JPH03286530A - Wafer cleaning apparatus - Google Patents

Abstract

PURPOSE:To reduce electrification in the central part of a wafer and to prevent an electrostatic breakdown by a method wherein a cleaning-water spray nozzle of a single-wafer-system wafer cleaning apparatus is equipped with an oscillating mechanism which works in conjunction with a nozzle reciprocating movement. CONSTITUTION:An arm 4 executes a link movement on a wafer 1 which is turned in the direction of (c) by using a point X as a fulcrum; a nozzle 3 at its tip executes an arc movement in directions of D and E from a point Y on the O-X line to a point Z on the outer circumference of the wafer. The distance X-Y is shorter than the distance X-O. The cleaning-water spray angle of the nozzle 3 is changed continuously in such a way that at the point Y it is at an angle at which the cleaning water reaches a point O on the wafer and that at the point Z it is a vertical direction. At the central part of the wafer, the cleaning water in the same quantity is received by a wide cleaning wafer spray face 9; as a result, a water pressure which is exerted on the surface is reduced. Consequently, while a cleaning effect is being kept, it is possible to prevent an electrostatic breakdown which is caused locally in the central part of the wafer.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a wafer cleaning apparatus.

[Prior Art] As shown in FIGS. 5 and 4, the conventional technology is to provide a single-point type cleaning water jet nozzle 3 on the top of the wafer 1 with the center of gravity ◯ as the center of rotation. The wafer 1 was moved in an arc from one end of the wafer 1 through the center of gravity O to the other end E with the cleaning water ejection angle fixed in the vertical direction. Further, the moving speed of the nozzle 3 was constant, and the jetting pressure and jetting area of the cleaning water 2 were also constant regardless of the position of the nozzle 6.

[Problem to be solved by the invention] However, in the conventional technology described above, the electrical resistance of the cleaning water used is often very high, and on the surface of sea urchins, the high pressure cleaning water 2 is applied to the center of the sea urchin rather than the outer periphery. - Since the spray is ejected into the surface pupil for a long period of time, the center of the wafer tends to be charged and electrostatic damage frequently occurs. In addition, reducing the water pressure for washing can be considered as a countermeasure against electrostatic damage, but from the viewpoint of cleaning effectiveness, it is necessary to ensure the amount of water for washing.

SUMMARY OF THE INVENTION In order to solve these conventional problems, it is an object of the present invention to provide a wafer cleaning apparatus that prevents electrostatic damage without reducing the cleaning effect of the wafer center.

[Means for Solving the Problems] In order to solve the above problems, the sea urchin cleaning device of the present invention has the following features:
A single-wafer type wafer cleaning device that supplies cleaning water while reciprocating two cleaning water jetting nozzles on the wafer surface, characterized in that the cleaning water jetting nozzle is provided with an oscillating mechanism that is linked to the reciprocating movement of the nozzle. shall be.

[Function] According to the above configuration of the present invention, the cleaning water ejection angle is different for each part of the wafer, and the angle of incidence of the cleaning water on the central receiver on the wafer surface can be made small, so that the wafer surface can be cleaned with the same amount of cleaning water. Since the applied water pressure is reduced, charging at the center of the wafer is reduced and electrostatic damage is prevented.

FIG. 1 is a side view showing one implementation row of the wafer cleaning apparatus of the present invention. The wafer 1 rotates around the center of gravity ◯, and a one-point nozzle 3 above which sprays cleaning water 2 onto the surface of the wafer 1 is arranged via a bearing 5 at the tip of an arm 4 that moves in a linked manner. Further, a connecting rod 7 is attached to the nozzle 5 via a bearing 6, and the connecting rod 7 reciprocates in the directions of arrows A and B in conjunction with the link movement of the arm 4. As a result, the arm 4
In conjunction with the link movement of
It changes from to Zb. The cleaning water 2 is supplied to the nozzle 35 through a tube 8 that absorbs the displacement caused by the swinging motion of the nozzle 5.
Let's do it from

FIG. 2 is a plan view showing the above-mentioned embodiment. On the sea urchin rotating in the direction of arrow C...1, arm 4 moves in a linked manner with point Move in an arc.

The distance X-Y is shorter than the distance X-○, and the cleaning water jetting angle of the nozzle is continuously changed so that at point Y, the cleaning water reaches point 0 on the wafer, and at point 2, it is in the vertical direction. 9
is the wafer surface cleaning water injection surface. Sea urchins: Since the center receives the same amount of washing water on a wide washing water jetting surface, the water pressure applied to the surface is reduced.

In the above configuration, compared to a case where the cleaning water ejection direction is fixed in the vertical direction, the surface at the center of the wafer receives the same amount of water and the water pressure is reduced, so that it is less likely to be charged. Further, in the center of the wafer, the cleaning water has a velocity also toward the outer circumference of the wafer, which increases the cleaning effect.

[Effects of the invention] As described above, according to the present invention, it is possible to reduce the cleaning water pressure applied to the center of the wafer surface while keeping the amount of cleaning water the same. It has the effect of preventing electrostatic damage that occurs locally.

・・・・・・・・・Washing water ・・・・・・・・・・Nozzle ·········arm ·········bearing ・・・・・・・・・－・Shaft holder ・・・・・・・・・Connecting rod ·········tube ・・・・・・Wafer surface cleaning water jet chamfering±

[Brief explanation of drawings]

Fig. 1 is a surface diagram showing an embodiment of the first wafer cleaning apparatus of the present invention, Fig. 2 is a plan view of the same, Fig. 3 is a plan view showing a conventional technique, and Fig. 4 is a side view of the same. It is.

Claims (1)

[Claims] (1) A single-wafer type wafer cleaning apparatus that supplies cleaning water while reciprocating a cleaning water jetting nozzle on the wafer surface, characterized in that the cleaning water jetting nozzle is provided with a swinging mechanism that is linked to the reciprocating movement of the nozzle. Wafer cleaning equipment.