WO2018074654A1 - Package for sealing flexible circuit board and metal case - Google Patents

Package for sealing flexible circuit board and metal case Download PDF

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Publication number
WO2018074654A1
WO2018074654A1 PCT/KR2016/013524 KR2016013524W WO2018074654A1 WO 2018074654 A1 WO2018074654 A1 WO 2018074654A1 KR 2016013524 W KR2016013524 W KR 2016013524W WO 2018074654 A1 WO2018074654 A1 WO 2018074654A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
metal case
metal
package
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PCT/KR2016/013524
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French (fr)
Korean (ko)
Inventor
이학규
서준규
박수현
Original Assignee
(주)켐옵틱스
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Publication of WO2018074654A1 publication Critical patent/WO2018074654A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • the present invention relates to an optical device package for optical communication, and more particularly to a flexible circuit board that maintains the airtightness of the package case and the flexible circuit board through a simple configuration in the optical communication device using a flexible circuit board that transmits electrical signals inside and outside the package; A sealed package of a metal case.
  • the optical module package applied to various optical communication components such as an optical module transmitter and a receiver uses a small package case and is used as a flexible circuit board as a method of converting an optical signal and an electrical signal.
  • epoxy sealing in the general process method for sealing bonding of the case and the substrate causes a large amount of package cases to be disposed of due to leakage defects appearing in the process, causing a cost increase of the product, adversely affect the reliability of the optical device in the long term. .
  • flexible circuit boards having thin and free flexibility are used for implementing signal transmission lines, including flexible polyimide, polyamide, and polyester. It is manufactured by etching a metal pattern on an organic polymer type insulating film, or by printing and plating a conductive ink or paste.
  • optical communication devices have been released in the optical communication device package case according to the purpose of use and environment, with a novel design such as a laser diode, a light receiving diode, a chip integrated on a silicon substrate, and an optical system.
  • a conventional wavelength tunable laser includes a laser diode chip for an external light source butt-coupling an optical waveguide directly, a polymer optical waveguide device including a Bragg grating for wavelength variability, and an optical output of light output from the waveguide.
  • Detection thermistors are a major component. In order to guarantee the tunable laser reliability, reliable sealing packaging that protects components from the external environment such as moisture is essential, and it is a major factor in determining the price of the tunable laser.
  • such an optical communication device package may use a product capable of ultraviolet and heat curing using epoxy at a bonding part that may be leaked during the packaging process, but as mentioned above, the sealing force is weak. Many leak failures are occurring.
  • the present invention has been made to solve the above problems, and an object of the present invention is to add a third metal element to a different type of metal to be bonded at a high temperature, and then, by means of heat, the blazing technology for bonding the package has a package appearance and airtightness.
  • the metal reinforcing plate is formed on the flexible circuit board, and the board and the case are sealed by soldering it with the metal package case to prevent the low cost flexible circuit board and the metal case which are resistant to external stress. Relates to a sealed package.
  • a flexible package of a flexible printed circuit board and a metal case includes a flexible printed circuit board having pads at both ends thereof; A metal case having a through portion formed at a side surface of the flexible circuit board such that one end of the flexible circuit board is fitted and exposed to the pad; A metal reinforcing plate coupled to one end of the flexible circuit board and inserted into the through part when the flexible circuit board is fitted into the metal case; And solder cream applied to the coupling portion of the flexible circuit board and the metal case.
  • the substrate, the metal case, and the metal reinforcement plate are combined and sealed through a heat treatment process.
  • the metal reinforcing plate is coupled to the upper surface or the lower surface of the end of the flexible circuit board, is coupled to be spaced apart in a predetermined distance from the end of the substrate so that the pad is exposed, corresponding to the upper or lower surface of the flexible circuit board It is formed in size.
  • the metal reinforcing plate is formed by sequentially laminating a reinforcement plate, a copper film and a metal plate of a resin material on the upper or lower surface of the end of the flexible circuit board is pressed by heat and pressure, characterized in that the side is coated with a metal material do.
  • the metal reinforcing plate at least one or more micro holes penetrating in the thickness direction; comprises a.
  • the inner surface of the micro holes is characterized in that the coating with a metal material.
  • the inside of the metal case, and formed on the upper side and the lower side of the through portion, the support portion extending inwardly in the through direction; includes.
  • solder cream is characterized in that the lead-free or flexible component is contained.
  • the sealing coupling structure of the flexible circuit board and the metal case according to the above configuration by using a hot plate, a solder cream can significantly reduce the process cost by not requiring special equipment and materials such as a blazing process.
  • FIG. 1 is a perspective view of a flexible circuit board of the present invention
  • FIG. 2 is a perspective view of a metal case of the present invention
  • Figure 3 is a side perspective view of the metal case of the present invention
  • Figure 4 is a perspective view of the sealed package of the flexible circuit board and the metal case of the present invention
  • FIG. 5 is a plan view of a sealed package of a flexible circuit board and a metal case of the present invention.
  • Figure 6 is a perspective view of the manufacturing process of the sealed package of the flexible circuit board and the metal case of the present invention
  • FIG. 1 is a perspective view of a flexible circuit board 100 according to an embodiment of the present invention.
  • the flexible circuit board 100 may include a substrate 110, first wire bond pad regions 120 and second wire bond pad regions 130 formed at both ends of the substrate 110, and first wire bonds.
  • the first pad 121 formed at the end of the pad region 120 and the second pad 131 formed at the end of the second wirebond pad region 130 may be formed.
  • the width of the first wirebond pad region 120 and the second wirebond pad region 130 may be wider than the width of the substrate 110. Any one of the first wirebond pad region 120 and the second wirebond pad region 130 is combined with the metal case 200 to be described later.
  • the first wire bond pad region 120 is a metal case. It will be described as defined as coupled to (200).
  • the flexible printed circuit board 100 of the present invention is manufactured by patterning an insulating film and a copper conductor, and a reinforcement plate is required at the connection part for stable coupling with other media, and a polyimide insulator is generally used.
  • the metal reinforcing plate 300 may be provided on the first wire bond pad region 120 to more firmly seal the metal case 200.
  • the metal reinforcement plate 300 may be coupled to an upper surface or a lower surface of the first wire bond pad region 120.
  • the metal reinforcing plate 300 may be formed to have a size corresponding to the first wire bond pad region 120, but may be predetermined at an end of the first wire bond pad region 120 so that the first pad 121 may be exposed. The distance can be coupled inwardly.
  • the metal reinforcing plate 300 may be formed by pressing the reinforcing plate, the copper film, and the metal plate of the resin material on the upper surface or the lower surface of the first wire bond pad region 120 with high heat and high pressure. At this time, the side of the metal reinforcing plate 300 may be configured by plating the gold 310 as a metal material as an example, thereby to metallize all the front, rear, left and right sides of the metal reinforcing plate 300.
  • the thickness of the metal reinforcing plate 300 formed on the flexible circuit board 100 may be formed in consideration of the thickness of the through part 210 of the metal case 200, the flexible circuit board 100 and the metal case
  • the first wire bond pad region 120 of the flexible printed circuit board 100 should not be damaged when the 200 is coupled, and the outer area should be sufficient, but not to interfere with the flexibility of the flexible printed circuit board 100. do.
  • micro holes 320 penetrating in the thickness direction are properly disposed, and the inner surface of the micro holes 320 may also be plated with gold so that the flexible circuit board 100 and the metal case ( 200) can increase the binding force and sealing between.
  • FIG. 2 is a perspective view of a metal case 200 according to an embodiment of the present invention
  • Figure 3 is a side perspective view of the metal case 200.
  • the metal case 200 may be formed on an enclosure having a space formed therein.
  • the through part 210 is formed on the side surface of the metal case 200 so as to penetrate with the first wire bond pad region 120 of the flexible circuit board 100.
  • the through part 210 forms a through passage having an elliptical or rectangular cross section in a direction in which the first wire bond pad region 120 of the flexible circuit board 100 is coupled.
  • the cross-sectional area of the through passage may be formed in consideration of the width and the thickness of the flexible printed circuit board so that the flexible printed circuit board 100 may be inserted smoothly.
  • the support portion 220 may be supported to support the first wire bond pad region 120.
  • the support part 220 includes a first support part 221 formed on the inner side of the through part 210 in the upper direction and a second support part 222 formed on the lower side in the inner direction.
  • FIG. 4 is a perspective view of a sealed package 1000 of a flexible circuit board and a metal case according to an embodiment of the present invention
  • Figure 5 is a sealed package of a flexible circuit board and a metal case according to an embodiment of the present invention
  • a plan view of a 1000 is shown
  • FIG. 6 is a perspective view illustrating a manufacturing process of a sealed package 1000 of a flexible circuit board and a metal case according to an exemplary embodiment of the present invention.
  • the solder cream 500 is applied to the case where the flexible circuit board 100 is inserted into the metal case 200 and meets the case outer wall 201 and the flexible circuit board 100.
  • Solder cream is a creamy mixture of alloying materials such as lead (Pb), tin (Sn), silver (Ag), bismuth (Bi) and a special flux at a uniform ratio. Melting point and moisture content vary according to size and main component ratio.
  • alloying materials such as lead (Pb), tin (Sn), silver (Ag), bismuth (Bi) and a special flux at a uniform ratio. Melting point and moisture content vary according to size and main component ratio.
  • Solder cream used in the present invention uses lead-free solder cream according to the Restriction of Hazardous Substances, Restriction of the use of Hazardous Substances in EEE (ROHS).
  • the surface of the metal case 200 is brought into contact with the hot plate H to melt the solder cream 500. Will be maintained.
  • the solder cream 500 at the point where the outer wall 201 of the metal case 200 and the flexible circuit board 100 meet is deformed from a cream type to a liquid form by high temperature heat, and thus the metal case is caused by a capillary phenomenon. It is moistened along the penetrating portion 210 of the 200 and the metal reinforcing plate 300 of the flexible circuit board 100 to be soldered.
  • the metal case 200 and the flexible circuit board 100 are completely bonded by the solder cream 500.
  • the inner wall surface and the outer wall shape of the metal case 200 coupled by the solder cream 500 form the solder only up to the area where the metal reinforcing plate 300 of the flexible circuit board 100 is formed, thereby affecting the polyimide region.
  • the flux is generated in the melting process of the solder cream 500, which can be removed using an ultrasonic disperser with a solvent-based liquid sample.
  • metal case 210 through part
  • metal reinforcing plate 310 gold

Abstract

The present invention relates to an optical element package for optical communication and, more particularly, to a package for sealing a flexible circuit board and a metal case, wherein, in connection with an optical communication element that uses a flexible circuit board for delivering electric signals between inside and outside the package, airtightness of the package case and the flexible circuit board is maintained by a simple configuration.

Description

연성회로기판과 금속케이스의 밀봉 패키지Sealed package of flexible printed circuit board and metal case
본 발명은 광통신용 광소자 패키지에 관한 것으로, 특히 패키지 내외부의 전기적인 신호 전달을 하는 연성회로기판을 사용하는 광통신 소자에서 간단한 구성을 통해 패키지케이스와 연성회로기판의 기밀성을 유지하는 연성회로기판과 금속케이스의 밀봉 패키지에 관한 것이다. The present invention relates to an optical device package for optical communication, and more particularly to a flexible circuit board that maintains the airtightness of the package case and the flexible circuit board through a simple configuration in the optical communication device using a flexible circuit board that transmits electrical signals inside and outside the package; A sealed package of a metal case.
광모듈 송신기, 수신기 등 다양한 광통신부품에 적용되고 있는 광모듈 패키지는 소형 패키지 케이스를 사용하며 광신호와 전기적 신호 변환 시키는 하나의 방법으로 연성회로기판으로 사용하게 된다.The optical module package applied to various optical communication components such as an optical module transmitter and a receiver uses a small package case and is used as a flexible circuit board as a method of converting an optical signal and an electrical signal.
이때, 케이스와 기판의 밀봉 결합을 위한 일반적인 공정 방법 중 에폭시실링은 공정에서 나타나는 누출 불량으로 인하여 다량의 패키지케이스가 폐기 처분되어 제품의 원가 상승의 원인이 되고, 장기적으로 광소자 신뢰성에 악영향을 미친다.At this time, epoxy sealing in the general process method for sealing bonding of the case and the substrate causes a large amount of package cases to be disposed of due to leakage defects appearing in the process, causing a cost increase of the product, adversely affect the reliability of the optical device in the long term. .
최근, 광학기술과 패키징 기술이 점차적으로 소형화, 하이브리드 집적화하는 추세로 인하여 그 중에서 신호 전송라인 구현을 위하여 얇고 자유로운 굴곡성 가지는 연성회로기판이 사용되는데, 연성을 가지는 폴리이미드, 폴리아미드, 폴리에스테르 등의 유기고분자 형태의 절연필름에 금속패턴을 에칭하여 제조되거나, 도전성 잉크 또는 페이스트를 인쇄 및 도금 하여 제조된다. Recently, due to the trend toward miniaturization and hybrid integration of optical technology and packaging technology, flexible circuit boards having thin and free flexibility are used for implementing signal transmission lines, including flexible polyimide, polyamide, and polyester. It is manufactured by etching a metal pattern on an organic polymer type insulating film, or by printing and plating a conductive ink or paste.
일반적으로 광통신소자 패키지 케이스 내부에는 레이저다이오드, 수광다이오드, 실리콘 기판 상에 집적화된 칩, 광학계 등 기발한 설계와 함께 사용 목적 및 환경에 따라 다양한 광통신소자들이 출시되고 있다. In general, various optical communication devices have been released in the optical communication device package case according to the purpose of use and environment, with a novel design such as a laser diode, a light receiving diode, a chip integrated on a silicon substrate, and an optical system.
광통신소자 패키지의 일예로 통상의 파장가변 레이저는, 광 도파로를 직접 butt-coupling한 외광원용 레이저다이오드칩과, 파장가변을 위한 브래그 격자를 포함한 폴리머 광도파로 소자와, 도파로에서 출력되는 광의 광출력을 모니터링 하기 위한 모니터용 광검출기와, 이를 광섬유에 접속시키기 위한 렌즈와, 이들 소자의 작동온도를 외부 환경과 무관하게 설정하기 위한 열전냉각기(thermoelectric cooler) 및 열전냉각기에 일정 온도를 설정하기 위해 필요한 온도검출용 써미스터 등이 주요 구성품이다. 이러한 파장가변 레이저 신뢰성을 보장하기 위해서는 구성품들을 습기 등 외부 환경으로 보호하는 신뢰성 있는 밀봉 패키징이 필수적이며, 파장가변 레이저의 가격을 결정하는 주요 요인이다.As an example of an optical communication device package, a conventional wavelength tunable laser includes a laser diode chip for an external light source butt-coupling an optical waveguide directly, a polymer optical waveguide device including a Bragg grating for wavelength variability, and an optical output of light output from the waveguide. The temperature required to set a constant temperature in the monitor photodetector for monitoring, the lens for connecting it to the optical fiber, the thermoelectric cooler and thermoelectric cooler for setting the operating temperature of these elements irrespective of the external environment. Detection thermistors are a major component. In order to guarantee the tunable laser reliability, reliable sealing packaging that protects components from the external environment such as moisture is essential, and it is a major factor in determining the price of the tunable laser.
이러한 광통신소자 패키지는 외부환경으로부터 신뢰성을 유지하기 위해 흔히 패키지 과정 중 리크 발생의 우려가 있는 결합부에 에폭시를 사용하여 자외선 및 열 경화가 가능 제품을 이용할 수가 있으나, 위에 언급한 대로 밀봉력이 약해 다수의 누출 불량이 발생되고 있다.  In order to maintain reliability from the external environment, such an optical communication device package may use a product capable of ultraviolet and heat curing using epoxy at a bonding part that may be leaked during the packaging process, but as mentioned above, the sealing force is weak. Many leak failures are occurring.
이에 반해 방열 구조가 우수하여 열전냉각기 등 소비전력과 온도 안정성 및 밀폐성이 우수한 ceramic feedthrough를 적용하는 TO-CAN 기반의 cooled EML TOSA 가 출시되어 있으나 고가의 가격 때문에 제작 단가가 높아지는 단점이 있다.On the other hand, TO-CAN-based cooled EML TOSA, which applies ceramic feedthrough with excellent power dissipation, temperature stability and sealability such as thermoelectric cooler, has been released. However, due to the high price, manufacturing cost increases.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서 본 발명의 목적은, 고온에서 접합하고자 하는 이종의 금속에 제3의 금속원소를 추가하여 열로써 접합하는 블레이징 기술은 패키지 외관 및 기밀성이 우수하여 다양한 분야에서 적용이 가능한 점에 착안하여 연성회로기판에 금속보강판을 형성하고, 이를 금속 패키지케이스와 솔더링하는 방법으로 기판과 케이스를 밀봉하여 외부 스트레스에 강한 저가형 연성회로기판과 금속케이스의 밀봉 패키지에 관한 것이다.The present invention has been made to solve the above problems, and an object of the present invention is to add a third metal element to a different type of metal to be bonded at a high temperature, and then, by means of heat, the blazing technology for bonding the package has a package appearance and airtightness. Based on the excellent and applicable in various fields, the metal reinforcing plate is formed on the flexible circuit board, and the board and the case are sealed by soldering it with the metal package case to prevent the low cost flexible circuit board and the metal case which are resistant to external stress. Relates to a sealed package.
본 발명에 따른 연성회로기판과 금속케이스의 밀봉 패키지는, 양단에 패드가 형성되는 연성회로기판; 상기 연성회로기판의 어느 한 단부가 끼움 결합되어 상기 패드가 내부에 노출되도록 측면에 관통부가 형성된 금속케이스; 상기 연성 회로 기판의 어느 한 단부에 결합되어 연성 회로 기판이 금속케이스에 끼움 결합 시 상기 관통부에 끼워지는 금속보강판; 및 상기 연성 회로 기판과 상기 금속케이스의 결합부에 도포되는 솔더크림;을 포함하며, 열처리 과정을 통해 상기 기판, 금속케이스 및 금속보강판이 결합되어 밀봉된다.According to the present invention, a flexible package of a flexible printed circuit board and a metal case includes a flexible printed circuit board having pads at both ends thereof; A metal case having a through portion formed at a side surface of the flexible circuit board such that one end of the flexible circuit board is fitted and exposed to the pad; A metal reinforcing plate coupled to one end of the flexible circuit board and inserted into the through part when the flexible circuit board is fitted into the metal case; And solder cream applied to the coupling portion of the flexible circuit board and the metal case. The substrate, the metal case, and the metal reinforcement plate are combined and sealed through a heat treatment process.
이때, 상기 금속보강판은, 상기 연성 회로 기판의 단부의 상면 또는 하면에 결합되되, 상기 패드가 노출되도록 상기 기판의 끝단에서 일정거리 내측으로 이격 결합되며, 상기 연성 회로 기판의 상면 또는 하면에 대응되는 크기로 형성된다.In this case, the metal reinforcing plate is coupled to the upper surface or the lower surface of the end of the flexible circuit board, is coupled to be spaced apart in a predetermined distance from the end of the substrate so that the pad is exposed, corresponding to the upper or lower surface of the flexible circuit board It is formed in size.
또한, 상기 금속보강판은, 연성 회로 기판의 단부의 상면 또는 하면에 수지재의 보강판, 구리필름 및 금속판을 순차적으로 적층 후 열과 압력으로 압착하여 형성되며, 측면은 금속재질로 코팅된 것을 특징으로 한다.In addition, the metal reinforcing plate is formed by sequentially laminating a reinforcement plate, a copper film and a metal plate of a resin material on the upper or lower surface of the end of the flexible circuit board is pressed by heat and pressure, characterized in that the side is coated with a metal material do.
또한, 상기 금속보강판은, 두께 방향으로 관통되는 적어도 하나 이상의 미세홀;을 포함하여 이루어진다.In addition, the metal reinforcing plate, at least one or more micro holes penetrating in the thickness direction; comprises a.
또한, 상기 미세홀의 내면은, 금속재질로 코팅된 것을 특징으로 한다.In addition, the inner surface of the micro holes is characterized in that the coating with a metal material.
또한, 상기 금속케이스의 내부에는, 상기 관통부의 상측 및 하측에 형성되되, 관통방향 내측으로 연장 형성되는 지지부;를 포함한다.In addition, the inside of the metal case, and formed on the upper side and the lower side of the through portion, the support portion extending inwardly in the through direction; includes.
아울러, 상기 솔더크림은, 무연 또는 유연 성분이 함량된 것을 특징으로 한다.In addition, the solder cream is characterized in that the lead-free or flexible component is contained.
위와 같은 구성에 따른 연성회로기판과 금속케이스의 밀봉 결합 구조는, 핫플레이트, 솔더크림을 이용함으로써 블레이징 공정과 같은 특수 장비 및 재료를 요구 하지 않음으로 획기적으로 공정비용을 절감할 수 있다. The sealing coupling structure of the flexible circuit board and the metal case according to the above configuration, by using a hot plate, a solder cream can significantly reduce the process cost by not requiring special equipment and materials such as a blazing process.
또한, 까다로운 공정이 사라지고 작업이 용이하여 패키지 비숙련자도 쉽게 접근이 가능하므로 생산성 향상에 기여를 하며, 안정된 작업성으로 재현성 및 신뢰성 있는 밀봉 결합 기능을 수행하는 효과가 있다. In addition, the difficult process is eliminated, and the operation is easy, so that even the inexperienced package can be easily accessed, thereby contributing to productivity improvement, and having stable workability and reproducibility and reliable sealing coupling function.
도 1은 본 발명의 연성회로기판 사시도1 is a perspective view of a flexible circuit board of the present invention
도 2는 본 발명의 금속케이스 사시도2 is a perspective view of a metal case of the present invention
도 3은 본 발명의 금속케이스 측면투시도Figure 3 is a side perspective view of the metal case of the present invention
도 4는 본 발명의 연성회로기판과 금속케이스의 밀봉 패키지 사시도Figure 4 is a perspective view of the sealed package of the flexible circuit board and the metal case of the present invention
도 5는 본 발명의 연성회로기판과 금속케이스의 밀봉 패키지의 평면도5 is a plan view of a sealed package of a flexible circuit board and a metal case of the present invention;
도 6은 본 발명의 연성회로기판과 금속케이스의 밀봉 패키지의 제조공정 사시도Figure 6 is a perspective view of the manufacturing process of the sealed package of the flexible circuit board and the metal case of the present invention
이하, 상기와 같은 본 발명의 일실시예에 대하여 도면을 참조하여 상세히 설명한다.Hereinafter, an embodiment of the present invention as described above will be described in detail with reference to the accompanying drawings.
도 1에는 본 발명의 일실시 예에 따른 연성회로기판(100)의 사시도가 도시되어 있다. 1 is a perspective view of a flexible circuit board 100 according to an embodiment of the present invention.
도시된 바와 같이 연성회로기판(100)은 기판(110)과, 기판(110)의 양단부에 형성된 제1 와이어본드 패드 영역(120) 및 제2 와이어본드 패드 영역(130)과, 제1 와이어본드 패드 영역(120)의 끝단에 형성된 제1 패드(121)와, 제2 와이어본드 패드 영역(130)의 끝단에 형성된 제2 패드(131)로 구성될 수 있다. 제1 와이어본드 패드 영역(120)과 제2 와이어본드 패드 영역(130)의 폭은 기판(110)의 폭보다 넓게 형성될 수 있다. 제1 와이어본드 패드 영역(120)과 제2 와이어본드 패드 영역(130) 중 어느 하나는 후술되는 금속케이스(200)와 결합되며, 편의상 본 발명에서는 제1 와이어본드 패드 영역(120)이 금속케이스(200)에 결합되는 것으로 정의하여 설명하기로 한다. As illustrated, the flexible circuit board 100 may include a substrate 110, first wire bond pad regions 120 and second wire bond pad regions 130 formed at both ends of the substrate 110, and first wire bonds. The first pad 121 formed at the end of the pad region 120 and the second pad 131 formed at the end of the second wirebond pad region 130 may be formed. The width of the first wirebond pad region 120 and the second wirebond pad region 130 may be wider than the width of the substrate 110. Any one of the first wirebond pad region 120 and the second wirebond pad region 130 is combined with the metal case 200 to be described later. For convenience, the first wire bond pad region 120 is a metal case. It will be described as defined as coupled to (200).
본 발명의 연성회로기판(100)은 절연 필름 및 구리형 도체를 패터닝하여 제작되는데, 다른 매체와 안정적인 결합을 위하여 연결부위에 보강판이 필수적으로 요구되며, 일반적으로 폴리이미드 절연체를 사용한다.The flexible printed circuit board 100 of the present invention is manufactured by patterning an insulating film and a copper conductor, and a reinforcement plate is required at the connection part for stable coupling with other media, and a polyimide insulator is generally used.
제1 와이어본드 패드 영역(120) 상에는 금속케이스(200)와의 결합을 더욱 견고히 즉 밀봉하기 위한 금속보강판(300)이 구비될 수 있다. 금속보강판(300)은 제1 와이어본드 패드 영역(120)의 상면 또는 하면에 결합될 수 있다. 금속보강판(300)은 제1 와이어본드 패드 영역(120)에 대응되는 크기로 형성될 수 있으나, 제1 패드(121)가 노출될 수 있도록 제1 와이어본드 패드 영역(120)의 끝단에서 일정거리 내측으로 이격 결합될 수 있다. The metal reinforcing plate 300 may be provided on the first wire bond pad region 120 to more firmly seal the metal case 200. The metal reinforcement plate 300 may be coupled to an upper surface or a lower surface of the first wire bond pad region 120. The metal reinforcing plate 300 may be formed to have a size corresponding to the first wire bond pad region 120, but may be predetermined at an end of the first wire bond pad region 120 so that the first pad 121 may be exposed. The distance can be coupled inwardly.
금속보강판(300)은 제1 와이어본드 패드 영역(120)의 상면 또는 하면에 수지재의 보강판, 구리필름 및 금속판을 고열과 고압력으로 압착하여 형성할 수 있다. 이때 금속보강판(300)의 측면은 금속 재질 일예로 금(310)을 도금하여 구성될 수 있고, 이에 따라 금속보강판(300)의 상하전후좌우 모든 면을 금속화하도록 하였다. The metal reinforcing plate 300 may be formed by pressing the reinforcing plate, the copper film, and the metal plate of the resin material on the upper surface or the lower surface of the first wire bond pad region 120 with high heat and high pressure. At this time, the side of the metal reinforcing plate 300 may be configured by plating the gold 310 as a metal material as an example, thereby to metallize all the front, rear, left and right sides of the metal reinforcing plate 300.
이때, 연성회로기판(100)에 형성되는 금속보강판(300)의 두께는, 금속케이스(200)의 관통부(210) 두께를 고려하여 형성될 수 있으며, 연성회로기판(100)과 금속케이스(200)의 결합 시 연성회로기판(100)의 제1 와이어본드 패드 영역(120)이 손상되지 않을 정도로 되어야 하며, 외부 면적은 충분하게 하되 연성회로기판(100)의 연성을 방해하지 않을 정도여야 한다.At this time, the thickness of the metal reinforcing plate 300 formed on the flexible circuit board 100 may be formed in consideration of the thickness of the through part 210 of the metal case 200, the flexible circuit board 100 and the metal case The first wire bond pad region 120 of the flexible printed circuit board 100 should not be damaged when the 200 is coupled, and the outer area should be sufficient, but not to interfere with the flexibility of the flexible printed circuit board 100. do.
또한, 금속보강판(300) 상에는 두께 방향으로 관통되는 적어도 하나 이상의 미세홀(320)을 적절히 배치하고 미세홀(320)의 안쪽면 역시 금도금이 가능하게 하여 연성회로기판(100)과 금속케이스(200) 간의 결합력 및 밀봉성을 증가시킬 수 있다.In addition, on the metal reinforcing plate 300, at least one or more micro holes 320 penetrating in the thickness direction are properly disposed, and the inner surface of the micro holes 320 may also be plated with gold so that the flexible circuit board 100 and the metal case ( 200) can increase the binding force and sealing between.
도 2에는 본 발명의 일실시 예에 따른 금속케이스(200)의 사시도가 도시되어 있고, 도 3에는 금속케이스(200)의 측면투시도가 도시되어 있다. 2 is a perspective view of a metal case 200 according to an embodiment of the present invention, Figure 3 is a side perspective view of the metal case 200.
도시된 바와 같이 금속케이스(200)는 내부에 공간이 형성된 함체 상으로 이루어질 수 있다. 이때 금속케이스(200)의 측면에는 연성회로기판(100)의 제1 와이어본드 패드 영역(120)과 관통 결합되도록 관통부(210)가 형성된다. As shown in the drawing, the metal case 200 may be formed on an enclosure having a space formed therein. In this case, the through part 210 is formed on the side surface of the metal case 200 so as to penetrate with the first wire bond pad region 120 of the flexible circuit board 100.
관통부(210)는 연성회로기판(100)의 제1 와이어본드 패드 영역(120)이 결합되는 방향으로 단면이 타원형 또는 직사각형 형태의 관통 통로를 형성한다. 관통통로의 단면적은 연성회로기판(100)이 부드럽게 삽입이 되도록 연성회로기판의 폭과 두께를 고려하여 여유 있게 형성될 수 있다. The through part 210 forms a through passage having an elliptical or rectangular cross section in a direction in which the first wire bond pad region 120 of the flexible circuit board 100 is coupled. The cross-sectional area of the through passage may be formed in consideration of the width and the thickness of the flexible printed circuit board so that the flexible printed circuit board 100 may be inserted smoothly.
또한 금속케이스(200) 내부에는 제1 와이어본드 패드 영역(120)이 삽입된 후, 제1 와이어본드 패드 영역(120)이 지지 가능하도록 받침이 가능한 지지부(220)를 포함한다. 지지부(220)는 관통부(210)의 내측 방향 상측에 형성된 제1 지지부(221)와 내측 방향 하측에 형성된 제2 지지부(222)를 포함하여 구성된다. In addition, after the first wire bond pad region 120 is inserted into the metal case 200, the support portion 220 may be supported to support the first wire bond pad region 120. The support part 220 includes a first support part 221 formed on the inner side of the through part 210 in the upper direction and a second support part 222 formed on the lower side in the inner direction.
도 4에는 본 발명의 일실시 예에 따른 연성회로기판과 금속케이스의 밀봉 패키지(1000)의 사시도가 도시되어 있고, 도 5에는 본 발명의 일실시 예에 따른 연성회로기판과 금속케이스의 밀봉 패키지(1000)의 평면도가 도시되어 있고, 도 6에는 본 발명의 일실시 예에 따른 연성회로기판과 금속케이스의 밀봉 패키지(1000)의 제조공정 사시도가 도시되어 있다. 4 is a perspective view of a sealed package 1000 of a flexible circuit board and a metal case according to an embodiment of the present invention, Figure 5 is a sealed package of a flexible circuit board and a metal case according to an embodiment of the present invention A plan view of a 1000 is shown, and FIG. 6 is a perspective view illustrating a manufacturing process of a sealed package 1000 of a flexible circuit board and a metal case according to an exemplary embodiment of the present invention.
도시된 바와 같이 금속케이스(200)에 연성회로기판(100)이 삽입된 상태에서 케이스 외벽(201) 및 연성회로기판(100)과 만나는 지점에 솔더크림(500)이 적당량 도포된다.As shown in the figure, the solder cream 500 is applied to the case where the flexible circuit board 100 is inserted into the metal case 200 and meets the case outer wall 201 and the flexible circuit board 100.
솔더크림은 성분이 납(Pb), 주석(Sn),은(Ag), 비스무트(Bi) 등의 합금상태의 물질과 특수 플럭스(flux)가 균일한 비율로 이루어진 크림상태의 혼합물이며, 합금의 사이즈, 주성분률에 따라 용융점, 함습성이 달라지게 된다. Solder cream is a creamy mixture of alloying materials such as lead (Pb), tin (Sn), silver (Ag), bismuth (Bi) and a special flux at a uniform ratio. Melting point and moisture content vary according to size and main component ratio.
본 발명에 사용되는 솔더크림은 전기전자제품 유해물질 사용제한 지침(ROHS; Restriction of Hazardous Substances, Restriction of the use of Hazardous Substances in EEE)에 따라 무연솔더크림을 사용한다.Solder cream used in the present invention uses lead-free solder cream according to the Restriction of Hazardous Substances, Restriction of the use of Hazardous Substances in EEE (ROHS).
금속케이스(200), 연성회로기판(100), 솔더크림(500)이 결합된 상태에서 금속케이스(200)의 일면에 핫플레이트(H)를 맞닿게 하여 솔더크림(500)이 용융되는 온도를 유지하게 된다. While the metal case 200, the flexible circuit board 100, and the solder cream 500 are bonded to each other, the surface of the metal case 200 is brought into contact with the hot plate H to melt the solder cream 500. Will be maintained.
이 때, 금속케이스(200)의 외벽(201)과 연성회로기판(100)이 만나는 지점에 있던 솔더크림(500)은 고온의 열에 의하여 크림타입에서 액체형태로 변형이 되어 모세관현상에 따라 금속케이스(200)의 관통부(210)와 연성회로기판(100)의 금속보강판(300)을 따라 함습되어 솔더링이 된다.At this time, the solder cream 500 at the point where the outer wall 201 of the metal case 200 and the flexible circuit board 100 meet is deformed from a cream type to a liquid form by high temperature heat, and thus the metal case is caused by a capillary phenomenon. It is moistened along the penetrating portion 210 of the 200 and the metal reinforcing plate 300 of the flexible circuit board 100 to be soldered.
고온의 열을 제거 후, 충분히 열을 식히면 금속케이스(200)와 연성회로기판(100)이 솔더크림(500)에 의하여 완전히 결합이 된다.After removing the heat of high temperature, after cooling sufficiently, the metal case 200 and the flexible circuit board 100 are completely bonded by the solder cream 500.
솔더크림(500)에 의하여 결합된 금속케이스(200)의 내부벽면, 외부벽면 형태는 연성회로기판(100)의 금속보강판(300)이 형성되어 있는 면적까지만 솔더가 맺힘으로써 폴리이미드 영역에는 영향을 주지 않지만, 솔더크림(500)의 용융과정에서 플럭스가 발생됨을 확인할 수 있으며, 이는 솔벤트계열의 액상시료와 함께 초음파분산기를 사용하여 제거할 수 있다.The inner wall surface and the outer wall shape of the metal case 200 coupled by the solder cream 500 form the solder only up to the area where the metal reinforcing plate 300 of the flexible circuit board 100 is formed, thereby affecting the polyimide region. Although not given, it can be confirmed that the flux is generated in the melting process of the solder cream 500, which can be removed using an ultrasonic disperser with a solvent-based liquid sample.
본 발명의 상기한 실시 예에 한정하여 기술적 사상을 해석해서는 안 된다. 적용범위가 다양함은 물론이고, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당업자의 수준에서 다양한 변형 실시가 가능하다. 따라서 이러한 개량 및 변경은 당업자에게 자명한 것인 한 본 발명의 보호범위에 속하게 된다.The technical spirit should not be interpreted as being limited to the above embodiments of the present invention. Various modifications may be made at the level of those skilled in the art without departing from the spirit of the invention as claimed in the claims. Therefore, such improvements and modifications fall within the protection scope of the present invention as long as it will be apparent to those skilled in the art.
[부호의 설명][Description of the code]
1000 : 밀봉 패키지1000: Sealed Package
100 : 연성회로기판 110 : 기판100: flexible circuit board 110: substrate
120 : 제1 와이어본드 패드 영역 121 : 제1 패드120: first wire bond pad region 121: first pad
130 : 제2 와이어본드 패드 영역 131 : 제2 패드130: second wirebond pad region 131: second pad
200 : 금속케이스 210 : 관통부200: metal case 210: through part
220 : 지지부220: support
300 : 금속보강판 310 : 금300: metal reinforcing plate 310: gold
320 : 미세홀320: fine holes
500 : 솔더크림500: solder cream

Claims (7)

  1. 양단에 패드가 형성되는 연성 회로 기판;A flexible circuit board having pads at both ends thereof;
    상기 연성 회로 기판의 어느 한 단부가 끼움 결합되어 상기 패드가 내부에 노출되도록 측면에 관통부가 형성된 금속케이스;A metal case having a penetrating portion formed at a side surface of the flexible circuit board such that one end of the flexible circuit board is fitted and exposed to the pad;
    상기 연성 회로 기판의 어느 한 단부에 결합되어 연성 회로 기판이 금속케이스에 끼움 결합 시 상기 관통부에 끼워지는 금속보강판; 및A metal reinforcing plate coupled to one end of the flexible circuit board and inserted into the through part when the flexible circuit board is fitted into the metal case; And
    상기 연성 회로 기판과 상기 금속케이스의 결합부에 도포되는 솔더크림;을 포함하며, And a solder cream applied to a coupling portion of the flexible circuit board and the metal case.
    열처리 과정을 통해 상기 기판, 금속케이스 및 금속보강판이 결합되어 밀봉되는 연성회로기판과 금속케이스의 밀봉 패키지.The sealing package of the flexible circuit board and the metal case is bonded and sealed by the substrate, the metal case and the metal reinforcing plate through the heat treatment process.
  2. 제 1항에 있어서, The method of claim 1,
    상기 금속보강판은,The metal reinforcing plate,
    상기 연성 회로 기판의 단부의 상면 또는 하면에 결합되되, 상기 패드가 노출되도록 상기 기판의 끝단에서 일정거리 내측으로 이격 결합되며,Is coupled to the upper or lower surface of the end of the flexible circuit board, is spaced apart by a predetermined distance from the end of the substrate to expose the pad,
    상기 연성 회로 기판의 상면 또는 하면에 대응되는 크기로 형성되는, 연성회로기판과 금속케이스의 밀봉 패키지.The sealing package of the flexible circuit board and the metal case is formed in a size corresponding to the upper or lower surface of the flexible circuit board.
  3. 제 2항에 있어서,The method of claim 2,
    상기 금속보강판은, The metal reinforcing plate,
    연성 회로 기판의 단부의 상면 또는 하면에 수지재의 보강판, 구리필름 및 금속판을 순차적으로 적층 후 열과 압력으로 압착하여 형성되며, It is formed by sequentially laminating a reinforcement plate of a resin material, a copper film and a metal plate on the upper or lower surface of the end of the flexible circuit board, and then crimped with heat and pressure,
    측면은 금속재질로 코팅된 것을 특징으로 하는, 연성회로기판과 금속케이스의 밀봉 패키지.The side surface is a metal package, characterized in that the flexible package and the sealing package of the metal case.
  4. 제 2항에 있어서,The method of claim 2,
    상기 금속보강판은, The metal reinforcing plate,
    두께 방향으로 관통되는 적어도 하나 이상의 미세홀;을 포함하여 이루어지는, 연성회로기판과 금속케이스의 밀봉 패키지.Sealing package of a flexible circuit board and a metal case comprising a; at least one or more micro holes penetrating in the thickness direction.
  5. 제 4항에 있어서,The method of claim 4, wherein
    상기 미세홀의 내면은, 금속재질로 코팅된 것을 특징으로 하는, 연성회로기판과 금속케이스의 밀봉 패키지.The inner surface of the micro-holes, characterized in that the coating of a metal material, the flexible package and the sealing package of the metal case.
  6. 제 1항에 있어서,The method of claim 1,
    상기 금속케이스의 내부에는, Inside the metal case,
    상기 관통부의 상측 및 하측에 형성되되, 관통방향 내측으로 연장 형성되는 지지부;A support part formed at an upper side and a lower side of the through part and extending inwardly in the through direction;
    를 포함하는, 연성회로기판과 금속케이스의 밀봉 패키지.A sealed package of the flexible circuit board and the metal case comprising a.
  7. 제 1항에 있어서,The method of claim 1,
    상기 솔더크림은, The solder cream is,
    무연 또는 유연 성분이 함량된 것을 특징으로 하는, 연성회로기판과 금속케이스의 밀봉 패키지.A sealed package of a flexible circuit board and a metal case, characterized in that the lead-free or flexible component is contained.
PCT/KR2016/013524 2016-10-18 2016-11-23 Package for sealing flexible circuit board and metal case WO2018074654A1 (en)

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KR10-2016-0135241 2016-10-18
KR1020160135241A KR101927426B1 (en) 2016-10-18 2016-10-18 Sealed package of Flexible Printed Circuit Board and Metal Case

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