JPH03290982A - Manufacture of led display element - Google Patents
Manufacture of led display elementInfo
- Publication number
- JPH03290982A JPH03290982A JP2091729A JP9172990A JPH03290982A JP H03290982 A JPH03290982 A JP H03290982A JP 2091729 A JP2091729 A JP 2091729A JP 9172990 A JP9172990 A JP 9172990A JP H03290982 A JPH03290982 A JP H03290982A
- Authority
- JP
- Japan
- Prior art keywords
- spacer
- glass substrate
- led chip
- chip
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 125000006850 spacer group Chemical group 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000011104 metalized film Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000013466 adhesive and sealant Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ガラス製品（眼鏡、窓ガラス、ビューファイ
ンダーなど）に取付けるＬＥＤ表示素子の製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an LED display element to be attached to glass products (glasses, window glasses, viewfinders, etc.).
ガラス製品にＬＥＤ （発光ダイオード）表示素子を取
付ける場合には、ガラスの透明性を損なわないために、
基板に透明なガラス板を用いており、その−例を第２図
に示す。When attaching an LED (light emitting diode) display element to a glass product, in order not to impair the transparency of the glass,
A transparent glass plate is used as the substrate, an example of which is shown in FIG.
図中、２１はガラス基板、２２はこの基板２１上に所定
パターンとなるように形成したメタライズ膜、２３はこ
のメタライズ膜２２の所定箇所に装着したＬＥＤチップ
、２４はこのＬＥＤチップ２３と前記メタライズＩＮ！
２２を接続するＡｊワイヤー、２５は前記ＬＥＤチップ
２３とＡＩＪワイヤー２４の部分を覆っているジャンク
ションコーティング剤である。In the figure, 21 is a glass substrate, 22 is a metallized film formed on this substrate 21 in a predetermined pattern, 23 is an LED chip attached to a predetermined location of this metallized film 22, and 24 is this LED chip 23 and the metallized film. IN!
Aj wire 22 is connected to the AJ wire 22, and 25 is a junction coating agent that covers the LED chip 23 and the AIJ wire 24.
しかし、このような構造では、ＬＥＤチップ２３とメタ
ライズ膜２２の間の接続にＡｊｌワイヤー２４を用いて
いるため、熱ストレスに弱く断線の恐れがある。また、
ジャンクションコーティング剤２５を平らなガラス基板
２１上に厚くコーティングすることが難しいので、耐湿
性に劣るといった欠点がある。However, in such a structure, since the Ajl wire 24 is used for connection between the LED chip 23 and the metallized film 22, it is susceptible to thermal stress and may break. Also,
Since it is difficult to thickly coat the junction coating agent 25 on the flat glass substrate 21, there is a drawback that moisture resistance is poor.
本発明の目的は、熱ストレスに強く、かつ耐湿性に優れ
たＬＥＤ表示素子の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing an LED display element that is resistant to heat stress and has excellent moisture resistance.
本発明は、ガラス基板上に所定パターンのメタライズ膜
を形成する工程と、ガラス基板のメタライズ膜上に導電
性接着剤を塗布する工程と、導電性接着剤塗布面にＬＥ
Ｄチップをマウントする工程と、ＬＥＤチップの周囲に
スペーサーを設け、これにシール剤を被覆する工程と、
メタライズ膜上に導電性接着剤を塗布した他のガラス基
板を前記ＬＥＤチップ及びスペーサーに被せ、加圧しな
がら導電性接着剤及びシール剤を加熱硬化させる工程と
を含むことを特徴とするものである。The present invention includes a step of forming a metallized film in a predetermined pattern on a glass substrate, a step of applying a conductive adhesive on the metallized film of the glass substrate, and a step of applying a conductive adhesive to the surface coated with the conductive adhesive.
a step of mounting the D chip; a step of providing a spacer around the LED chip and coating it with a sealant;
It is characterized by including the step of covering the LED chip and spacer with another glass substrate coated with a conductive adhesive on the metallized film, and heating and curing the conductive adhesive and sealant while applying pressure. .
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
第１図（Ａ）〜（Ｆ）は本発明の一実施例を示すもので
、まず第１図（Ａ）のようにガラス基板１上に所定パタ
ーンのメタライズ膜２を形成する。FIGS. 1(A) to 1(F) show an embodiment of the present invention. First, as shown in FIG. 1(A), a metallized film 2 in a predetermined pattern is formed on a glass substrate 1.
メタライズ膜２には、ＩＴＯ，ＩＴＯ＋Ｎｉ −Ｐ。The metallized film 2 includes ITO, ITO+Ni-P.
ＩＴＯ＋Ｎｉ −Ｐ＋Ａｕなどを用いる０例えばＩＴ
Ｏ＋Ｎｉ ・Ｐ＋ＡＬＩの場合は、ガラス基板上にＩ
ＴＯパターンを形成し、その上に無電解メツキＮ ｉ
−Ｐ ０．３１ｔ ｍ 、 Ａｕ６００Ａを施す。For example, IT using ITO+Ni-P+Au etc.
In the case of O+Ni ・P+ALI, I
Form a TO pattern and electroless plating Ni
- P 0.31t m , Au600A is applied.
次に、第１図（Ｂ）のように所定の位置に導電性接着剤
（ＡＣ＋ペーストなど）３を塗布し、この塗布面上に第
１図（Ｃ）のようにＬＥＤチップ４をグイボンディング
などによりマウントする。そして、第１図（Ｄ）のよう
にＬ Ｆ、 Ｄチップ４の周囲にスペーサー５を設置す
る。スペーサー５は、ＬＥＤチップ４の厚みに対して＋
０％、−２０％の寸法精度とする。スペーサー５の周り
には、デイスペンサーを用いてエポキシ樹脂などのシー
ル剤６を塗布し、１００℃、 ３０ｍ１ｎ程度の熱処理
を行う。Next, as shown in Fig. 1(B), conductive adhesive (AC+ paste, etc.) 3 is applied to a predetermined position, and the LED chip 4 is bonded onto this applied surface as shown in Fig. 1(C). etc. to mount it. Then, as shown in FIG. 1(D), spacers 5 are installed around the LF and D chips 4. The spacer 5 is + with respect to the thickness of the LED chip 4.
The dimensional accuracy is 0% and -20%. A sealing agent 6 such as epoxy resin is applied around the spacer 5 using a dispenser, and heat treatment is performed at 100° C. and approximately 30 m1n.
この後、第１図（Ｅ）のようにメタライズ膜２′上に導
電性接着剤３′が塗布された他のガラス基板１′を前記
ＬＥＤチップ４、スペーサー５などを挟むようにガラス
基板１に重ね、第１図（Ｆ）のように２枚のガラス基板
１，１′を上下から加圧しながら導電性接着剤３．３′
及びシール剤６を加熱硬化させる。加熱温度は２００℃
、加熱時間は４ｈｒ程度とする。After this, as shown in FIG. 1(E), another glass substrate 1' having a conductive adhesive 3' applied on the metallized film 2' is placed on the glass substrate 1' so as to sandwich the LED chip 4, spacer 5, etc. The conductive adhesive 3.3' is applied while pressing the two glass substrates 1 and 1' from above and below as shown in Figure 1 (F).
And the sealant 6 is heated and cured. Heating temperature is 200℃
The heating time is about 4 hours.
上記各工程での処理が完了すると、ＬＥＤチップ４が一
対のガラス基板ｌ、１′に電気的に直接接続されるよう
に挟持され、かつ封止状態となっているＬＥＤ表示素子
が得られる。When the processing in each of the above steps is completed, an LED display element is obtained in which the LED chip 4 is sandwiched between the pair of glass substrates 1 and 1' so as to be directly electrically connected, and is in a sealed state.
なお、上記工程でＬＥＤチップのマウント工程とスペー
サーの設置・シール処理工程の順序を入替えてもよい。Note that in the above steps, the order of the LED chip mounting step and the spacer installation/sealing step may be changed.
以上のように本発明によれば、ＬＥＤチップを２枚のガ
ラス基板で挟むとともに、スペーサーで囲み、導電性接
着剤及びシール剤を加熱硬化させて封止状態とするので
、耐湿性に優れ、かつ熱ストレスに強いＬＥＤ表示素子
を得ることができる。As described above, according to the present invention, an LED chip is sandwiched between two glass substrates, surrounded by a spacer, and a conductive adhesive and a sealant are heated and cured to form a sealed state, so that it has excellent moisture resistance. Moreover, an LED display element that is resistant to thermal stress can be obtained.
第１図（Ａ）〜（Ｆ）は本発明に係るＬＥＤ表示素子の
製造方法の一実施例を示す工程説明図、第２図はＬＥＤ
表示素子の従来の楕遣例を示す断面図である。
１及び１′・・・ガラス基板
２及び２′・・・メタライズ膜
３及び３′・・・導電性接着剤
５・・・スペーサー
４・・・ＬＥＤチップ
６・・・シール剤FIGS. 1(A) to (F) are process explanatory diagrams showing one embodiment of the method for manufacturing an LED display element according to the present invention, and FIG.
FIG. 2 is a cross-sectional view showing an example of a conventional elliptical layout of a display element. 1 and 1'... Glass substrates 2 and 2'... Metallized films 3 and 3'... Conductive adhesive 5... Spacer 4... LED chip 6... Sealing agent
Claims (1)
る工程と、ガラス基板のメタライズ膜上に導電性接着剤
を塗布する工程と、導電性接着剤塗布面にＬＥＤチップ
をマウントする工程と、ＬＥＤチップの周囲にスペーサ
ーを設け、これにシール剤を被覆する工程と、メタライ
ズ膜上に導電性接着剤を塗布した他のガラス基板を前記
ＬＥＤチップ及びスペーサーに被せ、加圧しながら導電
性接着剤及びシール剤を加熱硬化させる工程とを含むこ
とを特徴とするＬＥＤ表示素子の製造方法。A step of forming a metallized film in a predetermined pattern on a glass substrate, a step of applying a conductive adhesive on the metallized film of the glass substrate, a step of mounting the LED chip on the surface coated with the conductive adhesive, and a step of mounting the LED chip on the surface coated with the conductive adhesive. A process of providing a spacer around the periphery and coating it with a sealant, and covering the LED chip and spacer with another glass substrate coated with a conductive adhesive on the metallized film, and applying the conductive adhesive and sealant while applying pressure. A method for manufacturing an LED display element, comprising the step of curing by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2091729A JPH081965B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2091729A JPH081965B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03290982A true JPH03290982A (en) | 1991-12-20 |
| JPH081965B2 JPH081965B2 (en) | 1996-01-10 |
Family
ID=14034601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2091729A Expired - Lifetime JPH081965B2 (en) | 1990-04-06 | 1990-04-06 | Method of manufacturing LED display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH081965B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100618941B1 (en) * | 2005-11-08 | 2006-09-01 | 김성규 | Transparent light emitting apparatus and manufacturing method thereof |
| JP2010535412A (en) * | 2007-08-02 | 2010-11-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
-
1990
- 1990-04-06 JP JP2091729A patent/JPH081965B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100618941B1 (en) * | 2005-11-08 | 2006-09-01 | 김성규 | Transparent light emitting apparatus and manufacturing method thereof |
| WO2007055455A1 (en) * | 2005-11-08 | 2007-05-18 | Sung Kyu Kim | Transparent light emitting apparatus and manufacturing method thereof |
| JP2010535412A (en) * | 2007-08-02 | 2010-11-18 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Optical output device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH081965B2 (en) | 1996-01-10 |
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