CN209946469U - Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board - Google Patents
Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board Download PDFInfo
- Publication number
- CN209946469U CN209946469U CN201921006601.8U CN201921006601U CN209946469U CN 209946469 U CN209946469 U CN 209946469U CN 201921006601 U CN201921006601 U CN 201921006601U CN 209946469 U CN209946469 U CN 209946469U
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- circuit board
- optical
- positioning groove
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
The application discloses an optical fiber circuit board, an optical transmission device and a multilayer hybrid optical fiber circuit board, wherein the optical fiber circuit board comprises a substrate, a first circuit pattern, a second circuit pattern, at least one optical fiber and a bonding layer; wherein, the base plate is provided with a positioning groove with an opening at one side; the first circuit pattern and the second circuit pattern are respectively arranged on two opposite sides of the substrate; at least one optical fiber is arranged in the positioning groove; the bonding layer fixes the optical fiber in the positioning groove and fills the space outside the optical fiber in the positioning groove. By means of the mode, the integration level of photoelectric interconnection can be improved, the optical fiber is protected, and the reliability of the optical fiber circuit board is improved.
Description
Technical Field
The present application relates to the field of circuit board technology, and in particular, to an optical fiber circuit board, an optical transmission device, and a multilayer hybrid optical fiber circuit board.
Background
The conventional electrical interconnection faces the problems of signal delay, signal crosstalk, power consumption surge and the like at high frequency and high speed. The optical interconnection means that the signal connection between the circuit boards and the chips is realized by using light guide media (optical fibers, optical waveguides and the like), and the data transmission with low power consumption, high speed and complete signals between boards or in boards can be realized.
In the related art, the optical back plate is connected with the electrical back plate in a crossed mode through the optical fibers distributed in the flexible material, the optical back plate is attached to the electrical back plate for use in the final use process, the electrical back plate and the optical back plate are separated and need to be assembled together, and the fixed portion is abnormal in aging and affects overall performance after being used for a long time.
SUMMERY OF THE UTILITY MODEL
The application provides an optical fiber circuit board, optical transmission device and multilayer hybrid fiber circuit board, can improve the integrated level of photoelectricity interconnection, play the guard action and improve the reliability of optical fiber circuit board to the optic fibre.
The technical scheme adopted by the application is as follows: providing an optical fiber circuit board, wherein the optical fiber circuit board comprises a substrate, a first circuit pattern, a second circuit pattern, at least one optical fiber and a bonding layer; the base plate is provided with a positioning groove with one side opened; the first circuit pattern and the second circuit pattern are respectively arranged on two opposite sides of the substrate; the at least one optical fiber is arranged in the positioning groove; the bonding layer fixes the optical fiber in the positioning groove and fills the space outside the optical fiber in the positioning groove.
The technical scheme adopted by the application is as follows: there is provided an optical transmission device comprising the optical fiber circuit board as described above and an optical port provided at an end portion of the optical fiber circuit board, the optical port being used for connecting with an optical docking device for optical signal transmission.
Another technical scheme adopted by the application is as follows: provided is a hybrid fiber circuit board including: at least one circuit structure, at least one optical fiber circuit board and a connecting layer; the at least one optical fiber circuit board is stacked with the at least one circuit structure, and each optical fiber circuit board comprises a substrate, a first circuit pattern, a second circuit pattern, at least one optical fiber and a bonding layer; the base plate is provided with a positioning groove with one side opened; the first circuit pattern and the second circuit pattern are respectively arranged on two opposite sides of the substrate; the at least one optical fiber is arranged in the positioning groove; the bonding layer is filled in a space outside the optical fiber of the positioning groove; the connecting layer is arranged between the adjacent optical fiber circuit boards and/or circuit structures so as to connect the adjacent optical fiber circuit boards and/or circuit structures together.
The optical fiber circuit board comprises a substrate, a first circuit pattern, a second circuit pattern, at least one optical fiber and a bonding layer; wherein, first circuit pattern and second circuit pattern set up respectively in the relative both sides of base plate, and at least one optic fibre passes through the anchor coat and is fixed in the constant head tank on the base plate to integrate optic fibre and circuit in same circuit board, thereby improve the integrated level of photoelectricity interconnection, and can play the guard action to optic fibre, improve the reliability of optic fibre circuit board.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of an optical fiber circuit board according to the present application;
FIG. 2 is a schematic structural diagram of another embodiment of an optical fiber circuit board according to the present application;
FIG. 3 is a block diagram of an embodiment of an optical transmission apparatus according to the present application;
FIG. 4 is a schematic structural diagram of an embodiment of an optical transmission apparatus according to the present application;
FIG. 5 is a schematic structural diagram of an embodiment of a hybrid fiber circuit board according to the present application;
FIG. 6 is a schematic flow chart diagram illustrating one embodiment of a method for manufacturing an optical fiber circuit board according to the present invention;
FIG. 7 is a schematic structural diagram of an embodiment of the method for manufacturing an optical fiber circuit board according to the present application;
fig. 8 is a flowchart of step S10 in fig. 6;
fig. 9 is a flowchart of step S10 in fig. 6;
fig. 10 is a flowchart of the middle step S30.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of an embodiment of an optical fiber circuit board of the present application, and fig. 2 is a schematic structural diagram of another embodiment of the optical fiber circuit board of the present application. The optical fiber circuit board 10 in the present embodiment may be a circuit board capable of realizing photoelectric interconnection. Specifically, the optical fiber wiring board 10 includes a substrate 11, first and second circuit patterns 12 and 13, at least one optical fiber 14, and a bonding layer 15.
The substrate 11 is provided with a positioning groove 111 having an opening 112 at one side, the first circuit pattern 12 and the second circuit pattern 13 are respectively disposed at two opposite sides of the substrate 11, and the opening 112 of the positioning groove 111 faces the first circuit pattern 12 side or the second circuit pattern 13 side. At least one optical fiber 14 is fixed in the positioning groove 111 by a bonding layer 15, and the bonding layer 15 is further filled in a space outside the optical fiber 14 in the positioning groove 111.
By the mode, on one hand, the optical fiber 14 and the circuit can be integrated in the same circuit board, so that the integration level of photoelectric interconnection is improved, and the damage of the optical fiber 14 caused by the pressing of the optical fiber circuit board 10 is reduced, so that the optical fiber 14 is protected; on the other hand, the bonding layer 15 is filled in the space outside the optical fiber 14 in the positioning groove 111, so that the optical fiber 14 is firmly fixed in the positioning groove 111, the risk that the optical fiber 14 loosens and displaces in the long-term use process is reduced, and the reliability of the optical fiber circuit board 10 is improved.
The first circuit pattern 12 and the second circuit pattern 13 may be printed metal wires, and specifically may be printed copper wires.
The positioning slot 111 may be implemented by milling a slot with a corresponding cutter. Specifically, the number of the positioning grooves 111 formed in the substrate 11 may be one or more.
In one application scenario, the number of the positioning grooves 111 is one, the opening 112 of which is disposed on the side of the substrate 11 facing the first circuit pattern 12, and accordingly, the first circuit pattern 12 is provided with a through hole 121 corresponding to the opening 112, and at this time, the bonding layer 15 is further filled in the through hole 121 in addition to the space in the positioning grooves 111 except the optical fiber 14.
In another application scenario, the number of the positioning grooves 111 is multiple, at this time, the orientations of the openings 112 of different positioning grooves 111 may be the same or different, the number of the optical fibers 14 in each positioning groove 111 may be one or at least two, and the arrangement manners of the optical fibers 14 may be the same or different.
Specifically, when the number of the optical fibers 14 in the positioning groove 111 is at least two, the at least two optical fibers 14 are arranged in the positioning groove 111 in a single layer side by side, as shown in fig. 1; alternatively, the positioning grooves 111 may be stacked in multiple layers, as shown in fig. 2, which is not limited herein.
The depth of the positioning groove 111 is the dimension of the positioning groove 111 along the direction perpendicular to the plate surface of the substrate 11. In this embodiment, the depth of the positioning groove 111 may be greater than, equal to, or less than the dimension of the entire optical fibers arranged in the positioning groove 111 along the depth direction of the positioning groove 111, and when the depth of the positioning groove 111 is not less than the dimension of the entire optical fibers, the optical fibers 14 are completely embedded in the positioning groove 111 and do not protrude from the surface of the substrate 11.
The width of the positioning groove 111 is the dimension of the positioning groove 111 along the direction parallel to the plate surface of the substrate 11. In this embodiment, the difference between the width of the positioning groove 111 and the size of the entire arranged optical fibers along the width direction of the positioning groove 111 is smaller than the preset difference. The difference value can be specifically set according to the actual situation. In one application scenario, the predetermined difference is zero, i.e., the width of the positioning groove 111 is equal to the dimension of the whole optical fiber 14 along the width direction of the positioning groove 111.
It should be noted that the optical fiber assembly herein is considered to be an assembly of all the optical fibers 14 disposed in the positioning groove 111.
Specifically, the optical fiber 14 may be a high temperature optical fiber 14, for example, a coating layer capable of resisting a high temperature of 100 degrees or more is coated on the outer surface of the core of the optical fiber 14, and the material of the coating layer may be high temperature resistant acrylic acid, heat resistant silica gel, polyimide, metal, or the like; or the optical fiber may also be a common optical fiber 14, and the material of the core peripheral coating layer may be epoxy acrylate or polyacrylate, etc., which is not limited herein.
Wherein the bonding layer 15 is in a solid state in a first temperature range and/or a first pressure range and has a flow property in a second temperature range and/or a second pressure range.
In an application scenario, any temperature value in the first temperature range is not greater than any temperature value in the second temperature range, specifically, for example, at normal temperature and normal pressure, or at a temperature close to normal temperature and normal pressure, the bonding layer 15 is a solid, for example, a film-shaped adhesive material, and has certain fluidity when heated to a certain temperature and/or applied with a certain pressure, so as to be capable of filling the space inside the positioning groove 111 except for the optical fiber 14. In particular, the bonding layer 15 may be a thermoplastic material or a thermosetting material, and when the bonding layer 15 is a thermoplastic material, even if the bonding layer 15 is cured to a solid state in the first temperature range and/or the first pressure range, it will have a certain fluidity when it is again in the second temperature range and/or the second pressure range.
Specifically, the material of the bonding layer 15 can be selected according to actual requirements, and can be, for example, an epoxy resin system, an acrylic acid system, a silicone system, or the like.
In another application scenario, the bonding layer 15 is in a flowing state at or near normal temperature and pressure, and can flow and fill the space inside the positioning groove 111 except for the optical fiber 14, and can be cured into a solid state when heated or irradiated by ultraviolet light, etc., so as to fix the optical fiber 14 inside the positioning groove 111. After curing to a solid state, the bonding layer 15 can be converted into a fluid state again when heated to a certain temperature again, and an adhesive reaction occurs.
By adopting the bonding layer 15 made of the above materials, the bonding layer 15 can be in a flowing state by adopting a certain treatment mode so as to be coated on the periphery of the optical fiber 14, and is filled in the space in the positioning groove 111 except the optical fiber 14, and the air bubbles in the positioning groove 111 are discharged, so that the optical fiber 14 is more firmly fixed, the phenomena of looseness and displacement of the optical fiber 14 caused by insecure fixation are reduced, and the reliability of the optical fiber circuit board 10 is improved.
Further, in an embodiment, the optical fiber wiring board 10 may further include a first protective layer 16 disposed on the first circuit pattern 12 and the substrate 11, and a second protective layer 17 disposed on the second circuit pattern 13 and the substrate 11. Specifically, the first protective layer 16 and the second protective layer 17 may be made of the same material or different materials, and specifically, both may be a photo solder resist for protecting the first circuit pattern 12, the second circuit pattern 13, and the surface of the substrate 11.
Referring to fig. 3 and 4 together, fig. 3 is a frame diagram of an embodiment of the optical transmission device of the present application, and fig. 4 is a schematic structural diagram of the embodiment of the optical transmission device of the present application. In the present embodiment, the optical transmission device includes an optical fiber circuit board 10 and an optical port 20 connected to the optical fiber circuit board 10, wherein the optical port 20 is used for connecting to an optical interface device for optical signal transmission.
The optical fiber circuit board 10 in this embodiment is the same as the optical fiber circuit board 10 in the above-mentioned embodiment of the optical fiber circuit board 10 in this application, and for the related details, please refer to the above-mentioned embodiment, which is not described herein again.
The optical port 20 may include an optical fiber connector 21 and an optical fiber 14 extending from the substrate 11 of the optical fiber circuit board 10, the optical fiber connector 21 is provided with a positioning structure, and particularly may be disposed in an inner cavity of the optical fiber connector 21, and the optical fiber connector 21 may be configured to receive the optical fiber 14 extending from the substrate 11 of the optical fiber circuit board 10 and position the optical fiber 14 through the positioning structure.
In particular, the optical ports 20 may include single fiber connectors 211 and/or multi-fiber connectors 212, as well as optical fibers 14 extending from the substrate 11. The single-path optical fiber connector 21 is provided with a positioning structure for positioning one path of optical fiber, and is configured to receive and position one path of optical fiber 14 extending from the substrate 11. The multi-path optical fiber connector 21 is provided with a positioning structure for positioning the multi-path optical fibers, and is used for receiving and positioning the multi-path optical fibers 14 extending from the substrate 11.
In the actual manufacturing process, no matter the single-path optical fiber connector 211 or the multi-path optical fiber connector 212, the corresponding optical fiber needs to be inserted into the inner cavity of the optical fiber connector 21, then the optical fiber can be fixed by glue, the redundant optical fiber is cut off, and then the grinding and polishing are performed, so as to manufacture the optical port 20 meeting the requirements.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a hybrid fiber circuit board according to the present application. The hybrid fiber circuit board in this embodiment includes at least one circuit structure 30, at least one fiber circuit board 10, and a connection layer 40.
Wherein at least one optical fiber circuit board 10 and at least one circuit structure 30 are stacked, and the connecting layer 40 is disposed between the adjacent optical fiber circuit boards 10 and/or circuit structures 30 to connect the adjacent optical fiber circuit boards 10 and/or circuit structures 30 together.
Specifically, in the present embodiment, the hybrid optical fiber circuit board may be composed of a plurality of layers of the optical fiber circuit boards 10 connected in a stacked manner, or composed of at least one layer of the optical fiber circuit boards 10 and at least one layer of the circuit structure 30 connected in a stacked manner.
It should be noted that the optical fiber circuit board 10 in the present embodiment is the same as the optical fiber circuit board 10 in the above-mentioned embodiment of the optical fiber circuit board 10 in the present application, and for the details, reference is made to the above-mentioned embodiment, and details are not repeated here.
Specifically, the circuit structure 30 may be a third circuit pattern formed on the corresponding connection layer 40, or the circuit structure 30 may also be a circuit board having a fourth circuit pattern disposed on one side, or a circuit board having a fifth circuit pattern and a sixth circuit pattern disposed on both sides, which is not limited herein.
The material of the connection layer 40 may be the same as the material of the bonding layer 15 in the above-mentioned embodiment of the optical fiber circuit board 10 of the present application, and please refer to the above description for details, which is not described herein again.
In this embodiment, the hybrid fiber-optic circuit board may be formed by connecting the multilayer fiber-optic circuit board 10 and/or the circuit structure 30 together through the connecting layer 40 under a certain temperature or pressure, for example, by pressing under high temperature and high pressure.
Referring to fig. 6 to 10, a method for manufacturing an optical fiber circuit board 10 and a multilayer hybrid optical fiber circuit board according to the present invention will be described below by taking an example of manufacturing a hybrid optical fiber circuit board composed of two layers of optical fiber circuit boards and two layers of circuit structures which are connected in a stacked manner.
Specifically, the manufacturing method of the optical fiber wiring board 10 includes:
step S10: providing a substrate 11 with a first circuit pattern 12 and a second circuit pattern 13 respectively arranged on two sides, wherein the substrate 11 is provided with a positioning groove 111 with an opening 112 on one side;
specifically, in the present embodiment, the order of formation of the first circuit pattern 12 and the second circuit pattern 13 and formation of the positioning groove 111 is not limited.
In an application scenario, referring to fig. 8, step S10 may include:
step S11: providing a substrate 11;
step S12: a positioning groove 111 with an opening 112 at one side is formed on the substrate 11;
step S13: providing a first copper layer 18 and a second copper layer 19 on a side of the substrate 11 facing the opening 112 and a side of the substrate 11 facing away from the opening 112, respectively;
step S14: the first copper layer 18 and the second copper layer 19 are respectively subjected to etching treatment to form a first circuit pattern 12 and a second circuit pattern 13 respectively located on opposite sides of the substrate 11.
In the application scenario, a positioning groove 111 is formed in the substrate 11, the positioning groove 111 communicates with a surface of one side of the substrate 11, and then the first circuit pattern 12 and the second circuit pattern 13 are formed on two sides of the substrate 11 respectively.
In another application scenario, referring to fig. 9, step S10 may include:
step S15: providing a substrate 11;
step S16: providing a first copper layer 18 and a second copper layer 19 on opposite sides of the substrate 11, respectively;
step S17: etching the first copper layer 18 and the second copper layer 19 to obtain a first circuit pattern 12 and a second circuit pattern 13 on opposite sides of the substrate 11;
step S18: the substrate 11 is provided with a positioning groove 111, and the positioning groove 111 penetrates the substrate 11 toward one side of the first circuit pattern 12.
In this application scenario, the first circuit pattern 12 and the second circuit pattern 13 are formed on two sides of the substrate 11, and then the positioning groove 111 is further formed on the substrate 11. It should be noted that in this application scenario, the position of the positioning groove 111 on the substrate 11 is not at least partially covered by the first circuit pattern 12 or the second circuit pattern 13, so as to form the positioning groove 111.
Step S20: a first filling layer 151 is arranged in the positioning groove 111, at least one optical fiber 14 is arranged on the first filling layer 151, and a second filling layer is further arranged in the positioning groove 111 after the at least one optical fiber 14 is arranged;
the optical fibers 14 may be arranged independently, or may be pre-tapped and bonded together to form an assembly of optical fibers 14.
Step S30: the first filling layer 151 and the second filling layer are processed so that the first filling layer 151 and the second filling layer are fused with each other to coat the optical fiber 14 and are filled in the space outside the optical fiber 14 in the positioning groove 111 to form the bonding layer 15 for fixing the optical fiber 14, so as to obtain the optical fiber wiring board 10.
It is easily understood that the first filling-up layer 151 and the second filling-up layer are made of the same material as the bonding layer 15.
Specifically, referring to fig. 10, step S30 may include:
step S31: processing the first filling layer 151 and the second filling layer to make the first filling layer 151 and the second filling layer have fluidity in a first predetermined temperature range and/or a first predetermined pressure range, so that the first filling layer 151 and the second filling layer are fused with each other to coat the optical fiber 14 and are filled in a space outside the optical fiber 14 in the positioning groove 111 to form a bonding layer 15;
step S32: the bonding layer 15 is treated to make the bonding layer 15 in a second predetermined temperature range and/or a second predetermined pressure range so that the bonding layer 15 is cured to fix the optical fiber 14 in the positioning groove 111, and the optical fiber circuit board 10 is obtained.
Further, after the optical fiber circuit board 10 is formed, a hybrid circuit board may be further formed by using the optical fiber circuit board 10 and the connection layer 40, specifically, the first connection layer 40 may be laid between the first optical fiber circuit board 10a and the second optical fiber circuit board 10b after the manufacturing process is completed, so as to stack and connect the first optical fiber circuit board 10a and the second optical fiber circuit board 10b, and form the second connection layer 40 on the side of the first optical fiber circuit board 10a away from the second optical fiber circuit board 10b, further form the third circuit pattern 30a on the connection layer 40, and form the third connection layer 40 on the side of the second optical fiber circuit board 10b away from the first optical fiber circuit board 10a, further form the fourth circuit pattern 30a on the third connection layer 40, and finally form the hybrid optical fiber circuit board.
It should be noted that the above method for forming the hybrid fiber circuit board is only an example, and the order of the hybrid fiber circuit board is not limited.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (15)
1. A fiber optic circuit board, comprising:
the base plate is provided with a positioning groove with one side opened;
a first circuit pattern and a second circuit pattern respectively disposed on opposite sides of the substrate;
at least one optical fiber arranged in the positioning groove;
and the bonding layer is used for fixing the optical fiber in the positioning groove and filling the optical fiber in the positioning groove in a space outside the optical fiber.
2. The optical fiber circuit board of claim 1, wherein the number of the optical fibers is at least two, and at least two of the optical fibers are arranged in the positioning groove in a single layer side by side.
3. The optical fiber circuit board of claim 1, wherein the number of the optical fibers is at least two, and at least two of the optical fibers are stacked in multiple layers and disposed in the positioning groove.
4. The fiber circuit board of claim 1, wherein a depth of the positioning groove is not less than a dimension of the at least one optical fiber along a depth direction of the positioning groove, and a difference between a width of the positioning groove and the dimension of the at least one optical fiber along the width direction of the positioning groove is less than a preset difference.
5. The fiber optic circuit board of claim 1, wherein the width of the positioning slot is equal to a dimension of the at least one optical fiber along the width of the positioning slot.
6. The fiber optic wiring board of claim 1, wherein the first and second circuit patterns are printed metal traces.
7. The optical fiber wiring board of claim 1, wherein the opening is disposed on a side of the substrate facing the first circuit pattern, the first circuit pattern is provided with a via corresponding to the opening, and the bonding layer is further filled in the via.
8. The fiber optic circuit board of claim 1, wherein the bonding layer is in a solid state in a first temperature range and/or a first pressure range and has a fluidity in a second temperature range and/or a second pressure range, wherein any temperature value in the first temperature range is not greater than any temperature value in the second temperature range.
9. The fiber optic wiring board of claim 1, further comprising a first protective layer disposed over the first circuit pattern and the substrate, and a second protective layer disposed over the second circuit pattern and the substrate.
10. An optical transmission device comprising the fiber optic circuit board of any one of claims 1-9 and an optical port coupled to the fiber optic circuit board for connection to an optical interface for optical signal transmission.
11. The optical transmission device according to claim 10, wherein the optical port comprises an optical fiber connector and an optical fiber extending from the substrate, the optical fiber connector being provided with a positioning structure;
the optical fiber connector is used for receiving an optical fiber extending from the substrate and positioning the optical fiber through the positioning structure.
12. The optical transmission apparatus according to claim 11, wherein the optical port includes a single-fiber connector and/or a multi-fiber connector and an optical fiber extending from the substrate, the single-fiber connector is provided with a positioning structure for positioning a path of optical fiber, and is configured to receive and position a path of optical fiber extending from the substrate; the multi-path optical fiber connector is provided with a positioning structure for positioning the multi-path optical fibers and is used for receiving and positioning the multi-path optical fibers extending from the substrate.
13. A hybrid fiber optic circuit board, comprising:
at least one circuit structure;
at least one fiber optic circuit board disposed in a stacked relationship with the at least one circuit structure, each fiber optic circuit board comprising:
the base plate is provided with a positioning groove with one side opened;
a first circuit pattern and a second circuit pattern respectively disposed on opposite sides of the substrate;
at least one optical fiber arranged in the positioning groove;
the bonding layer is filled in the space outside the optical fiber of the positioning groove;
and the connecting layer is arranged between the adjacent optical fiber circuit boards and/or circuit structures so as to connect the adjacent optical fiber circuit boards and/or circuit structures together.
14. The hybrid fiber optic wiring board of claim 13, wherein the circuit structure is a third circuit pattern formed on the corresponding connection layer.
15. The hybrid fiber optic circuit board of claim 13, wherein the circuit structure is a circuit board having a fourth circuit pattern disposed on one side thereof or a circuit board having a fifth circuit pattern and a sixth circuit pattern disposed on both sides thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921006601.8U CN209946469U (en) | 2019-06-30 | 2019-06-30 | Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921006601.8U CN209946469U (en) | 2019-06-30 | 2019-06-30 | Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209946469U true CN209946469U (en) | 2020-01-14 |
Family
ID=69136203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921006601.8U Active CN209946469U (en) | 2019-06-30 | 2019-06-30 | Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209946469U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110187458A (en) * | 2019-06-30 | 2019-08-30 | 深南电路股份有限公司 | Fibre circuit plate and its manufacturing method, light transmitting device and hybrid optical fiber circuit plate |
| CN114126188A (en) * | 2020-08-28 | 2022-03-01 | 深南电路股份有限公司 | Photoelectric hybrid circuit board assembly |
-
2019
- 2019-06-30 CN CN201921006601.8U patent/CN209946469U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110187458A (en) * | 2019-06-30 | 2019-08-30 | 深南电路股份有限公司 | Fibre circuit plate and its manufacturing method, light transmitting device and hybrid optical fiber circuit plate |
| CN114126188A (en) * | 2020-08-28 | 2022-03-01 | 深南电路股份有限公司 | Photoelectric hybrid circuit board assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8882362B2 (en) | Methods for optical device including transparent member areas between core and connector insertion hole | |
| US7118293B2 (en) | Optical module and manufacturing method of the same, optical communication device, opto-electrical hybrid integrated circuit, circuit board, and electronic apparatus | |
| US8363993B2 (en) | Combined optical and electrical interconnection module and method for producing same | |
| US7389015B1 (en) | Mechanically decoupled opto-mechanical connector for flexible optical waveguides embedded and/or attached to a printed circuit board | |
| US6801693B1 (en) | Optical backplane array connector | |
| US7657136B2 (en) | Optoelectronic integrated circuit device and communications equipment using same | |
| KR20010041556A (en) | Optoelectric multichip module | |
| CN211856976U (en) | Photonic integrated circuit chip and assembly for photonic integrated circuit | |
| US8746989B2 (en) | Board to board optical interconnect using an optical interconnect assembly | |
| KR100645414B1 (en) | Optical semiconductor module and method of manufacturing the same | |
| KR20150039712A (en) | Optical fiber connector, method for manufacturing optical fiber connector, method for connecting optical fiber connector and optical fiber, and assembled body of optical fiber connector and optical fiber | |
| CN209946469U (en) | Optical fiber circuit board, optical transmission device and hybrid optical fiber circuit board | |
| US7949211B1 (en) | Modular active board subassemblies and printed wiring boards comprising the same | |
| US9274288B2 (en) | Connector for multilayered optical waveguide | |
| CN110187458A (en) | Fibre circuit plate and its manufacturing method, light transmitting device and hybrid optical fiber circuit plate | |
| WO2008147414A1 (en) | Optical ribbon and method of forming same | |
| JP6561517B2 (en) | OPTICAL WIRING COMPONENT, OPTICAL WIRING COMPONENT WITH END FACE PROTECTION MEMBER, OPTICAL WIRING COMPONENT WITH END FACE PROTECTION MEMBER AND ELECTRONIC DEVICE | |
| JP3513372B2 (en) | Optical wiring board | |
| Schröder et al. | Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards | |
| US8926194B2 (en) | Optical board having separated light circuit holding member and optical layer | |
| JP5845923B2 (en) | Optical module and manufacturing method thereof | |
| KR100901445B1 (en) | Flexible optical interconnection module coupled with connector and manufacturing method thereof | |
| KR100696210B1 (en) | Optical path change device and Electro-optical circuit board apparatus using the same | |
| KR100525223B1 (en) | An optical printed circuit board for transmitting of signals long-distance | |
| Shahid et al. | Small and efficient connector system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |