring board that facilitates mounting of electronic components such as optical elements.
（課題を解決するための手段）
本発明の印刷配線板は、絶縁板と、該絶縁板に形成され
ている複数の配線路と、それぞれが対応する前記絶縁板
面に重ね合わされ、前記絶縁板面を覆う１対の絶縁膜と
、前記絶縁板上に配置され、前記絶縁膜に覆われている
少なくとも１つの光ファイバケーブルとを備える。(Means for Solving the Problems) The printed wiring board of the present invention includes an insulating plate, a plurality of wiring paths formed on the insulating plate, and a plurality of wiring paths formed on the insulating plate, each of which is superimposed on a corresponding surface of the insulating plate, and The device includes a pair of insulating films covering a surface, and at least one optical fiber cable disposed on the insulating plate and covered with the insulating film.
（作用）
本発明の印刷配線板は、複数の配線路および少なくとも
１つの光ファイバケーブルを備えるから、空中配線を設
けることなく、光素子を有する電子部品および他の電子
部品を混在させて搭載することができる。(Function) Since the printed wiring board of the present invention includes a plurality of wiring paths and at least one optical fiber cable, it is possible to mount electronic components having optical elements and other electronic components in a mixed manner without providing aerial wiring. be able to.
また、光ファイバケーブルは絶縁膜で覆われているから
、外部機器との接触による損傷を少なくすることができ
る。Furthermore, since the optical fiber cable is covered with an insulating film, damage caused by contact with external equipment can be reduced.
（実施例）
第１図は本発明の印刷配線板の一実施例を示す断面図、
第２図は第１図の印刷配線板に電子部品を実装した状態
を示す斜視図、第３図は本発明の印刷配線板の他の実施
例を示す断面図である。(Example) FIG. 1 is a sectional view showing an example of the printed wiring board of the present invention.
2 is a perspective view showing a state in which electronic components are mounted on the printed wiring board of FIG. 1, and FIG. 3 is a sectional view showing another embodiment of the printed wiring board of the present invention.
印刷配線板１０は、絶縁板１２を備える。絶縁板１２は
四角形の平面形状を有し、複数の紙製基材と、該紙製基
材を相互に接着するフェノール樹脂の接着剤層とからな
る積層板である。Printed wiring board 10 includes an insulating plate 12 . The insulating plate 12 has a rectangular planar shape and is a laminate made of a plurality of paper base materials and a phenol resin adhesive layer that adheres the paper base materials to each other.
絶縁板１２には、複数の配線路１４が形成されている。A plurality of wiring paths 14 are formed on the insulating plate 12.
各配線路１４は、それぞれに対応する絶縁板１２の面上
すなわち表面上または裏面上に配置されている。各配線
路１４は銅箔からなる。各配線路１４は、絶縁板１２の
各面（表面および裏面）を覆う絶縁膜１６で覆われてい
る。Each wiring path 14 is arranged on the surface of the corresponding insulating plate 12, that is, on the front surface or the back surface. Each wiring path 14 is made of copper foil. Each wiring path 14 is covered with an insulating film 16 that covers each surface (front and back surfaces) of the insulating plate 12.
絶縁板１２の面上には、少なくとも１つの光ファイバケ
ーブル１８が配置されている。図示の例によれば、１つ
の光ファイバケーブル１８が絶縁板１２の表面に配置さ
れている。光ファイバケーブル１８は絶縁膜１６で覆わ
れている。光ファイバケーブル１８は光ファイバ素線（
図示せず）と、該光ファイバ素線を覆う緩衝層と、該緩
衝層を覆う２次被覆とからなる。At least one optical fiber cable 18 is arranged on the surface of the insulating plate 12 . According to the illustrated example, one optical fiber cable 18 is arranged on the surface of the insulating plate 12. The optical fiber cable 18 is covered with an insulating film 16. The optical fiber cable 18 is a bare optical fiber (
(not shown), a buffer layer that covers the optical fiber strand, and a secondary coating that covers the buffer layer.
第２図を参照するに、印刷配線板１０には、２３
４
つの光部品２０．２２および複数の電子部品２４，２６
．２８が搭載される。光部品２ｏは光分配器であり光部
品２２は光部品２ｏからの光信号を電気信号に変換する
光電変換器である。光部品２ｏの光出力端子は光ファイ
バケーブル１８によって光部品２２の光入力端子に接続
されている。Referring to FIG. 2, the printed wiring board 10 includes 23, 4 optical components 20, 22 and a plurality of electronic components 24, 26.
．． 28 will be installed. The optical component 2o is an optical distributor, and the optical component 22 is a photoelectric converter that converts an optical signal from the optical component 2o into an electrical signal. The optical output terminal of the optical component 2o is connected to the optical input terminal of the optical component 22 by an optical fiber cable 18.
電子部品２４は半導体パッケージであり、光ファイバケ
ーブル１８の上方に配置されている。電子部品２４の各
端子は、印刷配線板１ｏに設けられているスルーホール
（図示せず）を介して対応する配線路１４に接続されて
いる。電子部品２６はコンデンサであり、電子部品２８
はコネクタであり、各電部品２６．２８の各端子は対応
する配線路１４に接続されている。The electronic component 24 is a semiconductor package and is placed above the optical fiber cable 18. Each terminal of the electronic component 24 is connected to the corresponding wiring path 14 via a through hole (not shown) provided in the printed wiring board 1o. The electronic component 26 is a capacitor, and the electronic component 28
is a connector, and each terminal of each electrical component 26, 28 is connected to a corresponding wiring path 14.
また、実装作業中、例えば、工具などが印刷配線板１４
の光ファイバケーブル１８の位置する部位に衝突すると
、衝突による荷重は絶縁膜１６によって緩和され、緩和
された荷重が光ファイバケーブル１８に作用するから、
光ファイバケーブル１８は損傷されにくい。In addition, during mounting work, for example, tools may be removed from the printed wiring board 14.
When the optical fiber cable 18 is located, the load due to the collision is alleviated by the insulating film 16, and the relieved load acts on the optical fiber cable 18.
Fiber optic cable 18 is less susceptible to damage.
第３図を参照するに、印刷配線板３０は、多層積層体か
らなる絶縁板３２の内層および各面上に複数の配線路３
４．３６が形成されているものである。絶縁板３２の表
面には、１つ光ファイバケーブル１８が布設されている
。光ファイバケーブル１８および絶縁板３２の各面に形
成されている複数の配線路３６は絶縁膜１６で覆われて
いる。Referring to FIG. 3, the printed wiring board 30 includes a plurality of wiring paths 3 on the inner layer and each surface of an insulating board 32 made of a multilayer laminate.
4.36 is formed. One optical fiber cable 18 is laid on the surface of the insulating plate 32. A plurality of wiring paths 36 formed on each surface of the optical fiber cable 18 and the insulating plate 32 are covered with an insulating film 16.
（発明の効果）
本発明によれば、光ファイバケーブルなどの配線を印刷
配線板上に布設することなく、光素子を有する電子部品
および他の電子部品を混在させて搭載することができる
から、前記配線の布設による電子部品の実装スペースに
対する制約を解消することができる。(Effects of the Invention) According to the present invention, electronic components having optical elements and other electronic components can be mounted in a mixed manner without laying wiring such as optical fiber cables on a printed wiring board. Restrictions on the mounting space for electronic components due to the wiring installation can be eliminated.
また、本発明によれば、光ファイバケーブルが絶縁膜で
覆われていることから、外部機器などとの接触による損
傷を少なくすることができ、製品の不良化を未然に防止
することができる。Further, according to the present invention, since the optical fiber cable is covered with an insulating film, it is possible to reduce damage caused by contact with external equipment, etc., and it is possible to prevent the product from becoming defective.
第１図は本発明の印刷配線板の一実施例を示す断面図、
第２図は第１図の印刷配線板に電子部品を実装した状態
を示す斜視図、第３図は本発明の印刷配線板の他の実施
例を示す断面図である。
１０．３０・・・印刷配線板、１２．３２・・・絶縁板
、１４，３４．３６・・・配線路、１６・・・絶縁膜、
１８・・・光ファイバケーブルFIG. 1 is a sectional view showing an embodiment of the printed wiring board of the present invention,
2 is a perspective view showing a state in which electronic components are mounted on the printed wiring board of FIG. 1, and FIG. 3 is a sectional view showing another embodiment of the printed wiring board of the present invention. 10.30... Printed wiring board, 12.32... Insulating plate, 14, 34.36... Wiring path, 16... Insulating film,
18...Optical fiber cable
Claims (1)
、それぞれが対応する前記絶縁板面に重ね合わされ、前
記絶縁板面を覆う１対の絶縁膜と、前記絶縁板上に配置
され、前記絶縁膜に覆われている少なくとも１つの光フ
ァイバケーブルとを備える印刷配線板。an insulating plate, a plurality of wiring paths formed on the insulating plate, a pair of insulating films each overlapping a corresponding insulating plate surface and covering the insulating plate surface, and a pair of insulating films disposed on the insulating plate; , and at least one optical fiber cable covered with the insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16495189A JPH0329905A (en) | 1989-06-27 | 1989-06-27 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16495189A JPH0329905A (en) | 1989-06-27 | 1989-06-27 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0329905A true JPH0329905A (en) | 1991-02-07 |
Family
ID=15802964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16495189A Pending JPH0329905A (en) | 1989-06-27 | 1989-06-27 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0329905A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5548675A (en) * | 1993-04-02 | 1996-08-20 | The Furukawa Electric Co., Ltd. | Multifiber connector, a method of manufacturing the same, and a construction for connecting the multifiber connector to an optical device |
| KR20040016329A (en) * | 2002-08-16 | 2004-02-21 | 삼성전기주식회사 | Multi-layer printed circuit board and method for embedding optical fiber within the same |
| KR100483622B1 (en) * | 2002-08-16 | 2005-04-19 | 삼성전기주식회사 | Method for attaching optical waveguide component to printed circuit board |
-
1989
- 1989-06-27 JP JP16495189A patent/JPH0329905A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5548675A (en) * | 1993-04-02 | 1996-08-20 | The Furukawa Electric Co., Ltd. | Multifiber connector, a method of manufacturing the same, and a construction for connecting the multifiber connector to an optical device |
| KR20040016329A (en) * | 2002-08-16 | 2004-02-21 | 삼성전기주식회사 | Multi-layer printed circuit board and method for embedding optical fiber within the same |
| KR100483622B1 (en) * | 2002-08-16 | 2005-04-19 | 삼성전기주식회사 | Method for attaching optical waveguide component to printed circuit board |
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