JPH0328508Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a constant temperature device for a sample chamber in an electron beam lithography apparatus.

[Prior art]

The sample chamber of an electron beam lithography system is designed to prevent thermal displacement of the stage, sample, etc. stored inside.
It is necessary to keep the temperature constant to prevent displacement of the interferometer for measuring the position of the sample fixed on the inner wall of the sample chamber. An example of a conventional constant temperature device is a method in which grooves are provided above and below the sample chamber, and multiple drilled holes are drilled in the wall between the grooves, and cooling water is circulated from the grooves on one side to the grooves on the other side. However, due to the difference in resistance of the drilled holes, there were drilled holes where the cooling water could easily flow and holes where it was difficult to flow, resulting in differences in cooling effectiveness and uneven temperature distribution.

Also, since cooling water flows through multiple holes, the flow rate is slow and thermal efficiency is poor.

[Purpose of invention]

This invention eliminates these drawbacks, and its purpose is to uniformly distribute the temperature in the sample chamber and increase thermal efficiency by flowing cooling water throughout the sample chamber uniformly and at high speed. An object of the present invention is to provide a constant temperature device for a sample chamber in an electron beam lithography system.

[Key points of the idea]

In the constant temperature device for the sample chamber in the electron beam lithography system of the present invention, the sample chamber is formed by an upper plate, a lower plate, and a wall located between them, and a plurality of The holes are separated into two by two by grooves formed between the upper and lower ends of the wall and the upper plate and the lower plate, with the remaining two adjacent to each other on one end side of the upper and lower sides being communicated, Shifting the communication phase of the two holes at the upper and lower ends by one to form one flow path, and providing an inlet plug and an outlet plug at the ends of the two holes that are not in communication, respectively, Cooling water flows evenly over the entire area of the wall, and when the flow rate per unit time is the same as with conventional equipment, the flow rate inside the hole is increased to ensure efficient heat exchange. be.

[Example of idea]

The present invention will be explained below with reference to figures showing one embodiment. In FIG. 1, the sample chamber 11 is the upper plate 1.
2, the lower plate 13 and the wall 1 located between them
4, and a stage 16 on which a sample 15 is placed is housed inside. An interferometer 17 is attached inside the wall 14 and measures the position of the sample 15 using a mirror 18. Ring-shaped grooves 19 and 20 through which cooling water flows are formed in the upper plate 12 and lower plate 13 at portions that contact the upper end or lower end of the wall 14, respectively, and these grooves 19 and 20 vertically penetrate the wall 14. They are communicated by a drilled hole 21.

The upper groove 19 is connected to the hole 21H as shown in FIG.
and 21A or 21B and 21C etc., hole 2
It is divided into four blocks by four shikiri plates 22 so that two pieces of 1 are combined into one block.

As shown in Fig. 3, the lower groove 20 is formed by four holes, excluding the two adjacent holes 21A and 21B, and forming the remaining holes 21C to 21H into one block. It is divided into three blocks by the plate 23, and two adjacent holes 21A and 2
1B is made into only one block by a shikiri plate 24. Here, the shikiri plates 22 and 23 are approximately 45
゜The phase is shifted. Hole 2 of the lower groove 20
A cooling water outlet plug 25 is attached to the block 1A, and an inlet plug 26 is attached to the block 21B. In addition, 27 is a supply source of cooling water.

Next, the operation of the embodiment described above will be explained. The cooling water supplied from the supply source 27 first flows into the lower groove 20.
It flows through the inlet plug 26 into the block having only the hole 21B among the plurality of blocks, ascends through the hole 21B and enters one block in the upper groove 19.

Since this block has holes 21B and 21C, the cooling water flows down through the hole 21C and then ascends through the hole 21D.
After passing through 1G and 21H, it flows down the hole 21A and returns to the supply source 27 through the outlet plug 25. As described above, the present invention is characterized in that the cooling water flows along one flow path. Although the number of holes 21 is eight in the above description, it is not necessary to limit the number to eight.

FIG. 4 shows another embodiment of the present invention.
In the first embodiment, the grooves 19 and 20 were divided into a plurality of blocks by the cutting plates 22 to 24, but in this example, the upper and lower grooves 19a and 20a are not ring-shaped but have an inlet plug 26 and an outlet plug 25 attached thereto. Only the first block has one hole, and the other blocks are small blocks with two holes, and the operation is the same as in the first embodiment, so the explanation will be omitted.

[Effect of idea]

As explained above, the constant temperature device for the sample chamber in the electron beam lithography system of the present invention divides the groove formed between the wall forming the sample chamber and the upper and lower plates into a plurality of blocks. The two blocks communicate with each other through holes in the wall, and the phases of the upper and lower blocks are shifted, allowing the cooling water to flow along a single channel consisting of the holes and grooves divided into blocks. The temperature of each part becomes nearly uniform, and the flow rate is fast, so it has the advantage of high thermal efficiency.

[Brief explanation of the drawing]

Figures 1 to 3 show one embodiment of the present invention; Figure 1 is a longitudinal sectional view, Figure 2 is a sectional view taken along line 2-2 in Figure 1, and Figure 3 is a 3-3 line in Figure 1. The line sectional view, FIG. 4, is a drawing corresponding to FIG. 2 in another embodiment of the present invention. 11... Sample chamber, 12... Upper plate, 13... Lower plate, 14... Wall, 19, 19a, 20, 20a
...Groove, 21...hole.

Claims (1)

[Scope of Claim for Utility Model Registration] 1. In a constant temperature device in which a plurality of holes are provided in the wall of the sample chamber of an electron beam lithography device and cooling water is allowed to flow through the holes, the sample chamber is provided with an upper plate, a lower plate, and between them. A plurality of holes are formed by a wall in which the wall is located, and are provided vertically through the wall, with the exception of two adjacent to each other at either one of the upper and lower ends, and the other holes are located at the upper and lower ends and the upper part of the wall. The plate and the lower plate are divided into two by grooves formed respectively and communicated with each other, and the communication phase of each of the two holes at the upper and lower ends is shifted by one.
Forming a flow path, the two uncommunicated
A constant temperature device for a sample chamber in an electron beam lithography system, which has an inlet plug and an outlet plug at each end of two holes. 2. Utility model registration in which the groove is one annular groove formed between the wall and the upper and lower plates, respectively, and partitioned by a shikiri plate so that two holes are separated and communicated with each other. A constant temperature device for a sample chamber in an electron beam lithography apparatus according to claim 1.