JPS6322677Y2 - - Google Patents
Info
- Publication number
- JPS6322677Y2 JPS6322677Y2 JP1066383U JP1066383U JPS6322677Y2 JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2 JP 1066383 U JP1066383 U JP 1066383U JP 1066383 U JP1066383 U JP 1066383U JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- external
- resin body
- insulator
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000012212 insulator Substances 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 37
- 229920005989 resin Polymers 0.000 description 37
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1066383U JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1066383U JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59117160U JPS59117160U (ja) | 1984-08-07 |
| JPS6322677Y2 true JPS6322677Y2 (ko) | 1988-06-22 |
Family
ID=30142101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1066383U Granted JPS59117160U (ja) | 1983-01-28 | 1983-01-28 | 絶縁物封止半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117160U (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112022003555T5 (de) * | 2021-08-18 | 2024-05-16 | Rohm Co., Ltd. | Halbleiterbauteil |
| WO2024095788A1 (ja) * | 2022-11-04 | 2024-05-10 | ローム株式会社 | 半導体装置 |
-
1983
- 1983-01-28 JP JP1066383U patent/JPS59117160U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59117160U (ja) | 1984-08-07 |
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