JPH11242562A - Low reflective resistor film touch panel and its production and substrate having transparent conductive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low reflective resistor touch panel that is manufactured at low cost and its productivity is enhanced and also to provide a production method of the touch panel. SOLUTION: This touch panel includes a touch side substrate 20 which has a transparent electrode film 2 formed on the opposite side of a phase difference plate 3 where a linear polarizing plate 4 is stacked, and display side substrate 30 which has a phase difference plate 6 formed on the opposite side of a transparent insulating substrate 7 where a transparent electrode film 11 is stacked and an electrode part 8 of a circuit that draws the electrodes out of both films 2 and 11 which form a conductive pattern. The both substrates 20 and 30 are adhered together in a placement where both films 2 and 11 are set opposite to each other. In such a constitution, the number of adhering processes is reduced and the production cost of the touch panel is also reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low-reflection type resistive touch panel, a method of manufacturing the same, and a substrate provided with a transparent conductive film. In particular, the present invention relates to a display-side substrate and a touch-side substrate which are arranged opposite to each other. The present invention relates to a low-reflection resistive touch panel and a method for manufacturing the same.

[0002]

2. Description of the Related Art Generally, a resistive touch panel is made of PE.
The structure adopts a structure in which a display-side substrate made of a transparent substrate such as a T (polyethylene terephthalate) film or a synthetic resin plate is opposed to a touch-side substrate made of a transparent substrate of the same material. Further, a transparent conductive film pattern is formed on the opposing surface side of each substrate, and further, an extraction electrode from the conductive film pattern is formed.

When such a resistive touch panel is attached to a liquid crystal display or the like and a display image is viewed, the more transparent the touch panel itself, the clearer the image is projected and the longer the use of the touch panel during long-term use. Less fatigue. Visibility is an index of the visibility of such an image, and reflection of extraneous light is one of the factors that reduce the visibility of an image.

The present inventors have provided many low-reflection type resistive touch panels in order to prevent such a decrease in visibility due to extraneous light reflection. FIG. 5 shows an example of a touch-side substrate used in this low-reflection type resistive touch panel. As the touch side substrate, a transparent insulating substrate 1 such as a transparent resin film having no or little deflection is used as a substrate, and a transparent conductive film 2 is formed on the transparent insulating substrate 1 by a thin film forming means. An unnecessary portion is removed from the transparent conductive film 2 by etching or the like to form a predetermined conductive film pattern. Further, an extraction electrode (see FIG. (Not shown). Further, a retardation plate 3 is attached to the opposite surface of the transparent insulating substrate 1 on which the transparent conductive film 2 is formed, and a linear polarizing plate 4 is further attached thereon.
The linear polarizing plate 2 is attached to the retardation plate 3 to form a circular polarizing plate 5.

A display-side substrate on which a transparent conductive film having a predetermined pattern formed on a transparent insulating substrate having no or little deflection and a member such as a silver electrode for an electrode drawing circuit from the transparent conductive film is formed. (Not shown), the touch-side substrate is arranged so that the transparent conductive films 2 face each other, and a low-reflection type resistive film having a configuration in which a retardation plate is attached to the back surface of the display-side substrate. Type touch panel was developed. By using such a low-reflection type resistive touch panel, extraneous light can be suppressed to low reflection, and a decrease in visibility can be prevented.

[0006]

As described above, in the conventional low-reflection type resistive touch panel, a touch-side substrate and a display-side substrate are provided in order to prevent reflection of extraneous light and improve the transparency of the substrate. In both cases, it was necessary to use a transparent insulating substrate having no or little polarization. However, since transparent or non-deflective transparent insulating substrates are costly, using transparent or non-deflective transparent insulating substrates for both the touch-side substrate and the display-side substrate increases the manufacturing cost. There was a problem that products could not be provided at low cost.

Further, the conventional low-reflection type resistive touch panel is different from a normal resistive touch panel in that a phase difference plate and a linear polarizer are bonded to a transparent insulating substrate on the touch-side substrate, The substrate adopts a configuration in which a phase difference plate is attached to a transparent insulating substrate.
For this reason, in addition to the normal resistive touch panel manufacturing process, it is necessary to provide many new laminating processes, resulting in a decrease in productivity and an increase in product manufacturing costs. was there.

[0008] Further, in the case where the touch panel is to be made larger with the recent increase in the size of the display screen, it is necessary to increase the size of the touch-side substrate. Therefore, the yield of the circularly polarizing plate bonded to the transparent insulating substrate is low. There is also a problem of lowering.

Accordingly, the present invention is to solve such a conventional problem, and provides a new and improved low-reflection type resistive touch panel which can improve productivity and can be produced at low cost. Another object of the present invention is to provide a method of manufacturing the same.

[0010]

According to a first aspect of the present invention, a display-side substrate and a touch-side substrate are arranged opposite to each other. The low-reflective resistive touch panel
The display-side substrate is formed by sequentially laminating a phase difference plate, a transparent insulating substrate, and a transparent conductive film on which a conductive pattern is formed from an outer side to an opposite surface side, and includes an external lead electrode on the transparent conductive film. The touch-side substrate includes a linearly polarizing plate,
A configuration is adopted in which a phase difference plate and a transparent conductive film on which a conductive pattern is formed are sequentially laminated, and an external lead electrode is provided on the transparent conductive film.

According to this structure, since the transparent insulating substrate on the touch side substrate can be removed, the transmittance is improved,
The visibility can be further improved. In addition, the touch-side substrate eliminates the need for an expensive transparent insulating substrate.
A low-reflection resistive touch panel can be provided at low cost. Conventionally, a resist film that can be cured at a temperature of 120 ° C. or higher and a transparent conductive ink that can be dried at a temperature of 120 ° C. or higher have been used. I couldn't. For this reason, the part having the circularly polarizing plate and the other part were separately manufactured and then bonded together. However, the number of steps was increased, and the occurrence of defects at the time of bonding caused an increase in manufacturing cost.

The present inventors have studied the heat resistance temperature of the circularly polarizing plate, various resist films, and transparent conductive inks, and have reached the following configuration. The conductive pattern of the transparent conductive film on the touch-side substrate is preferably formed of a resist film formed on the transparent conductive film and curable at a temperature of 100 ° C. or less. In the case where a circularly polarizing plate having poor heat resistance is used, the conductive pattern of the transparent conductive film on the touch-side substrate is changed to 100 ° C. formed on the transparent conductive film. It may be formed of a transparent conductive ink that can be dried at the following temperature. Further, the lead electrode of the transparent conductive film on the touch-side substrate is
As described in claim 4, 10 applied to a predetermined position.
Preferably, the conductive paste is formed by heat-treating a conductive paste that can be cured or dried at a temperature of 0 ° C. or lower. Further, the display-side substrate and the touch-side substrate in which the transparent conductive films are arranged to face each other are preferably bonded by an adhesive curable at a temperature of 100 ° C. or less. .

Further, according to a second aspect of the present invention, there is provided a method of manufacturing a low-reflection resistive touch panel in which a display-side substrate and a touch-side substrate are arranged opposite to each other. Provided. In this manufacturing method, the touch-side substrate includes a step of forming a transparent conductive film on a retardation plate having a linear polarizing plate laminated thereon, and a step of forming a conductive pattern on the transparent conductive film. A step of applying a resist ink that cures at a temperature of 100 ° C. or less to form the resist ink, and a step of curing the resist ink applied on the transparent conductive film at a temperature of 100 ° C. or less to form a conductive pattern on the touch-side substrate. Forming a resist film, applying a conductive paste that can be cured or dried at a temperature of 100 ° C. or less to a predetermined position of the transparent conductive film forming the conductive pattern, Forming a transparent conductive film on the touch-side substrate to form an electrode portion for drawing out a circuit by curing by a heat treatment at a temperature of 100 ° C. or less. To have.

According to this structure, the number of bonding steps can be reduced as compared with the conventional method of manufacturing a low-reflection type resistive touch panel, so that productivity is improved and a low-cost low-reflection type resistive type touch panel is used. A touch panel can be provided.

Further, according to a seventh aspect of the present invention, there is provided the above-mentioned manufacturing method, wherein the display side substrate having a transparent conductive film on which a conductive pattern is formed and an extraction electrode from the transparent conductive film is kept at 100 ° C. or less. A step of applying an adhesive that cures at a temperature of, and a touch-side substrate having a transparent conductive film on which a conductive pattern is formed and a lead electrode from the transparent conductive film and the display-side substrate, wherein the conductive films face each other. Stacking the touch-side substrate and the display substrate stacked together via the adhesive.
A step of curing the adhesive at a temperature of 0 ° C. or lower to bond the two substrates, and a step of attaching a retardation plate to the opposite side of the display-side substrate to which the touch-side substrate is bonded via the adhesive. It is preferable to further include

Further, according to a third aspect of the present invention, there is provided a substrate provided with a transparent conductive film. The conductive pattern formed on the transparent conductive film may be formed by a resist film curable at a temperature of 100 ° C. or lower, as described in claim 8, or as described in claim 9. Alternatively, it may be formed of a transparent conductive ink that can be dried at a temperature of 100 ° C. or less. The transparent conductive film may further include a lead electrode formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less.
A substrate provided with the transparent conductive film according to claim 8.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a low-reflection type resistive touch panel according to the present invention will be described below with reference to FIGS.

In the low-reflection type resistive touch panel according to the present embodiment, as shown in FIG. 1, a cross-sectional view of the touch-side substrate is provided. A circularly polarizing plate 5 laminated with a plate 3 in a bonding step is used as a base material of a touch-side substrate 20, and a transparent conductive film 2 for forming a conductive pattern is formed on the side of the phase difference plate 3 of the circularly polarizing plate 5. It is laminated. That is, the one obtained by removing the transparent insulating substrate 1 from the touch-side substrate 20 of the conventional low-reflection resistive touch panel is employed as the touch-side substrate 20 according to the present embodiment.

Hereinafter, the configuration of the low-reflection type resistive touch panel according to the present invention will be described in detail with reference to FIG. FIG. 2 is a sectional view showing the structure of a resistive touch panel in which the touch-side substrate 20 and the display-side substrate 30 are bonded.

First, the display substrate 30 has a transparent conductive substrate 11 such as an ITO film laminated on a transparent insulating substrate 7 such as a glass substrate having no or little deflection. The transparent conductive film 11 has a predetermined conductive pattern formed by etching, for example, a planar pattern (analog type), a band-like pattern (matrix type), and the like. Silver electrode 8 is arranged. In addition, the transparent conductive film 1
A retardation plate 6 is formed on the back surface of the glass substrate 7 on which the layers 1 are laminated.

Although the glass substrate 7 which is a transparent insulating substrate having no or little deflection is exemplified as the base material of the display-side substrate 30, heat resistance, mechanical properties,
As long as conditions such as transparency are satisfied, a transparent resin plate such as polycarbonate or acrylic may be used.

On the other hand, the touch-side substrate 20 includes a circularly polarizing plate 5,
That is, a transparent conductive film 2 such as an ITO film is formed on the phase difference plate 3 with the linear phase difference plate 3 attached thereto as a base material. The transparent conductive film 2 has a predetermined pattern formed by a resist film 9 curable at a temperature of 100 ° C. or less, for example, a planar pattern (analog type), a band-shaped pattern (matrix type), and the like.
In a predetermined position of the conductive pattern of the transparent conductive film 2, silver for an electrode lead-out circuit from the transparent conductive film 2 formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less. An electrode 8 is arranged.

Then, the transparent conductive films 2 and 11 are disposed so as to face each other, and the side portions of the touch-side substrate 20 and the display-side substrate 30 are bonded by an adhesive 10 which is cured at a temperature of 100 ° C. or less. It is a low-reflection resistive touch panel.

In the present embodiment, as the transparent conductive films 2 and 11 formed on the touch-side substrate 20 and the display-side substrate 30, a commonly used ITO is exemplified. Tin fluorine (FT
O), metal oxides such as zinc aluminum oxide (AZO), composite oxides, and doped metal oxides.

The silver electrode 8 has been exemplified as an electrode for an electrode lead-out circuit from the transparent conductive films 2 and 11 formed on the touch-side substrate 20 and the display-side substrate 30.
Electrodes of other metals such as gold and copper or other alloys may be used.

Next, a method for manufacturing a low-reflection type resistive touch panel according to the present invention will be described with reference to FIG.

First, the touch-side substrate 20 is formed by sputtering the circularly polarizing plate 5 on the side of the phase difference plate 3 using the circularly polarizing plate 5 on which the phase difference plate 3 and the linearly polarizing plate 4 are bonded by a predetermined bonding process. Conductive film 2 by a thin film forming means such as a CVD method, a CVD method, a vacuum deposition method, and an ion plating method.
Is formed. Unnecessary portions are removed by 100 to form a predetermined conductive pattern on the formed transparent conductive film 2.
After printing a thermosetting resist ink that can be cured at a temperature of 100 ° C or less, a thermosetting treatment is performed at a temperature of 100 ° C or less.
A resist film 9 is formed. By forming the resist film 9 on the transparent conductive film 2, a conductive pattern can be formed on the transparent conductive film 2.

In the conventional method, a transparent conductive film 2 of ITO or the like is formed on one entire surface of the transparent insulating substrate 1 by a sputtering method or the like, and then unnecessary portions are removed by wet etching to obtain a predetermined pattern. However, in the touch-side substrate 20 according to the present invention, since the transparent insulating substrate 1 is removed and the transparent conductive film 2 is formed on the circularly polarizing plate 5, the circularly polarizing plate 5 having poor chemical resistance is immersed in an etching solution. Cannot be stacked. In addition, since the circularly polarizing plate 5 has the property of being extremely weak against moisture, it cannot be subjected to wet processing. For this reason, in the present invention, a method of performing patterning by a dry process of forming a resist film 9 on unnecessary portions of the transparent conductive film 2 on the circularly polarizing plate 5 is adopted.

On the other hand, the circularly polarizing plate 5 also has a heat resistance of 1%.
Since a temperature of about 00 ° C. is the limit, when a heat-curable resist ink is used, it must be cured at a temperature of 100 ° C. or less. Therefore, as long as this temperature condition is satisfied, either a resist ink that cures by irradiation with ultraviolet light or a resist ink that cures using both heat and ultraviolet light may be used. For example, a resist ink used for a membrane switch, a keyboard, or the like can be used as a material for a resist film.

Next, a silver paste that can be cured or dried at a temperature of 100 ° C. or less is printed on a predetermined position of the conductive film pattern on the touch-side substrate 20 on which the resist film 9 is formed and the conductive film pattern is formed. And heat treatment at a temperature of 100 ° C. or less. In this way, the silver electrode 8 for an electrode lead circuit from the transparent conductive film is formed.

In the conventional method, the conductive paste printed at a predetermined position on the transparent insulating substrate 1 is dried and cured at a temperature of 120 ° C. or more. However, as described above, the circular deflecting plate 5, which is inferior in heat resistance, is heated at 120 ° C.
Since heat treatment cannot be performed at the above temperature, in the present invention, a conductive paste that is cured or dried at 100 ° C. or less is used as a material for electrodes, and the circularly polarizing plate 5 is used.
A method of forming the silver electrode 8 by subjecting the conductive paste printed thereon to a thermosetting treatment at a temperature of 100 ° C. or less was employed.

On the other hand, the display-side substrate 30 uses a glass plate 7 which is a transparent insulating substrate having no or little deflection as a base material, and is a thin film forming means such as a sputtering method, a CVD method, a vacuum deposition method, and an ion plating method. Thereby, a transparent conductive film 11 is formed. Next, the formed transparent conductive film 11 is applied to, for example, a planar pattern (analog method),
In order to form a predetermined conductive pattern such as a band-shaped pattern (matrix type), unnecessary portions are removed by etching to perform patterning. Then, a silver paste is printed on a predetermined position of the pattern and dried to form a silver electrode 8 for an electrode drawing circuit from the transparent conductive film 11. Thus, the display-side substrate 30 was manufactured.

That is, since the display-side substrate 30 uses the same display-side substrate as the conventional low-reflection type resistive touch panel, it can be manufactured by the same method.

Then, an adhesive 10 curable at a temperature of 100 ° C. or less is printed and applied to the side of the display-side substrate 30, and the touch-side substrate is stacked so that the transparent conductive films 2 and 11 face each other. I do. This stacked touch-side substrate 20
The display 10 and the display-side substrate 30 can be bonded together by curing the adhesive 10 at a temperature of 100 ° C. or lower.

As described above, even when the touch-side substrate 20 and the display substrate 30 are bonded to each other, the heat resistance of the circularly polarizing plate 5, which is the base material of the touch-side substrate 20, becomes a problem. Adhesive 10 is used, which is cured at 100 ° C. or lower.

In the present embodiment, the adhesive 10 is applied on the resist film 9 and adhered. However, as shown in FIG. Without forming the transparent conductive film 2 directly with the adhesive 10
It is also possible to adhere by using. According to this method,
Since both substrates are firmly bonded, reliability is improved.

In order to bond the touch-side substrate and the display-side substrate, it is only necessary to be able to bond at a temperature of 100 ° C. or less. Therefore, as shown in FIG. It can also be carried out by bonding using.

Finally, the phase difference plate 6 is provided on the back surface of the transparent insulating substrate 7 of the display substrate 30 on which the touch-side substrate 20 is stacked.
The low reflection type resistance film type touch panel according to the present invention can be obtained by laminating.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a low-reflection type resistive touch panel manufactured according to the above-described manufacturing method will be described below.

First, the touch substrate 20 is formed on the side of the circularly polarizing plate 5 on the side of the circularly polarizing plate 5 using the circularly polarizing plate 5 on which the retardation plate 3 and the linearly polarizing plate 4 are bonded by a predetermined bonding process. The ITO film 2 was formed by the thin film forming means. And
After the formed ITO film 2 is printed on unnecessary portions with a thermosetting resist ink curable at a temperature of 100 ° C. or less, a thermosetting treatment is performed at a temperature of 100 ° C. for 30 minutes.
By forming the resist film 9, a predetermined conductive pattern was formed on the ITO film 2.

Next, a silver paste curable at a temperature of 100 ° C. or less is printed on a predetermined position of the conductive film pattern on the touch-side substrate 20 on which the resist film 9 is formed and the conductive film pattern is formed. A heat treatment was performed at a temperature of 30 ° C. for 30 minutes to be cured, thereby forming a silver electrode 8 for an electrode lead-out circuit from the transparent conductive film 2.

On the other hand, as the display-side substrate 30, an ITO film 11 as a transparent conductive film was formed by a thin film forming means using the glass plate 7 as a transparent insulating substrate as a substrate. Next, in order to form a predetermined conductive pattern on the formed ITO film 11, unnecessary portions were removed by etching to perform patterning. Then, a silver paste was printed on a predetermined position of the conductive pattern of the ITO film 11 and dried to form a silver electrode 8 for an electrode lead-out circuit from the ITO film 11, thereby producing a display-side substrate 30.

Next, an epoxy adhesive 11 which can be cured at a temperature of 80 ° C. for 60 minutes is printed and applied to the side of the display-side substrate 30, and then the ITO films 2 and 1 are printed.
The touch-side substrates were stacked so that No. 1s faced each other. Then, the touch-side substrate 20 and the display-side substrate 30 that were stacked were subjected to a heat treatment at a temperature of 80 ° C. for 60 minutes to cure the adhesive 10.

Finally, the retardation plate 6 was bonded to the back surface of the display-side substrate 30 to obtain a low-reflection resistive touch panel.

The low-reflection type resistive touch panel manufactured by this method has improved yield and good productivity as compared with those having the conventional structure. Further, since the transparent insulating substrate 1 is not used in the touch-side substrate 20, an effect of improving image quality and transmittance is obtained.

The preferred embodiments of the low-reflection resistive touch panel and the method for manufacturing the same according to the present invention have been described with reference to the accompanying drawings. However, the present invention is not limited to such examples. It is obvious that a person skilled in the art can conceive various changes or modifications within the scope of the technical idea described in the claims, and it is obvious that the technical scope of the present invention is not limited thereto. It is understood that it belongs to.

For example, in the above embodiment, an example was described in which the transparent conductive film was formed from a resist film, but the present invention is not limited to this example. For example, when using a circularly polarizing plate that is inferior in heat resistance, after printing the transparent conductive ink on the circularly polarizing plate without using a resist film that requires thermosetting,
By drying at a temperature of 100 ° C. or less, a conductive pattern can be formed.

Further, in the above-described embodiment, the present invention has been described by taking as an example a low-reflection type resistive touch panel in which a display-side substrate and a touch-side substrate are arranged opposite to each other. It is not limited to the example. The present invention can be applied to all uses for forming a transparent conductive film on a transparent substrate. In this case, similarly to the above embodiment, the conductive pattern of the transparent conductive film is cured at 100 ° C. or less. A lead electrode can be formed by forming a resist film or a transparent conductive ink that is dried at a temperature of 100 ° C. or less and then heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less.

[0049]

As is apparent from the above description, according to the present invention, a touch panel and a display-side substrate having a transparent conductive film forming a conductive pattern and an electrode portion for an electrode drawing circuit from the transparent conductive film are provided. In a low-reflection type resistive touch panel in which a transparent substrate and a side substrate are disposed so as to face each other and bonded to each other, a transparent conductive film is formed on a surface opposite to a phase difference plate in which linearly polarizing plates are laminated. The structure consists of a touch-side substrate and a display-side substrate with a phase difference plate formed on the opposite side of the transparent insulating substrate on which the transparent conductive film is laminated, so one expensive transparent insulating substrate is omitted. As a result, production costs could be reduced. In addition, as much as the light incident from the display equipped with the touch panel does not pass through the transparent insulating substrate,
The transmittance of the touch-side substrate was improved, and good image quality was obtained.

Further, in the present invention, the display-side substrate and the touch-side substrate having a transparent conductive film forming a conductive pattern and an electrode portion for an electrode lead-out circuit from the transparent conductive film are formed by the transparent conductive film. Forming a transparent conductive film on a retardation plate having a linear polarizing plate laminated thereon, wherein the conductive film is formed on the transparent conductive film. Applying a resist ink that cures at a temperature of 100 ° C. or less to form a pattern, and curing the resist ink applied on the transparent conductive film at a temperature of 100 ° C. or less to form a conductive pattern on the touch-side substrate Forming a resist film for curing, and curing or drying at a predetermined temperature of 100 ° C. or less at a predetermined position of the transparent conductive film forming the conductive pattern. A configuration including a step of applying an electric paste and a step of curing the applied conductive paste by a heat treatment at a temperature of 100 ° C. or less to form an electrode portion for drawing out a circuit of the transparent conductive film on the touch-side substrate is adopted. Therefore, the step of bonding the circularly polarizing plate and the transparent insulating substrate can be omitted, so that the effects of improving productivity and yield can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of a touch-side substrate of a low-reflection type resistive touch panel to which the present invention is applied.

FIG. 2 is a cross-sectional view showing a structure of a low-reflection type resistive touch panel to which the present invention is applied.

FIG. 3 is a cross-sectional view showing a structure of a low-reflection type resistive touch panel in which a substrate is bonded at a portion where a resist film is not formed.

FIG. 4 is a cross-sectional view showing the structure of a low-reflection resistive touch panel in which a substrate is adhered with a double-sided tape.

FIG. 5 is a cross-sectional view showing a configuration of a touch-side substrate of a conventional low-reflection type resistive touch panel.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 transparent insulating substrate 2 transparent conductive film 3 retarder 4 linear polarizer 5 circular polarizer 6 retarder 7 glass plate (transparent insulating substrate) 8 silver electrode 9 resist film 10 adhesive 11 transparent conductive film 12 double-sided tape 20 touch Side substrate 30 Display side substrate

Claims (10)

[Claims] 1. A low-reflection resistive touch panel in which a display-side substrate and a touch-side substrate are arranged opposite to each other, wherein the display-side substrate has a phase difference plate, a transparent insulating substrate, , A transparent conductive film on which a conductive pattern is formed, and an external lead-out electrode provided on the transparent conductive film. The touch-side substrate has a linearly polarizing plate, A low-reflection type resistive touch panel, comprising: a phase difference plate; and a transparent conductive film having a conductive pattern formed thereon are sequentially laminated, and an external lead electrode is provided on the transparent conductive film. 2. The method according to claim 1, wherein the conductive pattern of the transparent conductive film on the touch-side substrate is formed of a resist film formed on the transparent conductive film and curable at a temperature of 100 ° C. or less. 2. The low-reflection resistive touch panel according to 1. 3. The method according to claim 1, wherein the conductive pattern of the transparent conductive film on the touch-side substrate is formed of a transparent conductive ink formed on the transparent conductive film and dried at a temperature of 100 ° C. or less. Item 2. A low-reflection resistive touch panel according to item 1. 4. The lead electrode of the transparent conductive film of the touch-side substrate is formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less and applied at a predetermined position. Claim 1,
4. The low-reflection resistive touch panel according to any one of 2 and 3. 5. The display-side substrate and the touch-side substrate on which the transparent conductive film is disposed so as to face each other are bonded by an adhesive curable at a temperature of 100 ° C. or less. 5. The low-reflection type resistive touch panel according to any one of claims 2, 3, and 4. 6. A method for manufacturing a low-reflection type resistive touch panel in which a display-side substrate and a touch-side substrate are arranged to face each other, wherein the touch-side substrate is a phase difference plate in which linear polarizing plates are laminated. A step of forming a transparent conductive film, and 100 ° C. for forming a conductive pattern on the transparent conductive film.
Applying a resist ink that cures at the following temperature;
A step of forming a resist film for forming a conductive pattern on the touch-side substrate by curing at a temperature of 0 ° C. or lower, and a step of forming a resist film at a predetermined position of the transparent conductive film forming the conductive pattern at a temperature of 100 ° C. or lower. Applying a conductive paste which can be cured or dried;
A step of hardening by a heat treatment at a temperature of 0 ° C. or less to form an electrode portion for drawing out a circuit of the transparent conductive film of the touch-side substrate. Production method. 7. A step of applying an adhesive curable at a temperature of 100 ° C. or less to a side portion of a display-side substrate having a transparent conductive film on which a conductive pattern is formed and an extraction electrode from the transparent conductive film; Stacking a touch-side substrate having a pattern-formed transparent conductive film and a lead-out electrode from the transparent conductive film and the display-side substrate such that the conductive films face each other; Curing the adhesive at a temperature of 100 ° C. or less to bond the touch-side substrate and the display substrate, which are stacked one on another, and bonding the two substrates together, and the touch-side substrate is bonded via the adhesive. 7. The method of claim 6, further comprising: attaching a phase difference plate to the opposite surface of the display-side substrate. 8. A substrate provided with a transparent conductive film, wherein the transparent conductive film has a conductive pattern formed of a resist film curable at a temperature of 100 ° C. or less. A substrate provided with a conductive film. 9. A substrate having a transparent conductive film, wherein the transparent conductive film has a conductive pattern formed of a transparent conductive ink that can be dried at a temperature of 100 ° C. or less. A substrate provided with a transparent conductive film. 10. The method according to claim 8, wherein the transparent conductive film has an extraction electrode formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less. A substrate provided with the transparent conductive film according to the above.