JPH03279470A - Nonwoven fabric and laminated sheet and production of laminated sheet - Google Patents
Nonwoven fabric and laminated sheet and production of laminated sheetInfo
- Publication number
- JPH03279470A JPH03279470A JP7609990A JP7609990A JPH03279470A JP H03279470 A JPH03279470 A JP H03279470A JP 7609990 A JP7609990 A JP 7609990A JP 7609990 A JP7609990 A JP 7609990A JP H03279470 A JPH03279470 A JP H03279470A
- Authority
- JP
- Japan
- Prior art keywords
- nonwoven fabric
- base material
- fibers
- inorganic compound
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004745 nonwoven fabric Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 17
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 17
- 229920006231 aramid fiber Polymers 0.000 claims abstract description 10
- 239000003365 glass fiber Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 48
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 5
- 238000007733 ion plating Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000002966 varnish Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000004760 aramid Substances 0.000 abstract description 3
- 229910052681 coesite Inorganic materials 0.000 abstract description 3
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 229910052682 stishovite Inorganic materials 0.000 abstract description 3
- 229910052905 tridymite Inorganic materials 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000002759 woven fabric Substances 0.000 description 6
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- -1 etc.) Chemical compound 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Chemical Or Physical Treatment Of Fibers (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷配線の絶縁基板として適した積層板なら
びにその積層板の基材として用いる不織布に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laminate suitable as an insulating substrate for printed wiring, and a nonwoven fabric used as a base material for the laminate.
従来の技術
上記積層板は、エポキシ樹脂等を含浸したシート状基材
（プリプレグ）を重ねて加熱加圧成形して製造される。BACKGROUND OF THE INVENTION The above-mentioned laminate is manufactured by stacking sheet-like base materials (prepreg) impregnated with epoxy resin or the like and molding them under heat and pressure.
シート状基材としては、織布タイプのもの（ガラス繊維
織布、アラミド繊維織布等）と不織布タイプのもの（ガ
ラス繊維不織布、アラミド繊維不織布等）があり、これ
らを単独で、または組合わせて用いている。不織布基材
は、積層板の機械加工性の向上やコストダウンを目的と
して用いられるが、樹脂を含浸して重ねる基材の一部な
いし全部に不織布基材を用いた積層板は、織布基材の積
層板に比べて次のような問題がある。Sheet-like base materials include woven fabric types (glass fiber woven fabrics, aramid fiber woven fabrics, etc.) and non-woven fabric types (glass fiber non-woven fabrics, aramid fiber non-woven fabrics, etc.), and these can be used alone or in combination. It is used as such. Non-woven fabric base materials are used to improve the machinability of laminates and reduce costs, but laminates that use non-woven fabric for part or all of the resin-impregnated base materials are There are the following problems compared to laminated boards made of wood.
（１）加工工程中の加熱処理による寸法変化が大きい。(1) There is a large dimensional change due to heat treatment during the processing process.
（２）そり・ねじれが大きい。(2) Large warpage and twisting.
この理由は、次のように考えられる。The reason for this is thought to be as follows.
織布は、連続する繊維を収束した経糸と像光を密に織り
上げたものであり、織布自体の伸縮は抑えられており、
均一な材料である。Woven fabric is made by closely weaving continuous fibers into warp threads and image light, and the expansion and contraction of the woven fabric itself is suppressed.
It is a uniform material.
一方、不織布は、単繊維を絡み合わせながらシート状に
広げ、樹脂（バインダ）で繊維同士を固定したものであ
る。従って、基材としての強度が低く、また、繊維の配
向もランダムで繊維間の空隙も大きく、ミクロ的に見た
場合非常に不均一である。特に、基材強度の点では、繊
維同士を樹脂で固定して強度をもたせているため、樹脂
が軟化する高温域では基材強度が大きく低下してしまう
。On the other hand, nonwoven fabric is made by spreading single fibers into a sheet while intertwining them, and fixing the fibers together with a resin (binder). Therefore, the strength as a base material is low, the fiber orientation is random, the voids between fibers are large, and microscopically, it is very non-uniform. In particular, in terms of base material strength, since the fibers are fixed together with resin to provide strength, the strength of the base material decreases significantly in a high temperature range where the resin softens.
以上のような不織布基材の特性が、積層板とした後も残
っており、加熱処理をしたときの樹脂の後硬化収縮等の
樹脂の動きを不織布基材が抑えきれないため、寸法変化
やそり・ねじれが大きくなってしまうのである。The above characteristics of the nonwoven fabric base material remain even after it is made into a laminate, and the nonwoven fabric base material cannot suppress the movement of the resin such as post-curing shrinkage during heat treatment, resulting in dimensional changes and This results in increased warping and twisting.
発明が解決しようとする課題
上記の点に鑑み、本発明の課題は、使用する基材の一部
ないし全部に不織布基材を用いた積層板において、加熱
処理による寸法変化やそり・ねじれを小さくすることで
ある。また、この課題達成に有用な不織布を提供するこ
とである。Problems to be Solved by the Invention In view of the above points, an object of the present invention is to minimize dimensional changes, warping, and twisting due to heat treatment in a laminate using a nonwoven fabric base material for part or all of the base material used. It is to be. Another object of the present invention is to provide a nonwoven fabric useful for achieving this objective.
課題を解決するための手段
本発明に係る積層板は、使用する基材の一部ないし全部
に不織布基材を用いたものであるが、この不織布基材は
、単繊維が互いに絡まり合っている状態で、少なくとも
その繊維同士の交叉部分の表面に耐熱性、電気絶縁性の
無機化合物被膜が形成されていることを特徴とする。Means for Solving the Problems The laminate according to the present invention uses a non-woven fabric base material for part or all of the base material used, but this non-woven fabric base material has single fibers entangled with each other. In this state, a heat-resistant and electrically insulating inorganic compound coating is formed on at least the surface of the intersection portion of the fibers.
無機化合物は、５ｉｎ２やＡｌ２Ｏ，である。また、不
織布基材は、ガラス繊維不織布やアラミド繊維不織布で
ある。Inorganic compounds include 5in2 and Al2O. Moreover, the nonwoven fabric base material is a glass fiber nonwoven fabric or an aramid fiber nonwoven fabric.
本発明に係る積層板の製造は、不織布基材への樹脂含浸
に先立ち、真空蒸着、イオンプレーティング、スパッタ
リングの中から選ばれる手段で、不織布基材の絡まり合
っている単繊維の少なくとも交叉部分の表面に無機化合
物被膜を形成する。The laminate according to the present invention is manufactured by a method selected from vacuum evaporation, ion plating, and sputtering, prior to impregnating the nonwoven fabric base material with a resin, so that at least the intersecting portions of the entangled single fibers of the nonwoven fabric base material are An inorganic compound film is formed on the surface of the material.
その後、樹脂を含浸し、これを単独で、または他の樹脂
含浸基材と組合せて加熱加圧成形する。Thereafter, it is impregnated with a resin, and it is heated and press-molded either alone or in combination with another resin-impregnated base material.
作用
第１図は、本発明に係る積層板に用いる不織布基材の説
明図である。絡まり合っている単繊維１．１″は、その
交差部分を樹脂２で結着されて不織布を構成しているが
、さらにその表面に無機化合物の被膜３が形成されてい
る。これによって、単繊維同士の絡まり合いが強固なも
のとなり、基材の強度が高められる。Function FIG. 1 is an explanatory diagram of a nonwoven fabric base material used in a laminate according to the present invention. The intertwined single fibers 1.1'' are bound at their intersections with resin 2 to form a nonwoven fabric, and a coating 3 of an inorganic compound is further formed on the surface of the single fibers. The intertwining of the fibers becomes strong, increasing the strength of the base material.
積層板の加工工程で加熱処理（１５０〜３００℃）を受
けても、単繊維同士の結着が無機化合物で行なわれてい
るため、樹脂による結着にみられるような高温下での軟
′化がなく、積層板の寸法変化、そり・ねじれが抑制さ
れるのである。Even if heat treated (150 to 300°C) during the laminate processing process, the bonding between single fibers is done with an inorganic compound, so it will not soften at high temperatures like the bonding with resin. This prevents dimensional changes, warping, and twisting of the laminate.
無機化合物として用いるＳｉＯ２やＡ１□０３は、硬度
が高く耐熱性、電気絶縁性の点でも優れており、加工コ
スト、取扱いの容易さの面からみても好ましいものであ
る。単繊維同士の交叉部分の表面に無機化合物被膜を形
成する手段として、真空蒸着、イオンプレーティング、
スパッタリングは、高真空下でのドライプロセスである
ので、均一な被膜形成ができ、基材を劣化させないので
都合がよい。SiO2 and A1□03 used as inorganic compounds have high hardness and are excellent in heat resistance and electrical insulation, and are preferable from the viewpoint of processing cost and ease of handling. Vacuum deposition, ion plating,
Since sputtering is a dry process under high vacuum, it is convenient because it can form a uniform film and does not deteriorate the base material.
実施例
本発明に係る積層板の実施に際して、不織布基材の単繊
維表面に形成する無機化合物被膜の厚さは、０．１〜５
μｍの範囲が好ましい。被膜が薄すぎると、単繊維同士
を結着する効果が十分でなく、一方、厚すぎると、基材
の可撓性を低下させ被膜の割れと剥落を起す傾向が強く
なる。Example When implementing the laminate according to the present invention, the thickness of the inorganic compound coating formed on the single fiber surface of the nonwoven fabric base material is 0.1 to 5.
A range of μm is preferred. If the coating is too thin, the effect of binding the single fibers together will not be sufficient, while if it is too thick, the flexibility of the base material will be reduced and the coating will have a strong tendency to crack and peel off.
不織布基材は、ガラス繊維不織布基材や、メタ型アラミ
ド繊維、パラ型アラミド繊維をベースとするアラミド繊
維不織布、ポリエステル繊維の不織布等を使用できる。As the nonwoven fabric base material, a glass fiber nonwoven fabric base material, an aramid fiber nonwoven fabric based on meta-aramid fibers or para-aramid fibers, a polyester fiber nonwoven fabric, etc. can be used.
その厚さや密度は、樹脂の含浸性や含浸作業性に応じて
適宜選択すればよい。The thickness and density may be appropriately selected depending on the impregnating properties of the resin and the impregnating workability.
樹脂は、エポキシ樹脂をはじめとする熱硬化性樹脂を用
いることができ、基材繊維と樹脂との接着強度を高める
ために、基材に含浸する樹脂ワニス中にシラン系カップ
リング剤（エポキシシラン、アミノシラン等）、チタネ
ート系カップリング剤等を適宜配合してもよい。A thermosetting resin such as an epoxy resin can be used as the resin.In order to increase the adhesive strength between the base fiber and the resin, a silane coupling agent (epoxy silane) is added to the resin varnish impregnated into the base material. , aminosilane, etc.), titanate coupling agents, etc. may be appropriately blended.
積層板の製造は、上記樹脂ワニスを基材に含浸乾燥して
得たプリプレグを板厚に応じて重ね合わせ、これを加熱
加圧成形して得る。このとき、表面に金属箔を一体に貼
り付けるようにルてもよい。The laminate is produced by impregnating and drying a base material with the above-mentioned resin varnish, stacking prepregs according to the board thickness, and molding them under heat and pressure. At this time, a metal foil may be integrally attached to the surface.
実施例１
ガラス繊維不織布（坪量５０ ｇ ／ ｒｄ ）に、真
空蒸着により０．４μｍ厚さのＳ ｉ Ｏ，被膜を形成
した。Example 1 A 0.4 μm thick SiO film was formed on a glass fiber nonwoven fabric (basis weight 50 g/rd) by vacuum deposition.
硬化剤としてジシアンジアミド、硬化促進剤として２エ
チルイミダゾールを配合したビスフェノール型エポキシ
樹脂ワニスを、上記ガラス繊維不織布に含浸乾燥して樹
脂量６０％のプリプレグを得た。A bisphenol type epoxy resin varnish containing dicyandiamide as a curing agent and 2-ethylimidazole as a curing accelerator was impregnated into the glass fiber nonwoven fabric and dried to obtain a prepreg with a resin content of 60%.
上記プリプレグを１０プライ重ね、その両側に３５μｍ
厚さの銅箔を載置して、加熱加圧成形により１．０ｍ厚
さの銅張り積層板とした。10 plies of the above prepreg are stacked, and 35μm on both sides
A copper foil with a thickness of 1.0 m was placed on the laminate, and a copper-clad laminate with a thickness of 1.0 m was obtained by heat-pressing molding.
実施例２
パラ型アラミド繊維不織布（坪量５０ｇ／ｒｒｒ）に、
イオンプレーティングにより１．０μｍ厚さのＡｌ２Ｏ
３被膜を形成した。Example 2 Para-type aramid fiber nonwoven fabric (basis weight 50 g/rrr),
1.0 μm thick Al2O by ion plating
Three films were formed.
上記パラ型アラミド繊維不織布を用い、以下実施例１と
同様にして１．０■厚さの銅張り積層板とした。Using the para-type aramid fiber nonwoven fabric, a copper-clad laminate having a thickness of 1.0 mm was prepared in the same manner as in Example 1.
従来例Ｉ
Ｓ ｉ Ｏ２被膜を形成せず、他は実施例１と同様にし
て１．０ｗｎ厚さの銅張り積層板とした。Conventional Example I A copper-clad laminate having a thickness of 1.0wn was prepared in the same manner as in Example 1 except that no SiO2 film was formed.
従来例２
Ａ１□０３被膜を形成せず、他は実施例２と同様にして
１．０ｍｌ厚さの銅張り積層板とした。Conventional Example 2 A copper-clad laminate having a thickness of 1.0 ml was prepared in the same manner as in Example 2 except that the A1□03 coating was not formed.
上記各銅張り積層板を定法のエツチングレジスト印刷〜
エツチング〜半田しジスト印刷〜半田レベラーの印刷回
路板加工工程に供し、加工前後の寸法変化率、加工後の
そり・ねじれ、半田耐熱性（２６０℃半田浴フロート）
を調べた結果を第１表に示す。Standard etching resist printing on each of the above copper-clad laminates ~
Etching ~ Soldering Registration Printing ~ Solder leveler used in the printed circuit board processing process, dimensional change rate before and after processing, warping/twisting after processing, solder heat resistance (260℃ solder bath float)
The results of the investigation are shown in Table 1.
尚、そり・ねじれは、９０Ｘ１５０ｍｎの試験片を用い
、試験片を定板に伏せて置いたときの定板からの浮き上
がり量の最大値をａとして、次の式そり：ａ／試験片長
辺の長さ × １００ねじれ：ａ／試験片対角線の長さ
× １００第１表
アラミド繊維不織布基材を用いた場合、繊維の吸湿によ
る耐熱性の劣化が問題となるが、無機化合物被膜を形成
したことにより繊維の吸湿が抑制され、第１表より耐熱
性が向上することが判る。In addition, warping and twisting are calculated using the following formula, using a 90 x 150 mm test piece and setting the maximum amount of lift from the fixed plate when the test piece is placed face down on the fixed plate: warpage: a/long side of the test piece. Length x 100 Twist: a/Length of diagonal of test piece x 100 Table 1 When using an aramid fiber nonwoven fabric base material, deterioration of heat resistance due to moisture absorption of the fibers is a problem, but the formation of an inorganic compound coating It can be seen from Table 1 that the moisture absorption of the fibers is suppressed and the heat resistance is improved.
尚、上記の例では、使用する全ての基材を不織布とした
場合について説明したが、表面層の基材を織布とし、中
間層の基材を不織布としたコンポジット積層板等、他の
基材と組合せた積層板についても、同様に寸法変化が小
さく、そり・ねじれが小さくなる。In the above example, all base materials used are non-woven fabrics, but other base materials such as composite laminates in which the surface layer base material is woven fabric and the intermediate layer base material is non-woven fabric, etc. are explained. Similarly, the dimensional change of the laminated plate combined with the material is small, and warping and twisting are also small.
発明の効果
上述のように、本発明に係る積層板は、樹脂を含浸する
不織布基材の単繊維同士の結着が強固であることから、
この基材が加熱処理に伴う樹脂の収縮を抑えることがで
き、加熱処理を受けた後の寸法変化、そり・ねじれが小
さなものとなる。Effects of the Invention As described above, the laminate according to the present invention has strong binding between the single fibers of the resin-impregnated nonwoven fabric base material.
This base material can suppress shrinkage of the resin due to heat treatment, and dimensional changes, warping, and twisting after heat treatment are minimized.
第１図は、本発明に係る積層板における不織布の単繊維
同士の結着状態を説明する模式図である。
１．１′は単繊維
３は無機化合物被膜FIG. 1 is a schematic diagram illustrating the binding state of single fibers of nonwoven fabric in a laminate according to the present invention. 1.1' is a single fiber 3 coated with an inorganic compound
Claims (8)
ともその繊維同士の交叉部分の表面に耐熱性、電気絶縁
性の無機化合物被膜が形成されていることを特徴とする
不織布。(1) A nonwoven fabric characterized in that single fibers are entangled with each other and a heat-resistant, electrically insulating inorganic compound coating is formed on the surface of at least the intersection of the fibers.
形した積層板において、 シート状基材の一部ないし全部が不織布基材であり、こ
の不織布基材は、単繊維が互いに絡まり合っている状態
で、少なくともその繊維同士の交叉部分の表面に耐熱性
、電気絶縁性の無機化合物被膜が形成されていることを
特徴とする積層板。(2) In a laminate made by layering resin-impregnated sheet-like base materials and forming them under heat and pressure, part or all of the sheet-like base materials are non-woven fabric base materials, and this non-woven fabric base material has single fibers entangled with each other. A laminate characterized in that a heat-resistant, electrically insulating inorganic compound coating is formed on the surface of at least the intersecting portions of the fibers when the fibers are aligned.
求項２記載の積層板。(3) The laminate according to claim 2, wherein the inorganic compound coating has a thickness of 0.1 to 5 μm.
に記載の積層板。(4) Claim 2 or 3 wherein the inorganic compound is SiO_2
The laminate described in .
は３に記載の積層板。(5) The laminate according to claim 2 or 3, wherein the inorganic compound is Al_2O_3.
）〜（５）のいずれか１項に記載の積層板。(6) Claim (2) wherein the nonwoven fabric base material is a glass fiber nonwoven fabric.
) to (5).
２）〜（５）のいずれか１項に記載の積層板。(7) Claim in which the nonwoven fabric base material is an aramid fiber nonwoven fabric (
2) The laminate according to any one of (5).
形する積層板の製造において、 シート状基材の一部ないし全部に不織布基材を用い、こ
の不織布基材には、樹脂含浸に先立ち、真空蒸着、イオ
ンプレーティング、スパッタリングの中から選ばれる手
段で、絡まり合っている単繊維の少なくとも交叉部分の
表面に耐熱性、電気絶縁性の無機化合物被膜を形成する
ことを特徴とする積層板の製造法。(8) In the production of laminates in which sheet-like base materials impregnated with resin are stacked and molded under heat and pressure, a non-woven fabric base material is used for part or all of the sheet-like base materials, and this non-woven fabric base material is Prior to this, a heat-resistant and electrically insulating inorganic compound film is formed on the surface of at least the intersecting portions of the intertwined single fibers by a method selected from vacuum evaporation, ion plating, and sputtering. Method of manufacturing laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076099A JP2847875B2 (en) | 1990-03-26 | 1990-03-26 | Manufacture of nonwoven fabric substrates for laminates, laminates and laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076099A JP2847875B2 (en) | 1990-03-26 | 1990-03-26 | Manufacture of nonwoven fabric substrates for laminates, laminates and laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03279470A true JPH03279470A (en) | 1991-12-10 |
| JP2847875B2 JP2847875B2 (en) | 1999-01-20 |
Family
ID=13595420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2076099A Expired - Lifetime JP2847875B2 (en) | 1990-03-26 | 1990-03-26 | Manufacture of nonwoven fabric substrates for laminates, laminates and laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2847875B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049118A1 (en) * | 1998-03-20 | 1999-09-30 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and aramid fibers |
| CN107757025A (en) * | 2017-10-31 | 2018-03-06 | 安徽丹凤电子材料股份有限公司 | A kind of high-quality glass fabric |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453794U (en) * | 1987-09-25 | 1989-04-03 |
-
1990
- 1990-03-26 JP JP2076099A patent/JP2847875B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453794U (en) * | 1987-09-25 | 1989-04-03 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999049118A1 (en) * | 1998-03-20 | 1999-09-30 | Ahlstrom Glassfibre Oy | Base webs for printed circuit board production using the foam process and aramid fibers |
| CN107757025A (en) * | 2017-10-31 | 2018-03-06 | 安徽丹凤电子材料股份有限公司 | A kind of high-quality glass fabric |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2847875B2 (en) | 1999-01-20 |
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