CN217546396U - Photoelectric hybrid circuit board and electronic device - Google Patents
Photoelectric hybrid circuit board and electronic device Download PDFInfo
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- CN217546396U CN217546396U CN202220365766.XU CN202220365766U CN217546396U CN 217546396 U CN217546396 U CN 217546396U CN 202220365766 U CN202220365766 U CN 202220365766U CN 217546396 U CN217546396 U CN 217546396U
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Abstract
The utility model discloses a photoelectric mixed circuit board and electron device, wherein, photoelectric mixed circuit board includes: the device comprises a first plate, a second plate and a third plate, wherein at least one side of the first plate is provided with a groove; the optical fiber plate is installed in the recess, and wherein, the optical fiber plate includes at least one base plate, anchor coat and at least one optical fiber component, and at least one optical fiber component of anchor coat parcel, and the anchor coat laminating sets up in one side of at least one base plate. Through the structure, the utility model discloses can utilize the optical fiber board to reduce laying the degree of difficulty of optic fibre among the photoelectric mixed circuit board to the reinforcing improves photoelectric mixed circuit board's reliability and stability to optical fiber assembly's protection.
Description
Technical Field
The utility model discloses be applied to photoelectric hybrid technical field, especially photoelectric hybrid circuit board and electron device.
Background
A Printed Circuit Board (PCB), also called a Printed Circuit Board or a Printed Circuit Board, is an important electronic component used in a wide range, is a support for an electronic component, and is also a carrier for electrical connection of an electronic component.
The optical interconnection means that the signal connection between the circuit board and the chip is realized by using a light guide medium (optical fiber, optical waveguide, etc.), and the data transmission with low power consumption, high speed and complete signals between boards/in boards can be realized.
The conventional photoelectric hybrid circuit board is usually prepared by directly integrating optical fibers into the printed circuit board, but in the integration process, the optical fibers are easy to break, and the integration scheme is usually complex to realize and high in difficulty.
SUMMERY OF THE UTILITY MODEL
The utility model provides a photoelectric mixed circuit board to solve the photoelectric mixed circuit board that exists among the prior art and be difficult to the integrated problem.
In order to solve the technical problem, the utility model provides a photoelectric hybrid circuit board, include: the first plate is provided with a groove at least on one side; the optical fiber plate is installed in the groove, wherein the optical fiber plate comprises at least one substrate, a bonding layer and at least one optical fiber assembly, the bonding layer wraps the at least one optical fiber assembly, and the bonding layer is attached to one side of the at least one substrate.
Wherein, the fiber optic plate still includes: the optical fiber board comprises an optical fiber board body, a plurality of optical fiber bundles and a plurality of optical connectors, wherein one end of each optical fiber bundle is connected with the optical fiber board body, and the other end of each optical fiber bundle is connected with the corresponding optical connector; the optical fiber plate main body comprises at least one substrate, a bonding layer and at least one optical fiber assembly, and one end of each optical fiber bundle is connected with the corresponding optical fiber assembly in the optical fiber plate main body.
The groove comprises a groove main body and a plurality of sub-grooves, and the sub-grooves are arranged at intervals; one end of each sub-groove is communicated with the groove main body, and the other end of each sub-groove extends to the plate edge and/or the preset position of the photoelectric hybrid circuit board respectively.
The optical fiber plate main body is fixedly arranged in the groove by using filling materials, and the optical fiber bundles and the corresponding optical connectors are fixedly arranged in the corresponding sub-grooves by using the filling materials.
The optical fiber plate body is fixedly arranged in the groove by using filling materials, and at least part of optical fiber bundles and corresponding optical connectors are movably arranged in the corresponding sub-grooves.
Wherein, the mixed circuit board of photoelectricity still includes the second plate, and one side of second plate and the one side laminating setting that first plate formed the recess to make the optic fibre board set up between second plate and first plate.
The optical connector comprises a first plate, a second plate and a connecting device, wherein one side of the second plate is provided with a plurality of connecting devices, and each connecting device is used for being connected with a corresponding optical connector; and/or a plurality of connecting devices are arranged on the first plate, and each connecting device is respectively arranged corresponding to the corresponding optical connector so as to be connected with the corresponding optical connector.
The photoelectric hybrid circuit board further comprises a bonding layer; the bonding layer is arranged between the first plate and the second plate and is used for fixedly connecting the first plate and the second plate.
Wherein each optical fiber bundle comprises a plurality of optical fibers and a protective layer; wherein the protective layer wraps the plurality of optical fibers.
In order to solve the technical problem, the utility model also provides an electronic device, electronic device includes the mixed circuit board of photoelectricity as above-mentioned arbitrary.
The utility model has the advantages that: be different from prior art's condition, the utility model discloses a photoelectric hybrid circuit board can reduce laying the degree of difficulty of optic fibre through installing optic fibre integrated optical fiber plate in the recess of first plate to the reinforcing improves photoelectric hybrid circuit board's reliability and stability to optical fiber assembly's protection, and optical fiber plate installs in the recess of first plate indent, can reduce whole photoelectric hybrid circuit board size, saves occupation space.
Drawings
Fig. 1 is a schematic cross-sectional view of an embodiment of the opto-electric hybrid circuit board of the present invention;
FIG. 2 is a schematic top view of the optoelectronic hybrid circuit board in the embodiment of FIG. 1;
FIG. 3 is a schematic cross-sectional view of an embodiment of the optical fiber bundle of the present invention;
fig. 4 is a schematic cross-sectional structure diagram of another embodiment of the optical fiber bundle of the present invention;
fig. 5 is a schematic cross-sectional view of another embodiment of the opto-electric hybrid circuit board of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear \8230;) are involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure diagram of an embodiment of the opto-electric hybrid circuit board of the present invention.
The photoelectric hybrid circuit board 100 of the present embodiment includes: the optical fiber module comprises a first plate 101 and an optical fiber plate 102, wherein at least one side of the first plate 101 is formed with a groove 103, and the optical fiber plate 102 is installed in the groove 103.
The optical fiber plate comprises at least one substrate 1024, a bonding layer 1025 and at least one optical fiber component 1026, wherein the bonding layer 1025 wraps the at least one optical fiber component 1026, and the bonding layer 1025 is arranged on one side of the at least one substrate 1024 in a fitting mode. The plurality of optical fibers are arranged in a manner to form a fiber optic assembly 1026.
In one specific application scenario, where the number of substrates 1024 may be 2, the optical fiber plate body 1021 may be formed by sequentially stacking the substrate 1024, the bonding layer 1025, the optical fiber assembly 1026, the bonding layer 1025, and another substrate 1024. In another specific application scenario, where the number of the substrates 1024 is 1, the optical fiber plate body 1021 may also be formed by sequentially stacking the substrate 1024, the bonding layer 1025, the optical fiber assembly 1026, and the bonding layer 1025. The substrate 1024 includes a PI film, a resin fiberglass sheet, or other base films, substrates, carrier plates, etc. meeting the process conditions. While bonding layer 1025 may comprise a viscous, pliable bonding/filling material such as acrylic, rubber, silicone, glue, etc., which may be one or more substances that meet the process conditions, bonding layer 1025 is typically in a fully surrounding relationship with optical fiber assembly 1026. Wrapping the fiber optic assembly 1026 by the substrate 1024 and the bonding layer 1025 of the fiber optic plate 102 protects the optical fibers and improves the ability of the fiber optic plate 102 to withstand PCB and PCBA processes (temperature, pressure, liquid chemicals/liquid reagents), improving the reliability and stability of the fiber optic plate 102.
The first board 101 of the present embodiment includes at least one conductive layer 1012 and at least one dielectric layer 1011 stacked in sequence, and is formed by drilling, electroplating, exposing, developing, and other processes, so as to implement various functions of the circuit board. In this embodiment, the optical fiber plate 102 wraps the optical fiber assembly 1026 through the substrate 1024 and the bonding layer 1025, so that the optical fiber assembly can protect the optical fiber, and compared with directly laying the optical fiber on the first plate 101, the fault tolerance is higher, the optical fiber assembly is more convenient and easier, and the process is simpler and more convenient, and when the optical fiber is laid on the optical fiber plate 102, the preparation condition of the first plate 101 does not need to be considered, so that the optical fiber protection performance is better, and the reliability and the stability of the photoelectric hybrid circuit board 100 can be better improved. The embodiment integrates the optical fiber into the optical fiber plate 102, so that the optical fiber can be independent from the first plate 101, and the connection between the optical fiber and other devices or optical paths is facilitated. The first plate 101 and the optical fiber plate 102 of the embodiment are independent of each other, can be processed respectively, do not affect each other, and have lower scrap cost.
In a specific application scenario, one side of the first plate 101 may be formed with a groove 103 or a plurality of grooves 103, and each groove 103 may be correspondingly installed with the optical fiber plate 102. In another specific application scenario, one or more grooves 103 may be formed on multiple sides of the first plate 101, and each groove 103 may have a corresponding optical fiber plate 102 installed therein. Thereby forming the opto-electric hybrid circuit board 100.
The optical fiber board 102 of the embodiment is installed in the concave groove 103 on the first board 101, so that the size of the whole photoelectric hybrid circuit board 100 can be reduced, and the occupied space of the photoelectric hybrid circuit board 100 is saved.
In a specific application scenario, the fiber optic plate 102 may be mounted within the recess 103 by a filler material 105. In the installation process, the liquid filling material 105 is filled in the groove 103, the optical fiber plate 102 is placed in the groove 103, the filling material 105 wraps the groove 103 and fills the groove 103 to reduce the inner cavity of the photoelectric hybrid circuit board 100, and then the filling material 105 is fixed in a heating, lighting or pressurizing mode, so that the installation of the optical fiber plate 102 is completed. The filling material 105 may be, without limitation, epoxy resin, silicone, rubber, or the like. Wherein, the inner cavity of the optoelectronic hybrid circuit board 100 can be further reduced by performing a vacuum process on the filling material 105 filling the groove 103.
In another specific application scenario, the optical fiber plate 102 may also be mounted in the groove 103 by adhesion, clamping, welding, or the like, and the specific mounting manner is not limited herein.
Through the structure, the photoelectric hybrid circuit board of this embodiment can reduce laying the degree of difficulty of optic fibre through installing optic fibre integrated optical fiber plate in the recess of first plate to the reinforcing improves photoelectric hybrid circuit board's reliability and stability to the protection of optic fibre, and optical fiber plate installs in the recess of first plate indent, can reduce the size of whole photoelectric hybrid circuit board, saves occupation space.
In other embodiments, please further refer to fig. 2, wherein fig. 2 is a schematic top view of the opto-electric hybrid circuit board in the embodiment of fig. 1.
The optical fiber board 102 further includes a optical fiber board body 1021, a plurality of optical fiber bundles 1022, and a plurality of optical connectors 1023, wherein one end of each optical fiber bundle 1022 is connected to the optical fiber board body 1021, and the other end of each optical fiber bundle 1022 is connected to the corresponding optical connector 1023, so as to realize signal transmission between the optical fiber board body 1021 and the optical connectors 1023. The optical connector 1023 is used for communication connection with the first board 101, an external device, or an external optical path.
The fiber plate body 1021 includes at least one substrate 1024, a bonding layer 1025, and at least one optical fiber assembly 1026, and one end of each optical fiber bundle 1022 is connected to the corresponding optical fiber assembly 1026 in the fiber plate body 1021 for optical signal transmission.
In other embodiments, the recess 103 includes a recess body 1031 and a plurality of sub-recesses 1032, the plurality of sub-recesses 1032 are arranged at intervals, one ends of the plurality of sub-recesses 1032 are communicated with the recess body 1031, and the other ends of the plurality of sub-recesses 1032 respectively extend to the board edge and/or the predetermined position of the optoelectronic hybrid circuit board 100. Wherein, predetermine the position and can include the optional position on the mixed circuit board 100 face of photoelectricity, including the intermediate position on the face, specifically set up based on actual demand.
In other embodiments, the fiber plate body 1021 is fixedly mounted within the recess body 1031 with the filler material 105, and at least some of the optical fiber bundles 1022 and corresponding optical connectors 1023 are movably mounted within the corresponding sub-recesses 1032. The optical fiber bundles 1022 movably mounted in the corresponding sub-grooves 1032 can be flexibly placed, and the corresponding optical connectors 1023 can also be flexibly connected with external equipment or external optical paths, so that the connection freedom of the optical connectors 1023 is improved. To facilitate processing, testing, and application of the opto-electronic hybrid circuit board 100.
The optical fiber bundles 1022 may extend along the extending direction of the corresponding sub-grooves 1032, so that the corresponding optical connectors 1023 are connected with external devices or external optical paths at the board edge and/or the preset position of the optoelectronic hybrid circuit board 100.
In a specific application scenario, when the sub-groove 1032 extends to the edge of the board of the optoelectronic hybrid circuit board 100, the corresponding optical connector 1023 can be connected with an external device or an external optical path from the corresponding side of the edge of the board of the optoelectronic hybrid circuit board 100. In another specific application scenario, when the sub-groove 1032 extends to a preset position of the optoelectronic hybrid circuit board 100, the corresponding optical connector 1023 may be connected with an external device or an external optical path from a surface corresponding to the preset position of the optoelectronic hybrid circuit board 100.
In a specific application scenario, the optical connector 1023 may be exposed on the surface of the optoelectronic hybrid circuit board 100 to connect with a corresponding external device or external optical path, and the optical connector 1023 may also be disposed in the corresponding sub-groove 1032, and the corresponding external device or external optical path is inserted into the corresponding sub-groove 1032 to connect with the optical connector 1023.
In other embodiments, the optical fiber plate main body 1021 is fixedly installed in the groove 103 by the filling material 105, and the optical fiber bundles 1022 and the corresponding optical connectors 1023 are fixedly installed in the corresponding sub-grooves 1032 by the filling material 105, so that the entire optical fiber plate 102 is fixed by the filling material 105, thereby improving the installation stability of the optical fiber plate 102 and the structural stability of the optoelectronic hybrid circuit board 100.
In other embodiments, the optical fiber bundle 1022 includes a plurality of optical fibers and a protective layer that surrounds the plurality of optical fibers to protect the plurality of optical fibers through the protective layer, thereby improving reliability and stability of the optical fiber bundle 1022.
The protective layer of this embodiment may be made of a flexible material or a rigid material, and is not limited herein. When the protective layer is made of a flexible material, the flexible material is made of temperature-resistant silica gel, rubber, flexible resin and other materials, and is not limited herein.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structure diagram of an embodiment of an optical fiber bundle according to the present invention.
The optical fiber bundle 1022 of the present embodiment includes a plurality of optical fibers 1028 and a protective layer 1027, wherein the protective layer 1027 wraps the plurality of optical fibers 1028, and a gap is provided between the protective layer 1027 and the plurality of optical fibers 1028, so as to protect the plurality of optical fibers 1028 and improve stability and reliability of the optical fiber bundle 1022.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of another embodiment of the optical fiber bundle of the present invention.
The optical fiber bundle 1022 of the present embodiment includes a plurality of optical fibers 1028 and a protective layer 1027, wherein the protective layer 1027 wraps the plurality of optical fibers 1028, and the protective layer 1027 and the plurality of optical fibers 1028 are attached to each other, so that a buffering capacity to cope with external stress to a certain extent is provided for the optical fiber bundle 1022, the plurality of optical fibers 1028 are protected, and stability and reliability of the optical fiber bundle 1022 are improved.
In other embodiments, a plurality of connecting devices may be disposed on the first board 101, each of the connecting devices being disposed corresponding to a corresponding optical connector 1023, the plurality of connecting devices being configured to be correspondingly connected to a plurality of optical connectors of the optical fiber plate 102, so as to realize optical connection between the optical fiber plate 102 and the first board 101. Wherein, the connection device may include: the optical connector, the photoelectric converter, and the like are not particularly limited.
In other embodiments, the optoelectronic hybrid circuit board further includes a second board, and one side of the second board is attached to the side of the first board 101 with the groove, so as to dispose the optical fiber plate 102 between the second board and the first board 101. The second plate can be formed by sequentially laminating at least one conductive layer and at least one dielectric layer and then carrying out processes of drilling, electroplating, exposure, development and the like.
Referring to fig. 5, fig. 5 is a schematic cross-sectional view of another embodiment of the opto-electric hybrid circuit board of the present invention.
The first board 201, the optical fiber board 202, the groove and other structures in the opto-electric hybrid circuit board 200 of the present embodiment and the arrangement of the connection relationship thereof are the same as those in the previous embodiments, and please refer to the foregoing, which will not be described herein again.
The opto-electric hybrid circuit board 200 of the present embodiment further includes a second board 203 on the basis of the opto-electric hybrid circuit board 100 of the previous embodiment, and one side of the second board 203 is attached to one side of the first board 201 where a groove (not labeled in the figure) is formed, so that the optical fiber plate 102 is disposed between the second board 203 and the first board 101, thereby matching with the preparation requirement of the opto-electric hybrid circuit board 200. Through the structure, the optical fiber plate 202 can be embedded in the photoelectric hybrid circuit board 200, so that the size of the whole photoelectric hybrid circuit board 200 can be reduced, and the occupied space can be saved.
In other embodiments, a plurality of connecting devices may be disposed on one side of the second plate 203, and each connecting device is configured to be connected to a corresponding optical connector, so as to realize optical connection between the optical fiber plate 202 and the second plate 203. Wherein, the connection device may include: the optical connector, the photoelectric converter, and the like are not particularly limited.
In other embodiments, the optoelectronic hybrid circuit board 200 further includes an adhesive layer 204, and the adhesive layer 204 is disposed between the first board 201 and the second board 203 and is used to fixedly connect the first board 201 and the second board 203, so as to improve the structural stability of the entire optoelectronic hybrid circuit board 200.
In other embodiments, the bonding layer 204 comprises a prepreg. The prepregs are placed on the first plate 201 and the second plate 203, and then are melted and solidified in a high-temperature and high-pressure mode, so that the first plate 201 and the second plate 203 are fixed, and the structural stability of the whole photoelectric hybrid circuit board 200 is improved.
In other embodiments, the adhesive layer 204 may also include epoxy, glue, for direct bonding.
In other embodiments, at least one first metallized hole 206 may be formed in the first board 201, and the at least one first metallized hole 206 penetrates through the first board 201 to realize interconnection between boards of the first board 201; at least one second metalized hole 207 is formed in the second board 203, and the at least one second metalized hole 207 penetrates through the second board 203 to realize interconnection between boards of the second board 203; wherein at least one first metallized hole 206 is electrically connected to at least one second metallized hole 207, thereby realizing an inter-board interconnection between the first board 201 and the second board 203.
In other embodiments, the optoelectronic hybrid circuit board 200 may also be provided with a metal substrate to implement interconnection between boards, or not to implement interconnection between boards, and is specifically provided based on actual requirements, and is not limited herein.
The application also provides an electronic device, the electronic device includes the mixed circuit board of the photoelectricity of any one of the above-mentioned embodiments, thereby can reduce the degree of difficulty of laying of optic fibre, and the reinforcing is to the protection of optic fibre, improve the reliability and the stability of mixed circuit board of photoelectricity, and can reduce the size of whole mixed circuit board of photoelectricity, save occupation space, and can enlarge optical connector and other equipment or circuit connection's connection range and degree of freedom, thereby be convenient for mixed circuit board of photoelectricity processing, test and application.
The features of the embodiments described above may be combined in any combination, and for simplicity of description, not all possible combinations of the features of the embodiments described above are described, however, as long as there is no contradiction between combinations of these technical features, the scope of the present specification should be considered as being described.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. An opto-electric hybrid circuit board, characterized in that the opto-electric hybrid circuit board comprises:
the device comprises a first plate, a second plate and a third plate, wherein at least one side of the first plate is provided with a groove;
the optical fiber plate is installed in the groove, wherein the optical fiber plate comprises at least one substrate, a bonding layer and at least one optical fiber assembly, the bonding layer wraps the at least one optical fiber assembly, and the bonding layer is attached to and arranged on at least one side of the substrate.
2. The optoelectronic hybrid circuit board of claim 1, wherein the fiber optic plate further comprises: the optical fiber plate comprises an optical fiber plate body, a plurality of optical fiber bundles and a plurality of optical connectors, wherein one end of each optical fiber bundle is connected with the optical fiber plate body, and the other end of each optical fiber bundle is connected with the corresponding optical connector;
the optical fiber plate body comprises the at least one substrate, the bonding layer and the at least one optical fiber assembly, and one end of each optical fiber bundle is connected with the corresponding optical fiber assembly in the optical fiber plate body.
3. The optoelectronic hybrid circuit board of claim 2, wherein the recess comprises a recess main body and a plurality of sub-recesses, the plurality of sub-recesses being spaced apart from each other;
one end of each of the sub-grooves is communicated with the groove main body, and the other end of each of the sub-grooves extends to the edge of the photoelectric hybrid circuit board and/or a preset position.
4. The opto-electric hybrid circuit board according to claim 3,
the optical fiber plate main body is fixedly installed in the groove through a filling material, and the optical fiber bundles and the corresponding optical connectors are fixedly installed in the corresponding sub-grooves through the filling material.
5. The opto-electric hybrid circuit board according to claim 3,
the optical fiber plate main body is fixedly arranged in the groove by using filling materials, and at least part of the optical fiber bundles and the corresponding optical connectors are movably arranged in the corresponding sub-grooves.
6. The opto-electric hybrid circuit board according to claim 2,
each optical fiber bundle comprises a plurality of optical fibers and a protective layer;
wherein the protective layer encapsulates the plurality of optical fibers.
7. The opto-electric hybrid circuit board of any of claims 2-6, further comprising a second board member;
one side of the second plate and one side of the first plate, which is provided with the groove, are attached to each other, so that the optical fiber plate is arranged between the second plate and the first plate.
8. The opto-electric hybrid circuit board of claim 7,
a plurality of connecting devices are arranged on one side of the second plate, and each connecting device is used for being connected with a corresponding optical connector; and/or
The first plate is provided with a plurality of connecting devices, and each connecting device is arranged corresponding to a corresponding optical connector so as to be connected with the corresponding optical connector.
9. The opto-electric hybrid circuit board of claim 7,
the photoelectric hybrid circuit board further comprises a bonding layer;
the bonding layer is arranged between the first plate and the second plate and is used for fixedly connecting the first plate and the second plate.
10. An electronic device, characterized in that it comprises an opto-electronic hybrid circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220365766.XU CN217546396U (en) | 2022-02-22 | 2022-02-22 | Photoelectric hybrid circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220365766.XU CN217546396U (en) | 2022-02-22 | 2022-02-22 | Photoelectric hybrid circuit board and electronic device |
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| Publication Number | Publication Date |
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| CN217546396U true CN217546396U (en) | 2022-10-04 |
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| CN202220365766.XU Active CN217546396U (en) | 2022-02-22 | 2022-02-22 | Photoelectric hybrid circuit board and electronic device |
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| CN (1) | CN217546396U (en) |
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