JPH0328511Y2 - - Google Patents

Info

Publication number
JPH0328511Y2
JPH0328511Y2 JP1987151521U JP15152187U JPH0328511Y2 JP H0328511 Y2 JPH0328511 Y2 JP H0328511Y2 JP 1987151521 U JP1987151521 U JP 1987151521U JP 15152187 U JP15152187 U JP 15152187U JP H0328511 Y2 JPH0328511 Y2 JP H0328511Y2
Authority
JP
Japan
Prior art keywords
external
lead
insulator
external leads
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987151521U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6371547U (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987151521U priority Critical patent/JPH0328511Y2/ja
Publication of JPS6371547U publication Critical patent/JPS6371547U/ja
Application granted granted Critical
Publication of JPH0328511Y2 publication Critical patent/JPH0328511Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987151521U 1987-10-02 1987-10-02 Expired JPH0328511Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987151521U JPH0328511Y2 (ko) 1987-10-02 1987-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987151521U JPH0328511Y2 (ko) 1987-10-02 1987-10-02

Publications (2)

Publication Number Publication Date
JPS6371547U JPS6371547U (ko) 1988-05-13
JPH0328511Y2 true JPH0328511Y2 (ko) 1991-06-19

Family

ID=31068670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987151521U Expired JPH0328511Y2 (ko) 1987-10-02 1987-10-02

Country Status (1)

Country Link
JP (1) JPH0328511Y2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100958422B1 (ko) * 2003-01-21 2010-05-18 페어차일드코리아반도체 주식회사 고전압 응용에 적합한 구조를 갖는 반도체 패키지
KR102192997B1 (ko) * 2014-01-27 2020-12-18 삼성전자주식회사 반도체 소자

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588664A (ja) * 1981-07-08 1983-01-18 Nec Corp マルチサイズ印刷装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588664A (ja) * 1981-07-08 1983-01-18 Nec Corp マルチサイズ印刷装置

Also Published As

Publication number Publication date
JPS6371547U (ko) 1988-05-13

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