JP4577734B2 - Low reflective resistive touch panel and method for manufacturing the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a low-reflection resistive touch panel, a manufacturing method thereof, and a substrate provided with a transparent conductive film, and in particular, a low-reflective resistive touch panel in which a display-side substrate and a touch-side substrate are arranged to face each other. And a manufacturing method thereof.
[0002]
[Prior art]
In general, a resistive touch panel adopts a structure in which a display side substrate made of a transparent substrate such as a PET (polyethylene terephthalate) film or a synthetic resin plate and a touch side substrate made of a transparent substrate of the same material are opposed to each other. ing. A transparent conductive film pattern is formed on the opposite surface side of each substrate, and lead electrodes are formed from the conductive film pattern.
[0003]
When such a resistive touch panel is attached to a liquid crystal display or the like and the display image is viewed, the better the transparency of the touch panel itself, the clearer the image is displayed and the less the eye fatigue during prolonged use. . The visibility of such an image is visibility, and one of the factors that reduce the visibility of the image is reflection of extraneous light.
[0004]
The present inventors have provided a number of low-reflection resistive touch panels in order to prevent such visibility degradation due to external light reflection. An example of the touch side substrate used in this low reflection type resistive touch panel is shown in FIG. As the touch-side substrate, a transparent insulating substrate 1 such as a transparent resin film having little or no deflection is used as a substrate, and a transparent conductive film 2 is formed on the transparent insulating substrate 1 by a thin film forming means. Unnecessary portions are removed by etching or the like on the transparent conductive film 2 to form a predetermined conductive film pattern. Further, an extraction electrode (see FIG. (Not shown) is formed. A phase difference plate 3 is attached to the opposite surface of the transparent insulating substrate 1 on which the transparent conductive film 2 is formed, and a linear polarizing plate 4 is further attached thereon. A circularly polarizing plate 5 is formed by attaching the linearly polarizing plate 2 to the retardation plate 3.
[0005]
Then, a display-side substrate (not shown) on which a member such as a transparent conductive film having a predetermined pattern formed on a transparent insulating substrate with little or no deflection and a silver electrode for an electrode extraction circuit from the transparent conductive film is formed. A low-reflection resistive touch panel having a configuration in which the touch-side substrate is disposed so that the transparent conductive films 2 face each other, and a retardation plate is attached to the back surface of the display-side substrate. developed. By using such a low reflection type resistance film type touch panel, extraneous light can be suppressed to low reflection, and deterioration in visibility can be prevented.
[0006]
[Problems to be solved by the invention]
As described above, in the conventional low-reflection resistive touch panel, both the touch-side substrate and the display-side substrate have little or no polarization in order to prevent reflection of extraneous light and improve the transparency of the substrate. It was necessary to use a transparent insulating substrate. However, the cost of this transparent insulating substrate with little or no deflection is high, so the use of transparent insulating substrates with no or little deflection on both the touch side substrate and the display side substrate increases the manufacturing cost. There was a problem that the product could not be provided at low cost.
[0007]
Furthermore, unlike conventional resistive touch panels, the conventional low-reflection resistive touch panel has a phase difference plate and a linear polarizing plate attached to a transparent insulating substrate on the touch side substrate, and a display side substrate. , Adopting a structure in which a retardation plate is bonded to a transparent insulating substrate. For this reason, it is necessary to provide a lot of new bonding processes in addition to the normal resistance film type touch panel manufacturing process, resulting in a decrease in productivity and an increase in product manufacturing costs. was there.
[0008]
In addition, when the size of the touch panel is increased with the recent increase in the size of the display screen, it is necessary to increase the size of the touch side substrate. There is also the problem of end.
[0009]
Therefore, the present invention solves such a conventional problem, and is a new and improved low-reflection resistive touch panel that can improve productivity and can be produced at low cost. The object is to provide a manufacturing method.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problem, according to a first aspect of the present invention, in a low-reflection resistive touch panel in which a display-side substrate and a touch-side substrate are arranged to face each other, the display-side substrate is arranged outside. A phase difference plate, a transparent insulating substrate, and a transparent conductive film on which a conductive pattern is formed, which are sequentially laminated from the surface to the opposing surface side, and an external lead electrode is provided on the transparent conductive film, and the touch side substrate Is formed by sequentially laminating a linearly polarizing plate, a retardation plate, and a transparent conductive film on which a conductive pattern is formed from the outer side to the opposite surface side, and an external lead electrode is provided on the transparent conductive film. conductive pattern of the transparent conductive film of the touch side substrate is curable at a temperature of 100 ° C. or less to the unnecessary parts to form a predetermined conductor pattern on the transparent conductive film resist film It is constructed by forming.
[0011]
According to this configuration, since the transparent insulating substrate on the touch side substrate can be removed, the transmittance is improved and the visibility can be further improved. In addition, since the touch-side substrate does not use an expensive transparent insulating substrate, a low-reflection resistive touch panel can be provided at a low cost.
In addition, conventionally, a resist film that can be cured at a temperature of 120 ° C. or higher and a transparent conductive ink that can be dried at a temperature of 120 ° C. or higher are used. I couldn't.
For this reason, the part having the circularly polarizing plate and the other part were separately fabricated and then pasted together. However, this increased manufacturing costs due to the increased number of processes and the occurrence of defects during pasting.
[0012]
Therefore, as a result of studying the heat resistance temperature of the circularly polarizing plate, various resist films, and transparent conductive ink, the present inventors have reached the following configuration.
The conductive pattern of the transparent conductive film of the touch side substrate is formed of a resist film that is formed on the transparent conductive film and can be cured at a temperature of 100 ° C. or lower . Incidentally, in the case such as using a circularly polarizing plate having low heat resistance, the conductive pattern of the transparent conductive film of the touch side substrate may be formed by dryable transparent conductive ink 100 ° C. or lower. Furthermore, it is preferable that the lead electrode of the transparent conductive film of the touch side substrate is formed by heat-treating a conductive paste applied at a predetermined position and cured or dried at a temperature of 100 ° C. or lower. Furthermore, it arranged display side substrate and the touch side substrate so that the transparent conductive film is facing, it is preferable to adhere by an adhesive which can be cured at 100 ° C. or lower.
[0013]
Furthermore, in order to solve the above-described problem, according to a second aspect of the present invention, there is provided a method for manufacturing a low-reflection resistive touch panel in which a display-side substrate and a touch-side substrate are arranged to face each other. . In this manufacturing method, the touch-side substrate includes a step of forming a transparent conductive film on a retardation plate on which linearly polarizing plates are laminated, and an unnecessary part for forming a predetermined conductive pattern on the transparent conductive film. And a step of applying a thermosetting resist ink that can be cured at a temperature of 100 ° C. or less, and curing the resist ink applied on the transparent conductive film at a temperature of 100 ° C. or less to form a conductive pattern on the touch side substrate. Forming a resist film, applying a conductive paste that can be cured or dried at a temperature of 100 ° C. or lower to a predetermined position of the transparent conductive film forming the conductive pattern, and applying the applied conductive paste And a step of forming a circuit lead-out electrode portion of the transparent conductive film of the touch side substrate by curing the substrate by a heat treatment at a temperature of 100 ° C. or lower. It is.
[0014]
According to this configuration, the pasting process can be reduced as compared with the conventional method of manufacturing a low-reflection resistive touch panel, so that productivity is improved and a low-cost low-reflective resistive touch panel is provided. can do.
[0015]
Furthermore , the manufacturing method includes a step of applying an adhesive that cures at a temperature of 100 ° C. or less to a side portion of a display-side substrate having a transparent conductive film on which a conductive pattern is formed and an extraction electrode from the transparent conductive film; A step of stacking a touch-side substrate having a transparent conductive film on which a conductive pattern is formed and an extraction electrode from the transparent conductive film and the display-side substrate so that the conductive films face each other, and the adhesive A step of curing the adhesive at a temperature of 100 ° C. or less to bond the two substrates, and the touch side substrate is bonded via the adhesive; And a step of attaching a retardation plate to the opposite surface of the display-side substrate.
[0016]
Furthermore, according to the 3rd viewpoint of this invention, the board | substrate provided with the transparent conductive film is provided. Then, a conductive pattern formed on the transparent conductive film may be formed by curable resist film at 100 ° C. or less of the temperature or, formed by dryable transparent conductive ink 100 ° C. below the temperature May be. Then, the transparent conductive film, and a lead-out electrode which is formed by heat-treating cured or dryable conductive paste 100 ° C. or lower.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a low reflection type resistive touch panel according to the present invention will be described with reference to FIGS.
[0018]
In the low reflection type resistive touch panel according to the present embodiment, as shown in a cross-sectional view of the touch side substrate in FIG. 1, the touch side substrate 20 according to the present invention includes a linear polarizing plate 4, a retardation plate 3, and the like. Is used as the base material of the touch-side substrate 20, and the transparent conductive film 2 for forming a conductive pattern is laminated on the phase difference plate 3 side of the circularly polarizing plate 5. Yes. That is, a conventional low-reflection resistive touch panel touch-side substrate 20 obtained by removing the transparent insulating substrate 1 is used as the touch-side substrate 20 according to the present embodiment.
[0019]
Below, based on FIG. 2, the structure of the low reflection type resistive film type touch panel concerning this invention is demonstrated in detail. FIG. 2 is a cross-sectional view showing the structure of a resistive touch panel in which the touch-side substrate 20 and the display-side substrate 30 are bonded.
[0020]
First, the display substrate 30 is formed by laminating a transparent conductive film 11 such as an ITO film with a transparent insulating substrate 7 such as a glass substrate having little or no deflectability as a base material.
The transparent conductive film 11 is formed with a predetermined conductive pattern formed by etching, for example, a planar pattern (analog type), a band-like pattern (matrix type), and the like. A silver electrode 8 is disposed. A retardation film 6 is formed on the back surface of the glass substrate 7 on which the transparent conductive film 11 is laminated.
[0021]
Although the glass substrate 7 which is a transparent insulating substrate with little or no deflection is illustrated as a base material of the display side substrate 30, the conditions such as heat resistance, mechanical properties and transparency are satisfied. For example, a transparent resin plate such as polycarbonate or acrylic may be used.
[0022]
On the other hand, the touch-side substrate 20 has a circularly polarizing plate 5, that is, a retardation plate 3 with a linearly polarizing plate 4 attached thereto as a base material, and a transparent conductive film 2 such as an ITO film is formed on the retardation plate 3. Yes. The transparent conductive film 2 has a predetermined pattern formed by a resist film 9 curable at a temperature of 100 ° C. or lower, for example, a planar pattern (analog type), a strip pattern (matrix type), or the like. Then, at a predetermined position of the conductive pattern of the transparent conductive film 2, silver for electrode lead-out circuit from the transparent conductive film 2 formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or less. An electrode 8 is disposed.
[0023]
Then, the transparent conductive films 2 and 11 are disposed so as to face each other, and the touch-side substrate 20 and the side portion of the display-side substrate 30 are bonded by an adhesive 10 that cures at a temperature of 100 ° C. or less. Resistive touch panel.
[0024]
In the present embodiment, ITO that is generally used is exemplified as the transparent conductive films 2 and 11 formed on the touch-side substrate 20 and the display-side substrate 30, but other examples include tin dioxide fluorine ( FTO), zinc aluminum oxide (AZO), and other metal oxides, composite oxides, doping metal oxides, and the like can also be used.
[0025]
Further, the silver electrode 8 is exemplified as the electrode for the electrode lead-out circuit from the transparent conductive films 2 and 11 formed on the touch side substrate 20 and the display side substrate 30, but other metals such as gold and copper, and other alloys are exemplified. It may be an electrode.
[0026]
Next, based on FIG. 2, the manufacturing method of the low reflection type resistive touch panel according to the present invention will be described.
[0027]
First, the touch-side substrate 20 uses the circularly polarizing plate 5 in which the retardation plate 3 and the linearly polarizing plate 4 are bonded by a predetermined bonding process as a substrate, and the sputtering method or CVD is applied to the retardation plate 3 side of the circularly polarizing plate 5. The transparent conductive film 2 is formed by a thin film forming means such as a method, a vacuum evaporation method, or an ion plating method. And after printing the thermosetting resist ink which can harden | cure an unnecessary part at the temperature of 100 degrees C or less so that a predetermined conductive pattern may be formed on the formed transparent conductive film 2, the temperature of 100 degrees C or less is printed. Then, a thermosetting process is performed to form a resist film 9. By forming the resist film 9 on the transparent conductive film 2, a conductive pattern can be formed on the transparent conductive film 2.
[0028]
In the conventional method, the transparent conductive film 2 such as ITO is formed on the entire surface of the transparent insulating substrate 1 by sputtering or the like, and then unnecessary portions are removed by wet etching to obtain a predetermined pattern. However, since the touch-side substrate 20 according to the present invention removes the transparent insulating substrate 1 and forms the transparent conductive film 2 on the circularly polarizing plate 5, the circularly polarizing plate 5 having poor chemical resistance is immersed in an etching solution. It cannot be stacked. Further, since this circularly polarizing plate 5 has the property of being extremely weak against moisture, it cannot be wet-processed. For this reason, in this invention, the method of patterning by the dry process which forms the resist film 9 in the unnecessary part of the transparent conductive film 2 on the circularly-polarizing plate 5 was employ | adopted.
[0029]
On the other hand, the circularly polarizing plate 5 has a limit of about 100 ° C. in terms of heat resistance. Therefore, when using a thermosetting resist ink, the circularly polarizing plate 5 is required to be cured at a temperature of 100 ° C. or less. Therefore, as long as this temperature condition is satisfied, either a resist ink that is cured by ultraviolet irradiation or a resist ink that is cured by using both heat and ultraviolet rays may be used. For example, a resist ink used for a membrane switch, a keyboard, or the like can be used as a resist film material.
[0030]
Next, a silver paste that can be cured or dried at a temperature of 100 ° C. or lower is printed at a predetermined position of the conductive film pattern on the touch-side substrate 20 on which the resist film 9 is formed and the conductive film pattern is formed. The resin is cured by heat treatment at the following temperature. In this way, the silver electrode 8 for the electrode extraction circuit is formed from the transparent conductive film.
[0031]
In the conventional method, the conductive paste printed at a predetermined position on the transparent insulating substrate 1 is dried and cured at a temperature of 120 ° C. or higher. However, as described above, since the circular deflection plate 5 having poor heat resistance cannot be heat-treated at a temperature of 120 ° C. or higher, in the present invention, a conductive paste that is cured or dried at 100 ° C. or lower is used as an electrode. A method of forming the silver electrode 8 by adopting a thermosetting treatment of the conductive paste printed on the circularly polarizing plate 5 at a temperature of 100 ° C. or lower was adopted.
[0032]
On the other hand, the display side substrate 30 uses a glass plate 7 which is a transparent insulating substrate with little or no deflection as a base material, and is transparent by thin film forming means such as sputtering, CVD, vacuum deposition, ion plating, etc. A conductive film 11 is formed. Next, in order to form a predetermined conductive pattern such as a planar pattern (analog type) or a band-like pattern (matrix type), for example, an unnecessary portion is removed by etching to pattern the formed transparent conductive film 11. Do it. Then, a silver paste is printed at a predetermined position of the pattern and dried to form a silver electrode 8 for an electrode extraction circuit from the transparent conductive film 11. Thus, the display side substrate 30 was produced.
[0033]
That is, the display-side substrate 30 can be manufactured by the same method because the display-side substrate similar to the conventional low-reflection resistive touch panel is used.
[0034]
Then, after the adhesive 10 that can be cured at 100 ° C. or lower is printed and applied to the side of the display-side substrate 30, the touch-side substrate is stacked so that the transparent conductive films 2 and 11 face each other. The stacked touch-side substrate 20 and display-side substrate 30 can be bonded together by curing the adhesive 10 at a temperature of 100 ° C. or lower.
[0035]
As described above, even when the touch-side substrate 20 and the display substrate 30 are bonded, the heat resistance of the circularly polarizing plate 5 which is the base material of the touch-side substrate 20 becomes a problem, and therefore, it is cured at a temperature of 100 ° C. Adhesive 10 is employed and heat treatment is performed at a temperature of 100 ° C. or lower.
[0036]
In this embodiment, the adhesive 10 is applied and bonded onto the resist film 9, but as shown in FIG. 3, the resist film 9 is not formed on the portion to be bonded to the touch side substrate 20. In addition, the transparent conductive film 2 can be directly bonded with the adhesive 10. According to this method, since both the substrates are firmly bonded, the reliability is improved.
[0037]
In order to bond the touch-side substrate and the display-side substrate, it is only necessary to be able to bond at a temperature of 100 ° C. or lower. Therefore, as shown in FIG. It can also be carried out by bonding them together.
[0038]
Finally, by sticking the retardation film 6 to the back surface of the transparent insulating substrate 7 of the display substrate 30 on which the touch-side substrate 20 is stacked, the low reflection resistance touch panel according to the present invention can be obtained.
[0039]
【Example】
Hereinafter, examples of the low reflection type resistive touch panel manufactured based on the manufacturing method described above will be described.
[0040]
First, the touch substrate 20 is a thin film forming means on the side of the phase difference plate 3 of the circularly polarizing plate 5 using the circularly polarizing plate 5 having the phase difference plate 3 and the linear polarizing plate 4 bonded by a predetermined bonding process as a base material. Then, an ITO film 2 was formed. The formed ITO film 2 is printed with a thermosetting resist ink that can be cured at a temperature of 100 ° C. or lower on an unnecessary portion, and then subjected to a thermosetting treatment at a temperature of 100 ° C. for 30 minutes to obtain a resist. A predetermined conductive pattern was formed on the ITO film 2 by forming the film 9.
[0041]
Next, a silver paste that can be cured at a temperature of 100 ° C. or lower is printed at a predetermined position of the conductive film pattern on the touch-side substrate 20 on which the resist film 9 is formed and the conductive film pattern is formed. The silver electrode 8 for the electrode lead-out circuit from the transparent conductive film 2 was formed by performing a heat treatment for 30 minutes.
[0042]
On the other hand, the display side substrate 30 was formed by forming an ITO film 11 as a transparent conductive film by a thin film forming means using the glass plate 7 as a transparent insulating substrate as a substrate. Next, in order to form a predetermined conductive pattern, the formed ITO film 11 was patterned by removing unnecessary portions by etching. Then, a silver paste 8 was printed on a predetermined position of the conductive pattern of the IT0 film 11 and dried to form a silver electrode 8 for an electrode extraction circuit from the ITO film 11, and the display side substrate 30 was produced.
[0043]
Next, an epoxy-based adhesive 11 that can be cured at a temperature of 80 ° C. for 60 minutes is printed on the side of the display-side substrate 30 and then the ITO films 2 and 11 are opposed to each other. The touch side substrate was stacked. The stacked touch-side substrate 20 and display-side substrate 30 were heat-treated at 80 ° C. for 60 minutes to cure the adhesive 10.
[0044]
Finally, the phase difference plate 6 was bonded to the back surface of the display side substrate 30 to obtain a low reflection type resistance film type touch panel.
[0045]
The low-reflection resistive touch panel manufactured by this method has improved yield and productivity compared to the conventional touch panel. In addition, since the touch-side substrate 20 does not use the transparent insulating substrate 1, an effect of improving the image quality and the transmittance can be obtained.
[0046]
The preferred embodiments of the low-reflection resistive touch panel configured according to the present invention and the manufacturing method thereof have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the technical idea described in the claims. It is understood that it belongs to.
[0047]
For example, in the above embodiment, an example in which the transparent conductive film is formed of a resist film has been shown, but the present invention is not limited to such an example. For example, when using a circularly polarizing plate with poor heat resistance, a transparent conductive ink is printed on the circular deflecting plate without using a resist film that requires thermosetting, and then dried at a temperature of 100 ° C. or lower. It is also possible to form a conductive pattern.
[0048]
Further, in the above-described embodiment, the present invention has been described by taking the low reflection type resistive touch panel in which the display side substrate and the touch side substrate are arranged to face each other as an example. However, the present invention is limited to such an example. Not. The present invention can be applied to all uses for forming a transparent conductive film on a transparent substrate, and in that case as well, the conductive pattern of the transparent conductive film is cured at 100 ° C. or lower as in the above embodiment. The lead electrode can be formed by heat-treating a conductive paste that can be cured or dried at a temperature of 100 ° C. or lower, after being formed of a resist film or a transparent conductive ink that is dried at 100 ° C. or lower.
[0049]
【The invention's effect】
As is clear from the above description, in the present invention, the display side substrate and the touch side substrate having the transparent conductive film forming the conductive pattern and the electrode part for the electrode lead-out circuit from the transparent conductive film, A touch-side substrate having a transparent conductive film formed on a surface opposite to a retardation plate on which a linearly polarizing plate is laminated; Because it employs a structure consisting of a display-side substrate with a phase difference plate formed on the opposite side of a transparent insulating substrate on which a transparent conductive film is laminated, one expensive transparent insulating substrate can be omitted and produced. The cost could be reduced. In addition, the transmittance of the touch side substrate is improved by the amount that the light incident from the display equipped with the touch panel does not pass through the transparent insulating substrate, and good image quality is obtained.
[0050]
In the present invention, the transparent conductive film faces the display side substrate having the transparent conductive film forming the conductive pattern and the electrode portion for the electrode lead-out circuit from the transparent conductive film, and the touch side substrate. Forming a transparent conductive film on a phase difference plate laminated with a linearly polarizing plate, and forming a conductive pattern on the transparent conductive film In order to form a conductive pattern on the touch-side substrate by applying a resist ink that cures at a temperature of 100 ° C. or lower, and curing the resist ink applied on the transparent conductive film at a temperature of 100 ° C. or lower. Step of forming a resist film, and conductive paste that can be cured or dried at a temperature of 100 ° C. or lower at a predetermined position of the transparent conductive film forming the conductive pattern Since the structure including the step of applying and the step of forming the electrode part for circuit extraction of the transparent conductive film of the touch side substrate by curing the applied conductive paste by a heat treatment at a temperature of 100 ° C. or less is adopted. Since the step of bonding the polarizing plate and the transparent insulating substrate can be omitted, the effect of improving productivity and yield can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a configuration of a touch-side substrate of a low-reflection resistive touch panel to which the present invention is applied.
FIG. 2 is a cross-sectional view showing the structure of a low-reflection resistive touch panel to which the present invention is applied.
FIG. 3 is a cross-sectional view showing the structure of a low-reflection resistive touch panel in which a substrate is bonded at a portion where a resist film is not formed.
FIG. 4 is a cross-sectional view showing a structure of a low-reflection resistive touch panel in which a substrate is bonded with a double-sided tape.
FIG. 5 is a cross-sectional view showing a configuration of a touch-side substrate of a conventional low-reflection resistive touch panel.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Transparent insulating substrate 2 Transparent conductive film 3 Phase difference plate 4 Linearly polarizing plate 5 Circularly polarizing plate 6 Phase difference plate 7 Glass plate (transparent insulating substrate)
8 Silver electrode 9 Resist film 10 Adhesive 11 Transparent conductive film 12 Double-sided tape 20 Touch side substrate 30 Display side substrate

Claims (5)

In a low reflection type resistive touch panel in which a display side substrate and a touch side substrate are arranged opposite to each other,
The display-side substrate is formed by sequentially laminating a retardation plate, a transparent insulating substrate, and a transparent conductive film on which a conductive pattern is formed from the outside to the opposite surface side, and includes an external lead electrode on the transparent conductive film. Consisting of
The touch side substrate is formed by sequentially laminating a linearly polarizing plate, a phase difference plate, and a transparent conductive film on which a conductive pattern is formed from the outside to the opposite surface side, and includes an external lead electrode on the transparent conductive film,
The conductive pattern of the transparent conductive film of the touch-side substrate is formed by forming a resist film that can be cured at a temperature of 100 ° C. or less on unnecessary portions so as to form a predetermined conductive pattern on the transparent conductive film. A low-reflection resistive touch panel, characterized by   The lead electrode of the transparent conductive film of the touch side substrate is formed by heat-treating a conductive paste which is applied at a predetermined position and can be cured or dried at a temperature of 100 ° C. or less. 2. The low-reflection resistive touch panel as described in 1.   3. The display-side substrate and the touch-side substrate, which are arranged so that the transparent conductive films face each other, are bonded by an adhesive that can be cured at a temperature of 100 [deg.] C. or less. The low-reflection resistive touch panel described in 1. A method of manufacturing a low-reflection resistive touch panel in which a display-side substrate and a touch-side substrate are arranged opposite to each other,
The touch side substrate is:
Forming a transparent conductive film on a retardation plate on which linear polarizing plates are laminated;
Applying a thermosetting resist ink that can be cured at a temperature of 100 ° C. or lower to an unnecessary portion so as to form a predetermined conductive pattern on the transparent conductive film;
Forming a resist film for curing a resist ink applied on the transparent conductive film at a temperature of 100 ° C. or less to form a conductive pattern of the touch-side substrate;
Applying a conductive paste that can be cured or dried at a temperature of 100 ° C. or lower to a predetermined position of the transparent conductive film forming the conductive pattern;
Curing the applied conductive paste by a heat treatment at a temperature of 100 ° C. or lower to form an electrode portion for circuit extraction of the transparent conductive film on the touch side substrate;
A method of manufacturing a low-reflection resistive touch panel, which is manufactured through a process. Applying an adhesive that cures at a temperature of 100 ° C. or less to a side of a display-side substrate having a transparent conductive film on which a conductive pattern is formed and a lead electrode from the transparent conductive film;
Stacking a touch-side substrate having a transparent conductive film on which a conductive pattern is formed and an extraction electrode from the transparent conductive film, and the display-side substrate so that the conductive films face each other;
Curing the adhesive at a temperature of 100 ° C. or less to bond the two substrates by stacking the touch side substrate and the display substrate stacked via the adhesive;
A step of attaching a retardation plate to the opposite surface of the display-side substrate to which the touch-side substrate is bonded via the adhesive;
The method for manufacturing a low-reflection resistive touch panel according to claim 4, further comprising:

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