JPH0327593A - Manufacture of composite multilayer printed wiring board - Google Patents
Manufacture of composite multilayer printed wiring boardInfo
- Publication number
- JPH0327593A JPH0327593A JP16200289A JP16200289A JPH0327593A JP H0327593 A JPH0327593 A JP H0327593A JP 16200289 A JP16200289 A JP 16200289A JP 16200289 A JP16200289 A JP 16200289A JP H0327593 A JPH0327593 A JP H0327593A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible
- pwb
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 230000002093 peripheral effect Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 description 5
- 230000032798 delamination Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分’ＪＥｆ ＞
本発明はプリン１・配線板の製造方法に関し、牛，′ｌ
にフレキシブルプリント配線板（以下、ＦＰＣと記す）
の両側を、それぞれ２枚の硬質プリン１一配線板（以下
、ＰＷＢと記す）によって両面よ９挾んで積層接着して
なる複合多層プリント配線板（フレクスリジッドプリン
ト配線板）の製造方法に関する。[Detailed description of the invention] <Industrial use 'JEf> The present invention relates to a method for manufacturing pudding 1/wiring board.
Flexible printed wiring board (hereinafter referred to as FPC)
This invention relates to a method for producing a composite multilayer printed wiring board (flex-rigid printed wiring board) in which both sides of the board are laminated and bonded by two hard pudding boards (hereinafter referred to as PWBs) on both sides.
〈従来の技術〉
従来の複合多層プリント配線板で、２つ以上の硬質部分
がフレキシブル部分で結ばれているものの１例を第６図
に示す。この製造工程において、部品実装ｆｕ易にする
ため、フレキシブル部分７を除く各硬質部分８を固定す
る場合が多い８例えば第７図のように、上記硬質部分８
を周辺部９に固定し、電子部品の実装後に上記周辺部９
を手で切断する。<Prior Art> An example of a conventional composite multilayer printed wiring board in which two or more hard parts are connected by a flexible part is shown in FIG. In this manufacturing process, in order to facilitate component mounting, each hard part 8 except for the flexible part 7 is often fixed8. For example, as shown in FIG.
is fixed to the peripheral part 9, and after mounting the electronic components, the peripheral part 9 is fixed to the peripheral part 9.
cut by hand.
次に、第８図乃至第１０図に従って、従来の複合多層プ
リンＩ・配線板の製造工程について述べる。Next, the manufacturing process of a conventional composite multilayer print I/wiring board will be described according to FIGS. 8 to 10.
１ず、第８図に示すように両面に導体パターンを形或し
た後カバーレイフィルムを貼付けたＦＰＣ１の両側から
接着シート２を介して、片面に銅箔を張り付けたＰＷＢ
ａを、銅箔を外側にして重ね合わせ熱圧着する。この時
、接着シ一ト２とＰＷＢ３には、フレキシブル部分にあ
たる範囲に中孔４，５をあけて除去してかく。熱圧着後
の断面図を第９図に示す。この後穴明け、スルーホール
めっき、パターンエッチングを行い、外形加工第１０図
のようになる。同図において、９は周辺部、１０ぱスル
ーホール、１１は導体パターンである。この後、周辺部
９を手で切断除去する。1. As shown in FIG. 8, a PWB is prepared by pasting copper foil on one side of the FPC 1 with conductor patterns formed on both sides and a coverlay film pasted thereon through an adhesive sheet 2 from both sides.
(a) are stacked together with the copper foil facing outside and bonded together under heat. At this time, holes 4 and 5 are made in the adhesive sheet 2 and PWB 3 in the area corresponding to the flexible portion, and then removed. A cross-sectional view after thermocompression bonding is shown in FIG. After this, drilling, through-hole plating, and pattern etching are performed to form the external shape as shown in Figure 10. In the figure, 9 is a peripheral part, 10 is a through hole, and 11 is a conductor pattern. Thereafter, the peripheral portion 9 is cut and removed by hand.
〈発明が解決しようとする課題〉
第７図に示す様な従来の複合多層プリント配線板は、電
子部品を実装する時、以下の問題がある。<Problems to be Solved by the Invention> The conventional composite multilayer printed wiring board as shown in FIG. 7 has the following problems when mounting electronic components.
遠赤外線方式の半田リフロー炉を用いた場合、炉内にお
いて上記複合多層プリント配線板の温度は、フレキシブ
ル部分７が硬質部分８よ９２０〜４０℃程度高温になる
。このため硬質部分８で半田ペーストが十分溶融する温
度に設定した時、フレキシブル部分の温度７はＦＰＣ材
料の耐熱温度を越えＦＰＣ材料の層間剥離が生じやすい
。When a far-infrared type solder reflow oven is used, the temperature of the composite multilayer printed wiring board in the oven is about 920 to 40° C. higher in the flexible portion 7 than in the hard portion 8. Therefore, when the temperature is set to sufficiently melt the solder paste in the hard part 8, the temperature 7 in the flexible part exceeds the heat resistance temperature of the FPC material, and delamination of the FPC material tends to occur.
又、半田ディップの場合も、硬質部分８のヌルーホール
に半田が充填されるように、半田温度を２４０〜２５０
℃程度に設定するためフレキシプル部分でｉｄＦＰＣ桐
料にとって過艮の熱衝撃となり、層間剥離が生じやすい
。Also, in the case of solder dipping, the solder temperature should be set at 240 to 250 so that the null holes in the hard part 8 are filled with solder.
Since the temperature is set at about 0.degree. C., excessive thermal shock occurs to the idFPC paulownia material in the flexible portion, which tends to cause delamination.
そこで本発明の目的は、遠赤外線方式の半田リフロー炉
を用いた場合や半田ディップを行った際にも、フレキシ
ブｌレ部分７のＫグ間剥離の生じないような複合多層プ
リント配線板の製造方法を提供することにある。Therefore, an object of the present invention is to manufacture a composite multilayer printed wiring board that does not cause peeling of the flexible latch portion 7 even when using a far-infrared solder reflow oven or when performing solder dipping. The purpose is to provide a method.
〈課題を解決するための手段〉
上記目的を達威するために、本発明にかいては、積層捩
着＋」ｉＪのＰＷＢはＦ Ｐ Ｃの露山部に相対する部
分を含み、且つ該部分は除去補助手段を備えてなり、積
層接着及び外形加工後に、上記ＰＷＢのＦＰＣ露出部に
相対する部分を除去するようにした。<Means for Solving the Problems> In order to achieve the above object, in the present invention, the PWB of the laminated screw +"iJ includes a portion facing the exposed portion of the FPC, and The portion was equipped with a removal assisting means, and after lamination adhesion and contour processing, the portion of the PWB facing the FPC exposed portion was removed.
〈作 用〉
複合多層プリント配線板の製造工程に釦いて、フレキシ
ブル部分がＰＷＢで鮫訃われた状態で半田リフローや半
田ディップを行えるため、半田リフローではフレキシブ
ル部分の過熱を防止することができ、半田ディップでは
熱衝撃をやわらげる効果が得られる。<Function> In the manufacturing process of composite multilayer printed wiring boards, solder reflow or solder dip can be performed with the flexible part being pierced by PWB, so it is possible to prevent overheating of the flexible part during solder reflow. Solder dipping has the effect of softening thermal shock.
〈実施例〉
本発明一実施例を第１図乃至第５図を参１１αして説明
する。筐ず、第１図に示すように、パターンエッチング
後カバーレイフィＩレムを施された両而Ｆ ＰＣ．！：
フレキシプノレ部分に相対する部分に孔あけした接着シ
一ト２と片面銅張ＰＷＢ３を熱圧着する。このとき、こ
の片面銅張ＰＷＢ３は、予め硬質部分とフレキシブル部
分の境界に沿ってＦＰＣ１と接着される面から座ぐ９加
工により溝６を形威しておく曳圧着後の断面図は第２図
となる。この溝６ぱ、ＰＷＢ３のフレキシプノレ部分７
にあたる範囲を後で切断するものであり、手作業で切断
でき、且つ、以降の配線板の加工に耐えつる強度が必要
であシ、溝巾１朋以下に対し、ＰＷＢ３の残り厚み５０
μ渦程度が適している。<Embodiment> An embodiment of the present invention will be described with reference to FIGS. 1 to 5. As shown in Fig. 1, both FPC. ! :
An adhesive sheet 2 with holes formed in a portion opposite to the flexipunore portion and a single-sided copper-clad PWB 3 are bonded by thermocompression. At this time, this single-sided copper-clad PWB 3 has a groove 6 formed in advance from the surface to be bonded to the FPC 1 along the boundary between the hard part and the flexible part by 9 machining. It becomes a figure. This groove 6 is the flexipunore part 7 of PWB3.
This area will be cut later, so it must be able to be cut by hand and have the strength to withstand the subsequent processing of the wiring board.
A μ vortex level is suitable.
以降、従来例と同様にスノレーホーノレ１０及び導体パ
ターン１１を形或した後、外形加工を行うと、第３図に
示す斜視図の構造になる。第４図に断面図を示す。Thereafter, after shaping the snow hole 10 and the conductor pattern 11 in the same manner as in the conventional example, the outer shape is processed, resulting in the structure shown in the perspective view of FIG. 3. A cross-sectional view is shown in FIG.
これに電子部品を実装するが、この時、遠赤外線方式の
半田リフロー炉を用いた場合に、フレキシブル部分７ぱ
ＰＷＢ１２で勅おわれているため、上記フレキシブル部
分７が過熱されることがない。Electronic components are mounted on this, but at this time, when a far-infrared solder reflow oven is used, the flexible portion 7 is covered with the PWB 12, so the flexible portion 7 is not overheated.
１た、半田ディップ時の熱衝撃もやわらげられる。1.Thermal shock during solder dipping can also be alleviated.
以上のように、いずれの場合もフレキシブル部分７の層
間剥離の発生を防止できる。As described above, in either case, the occurrence of delamination of the flexible portion 7 can be prevented.
最後に電子部品実装後、まず硬質部分８を保持する周辺
部分９を切断し、次にフレキシブル部分７に４：１１対
するＰＷ８１２ｋ、第５図の様にして、配線板全体を上
下にずらすことによって切断除去し、フレキシブル部分
７を露出させる。Finally, after mounting the electronic components, first cut the peripheral part 9 that holds the hard part 8, then attach the PW812k to the flexible part 7 at a ratio of 4:11, as shown in Figure 5, and shift the entire wiring board up and down. Cut and remove to expose the flexible portion 7.
なお、上記実施例にかいては、除去補助手段としてＰＷ
Ｂ３に溝６を形成したが、この方法に限定されるもので
はなく、例えば破線形状のよう、にしてもよい。In addition, in the above embodiment, PW is used as a removal auxiliary means.
Although the groove 6 is formed in B3, the groove 6 is not limited to this method, and may be formed into a broken line shape, for example.
〈発明の効果〉
フレキシブル部分のＦＰＣが、ＰＷＢでおかわれている
ので、半田リフロ一時にフレキシブル部分が渦熱される
ことがなく、又、半田ディップ時の熱衝撃もやわらげら
れるため、上記フレキシブル部分での層間剥離の発生を
防止できる。<Effects of the invention> Since the flexible part of the FPC is covered with PWB, the flexible part is not subjected to vortex heating during solder reflow, and thermal shock during solder dipping is also softened, so that the flexible part The occurrence of delamination can be prevented.
第１図は、本発明一実施例による複合多１曽プリント配
線板の、熱圧着前の積層概略図、第２図乃至第５図は同
複合多層プリント配線板の製造方法を説明するための図
、第６図乃至第１０図は従来例による複合多層ブリン１
・配線板の製造方法を睨明するための図である。
１・・・フレキシフルプリンｌ一配線板、 ３・・・硬
質プリント配線板、 ６・・・溝（除去補助手段）。
代理人 弁理士 杉 山 毅 至（他１名）Ｘ
区
口刀■口
口Ｊ匹口FIG. 1 is a schematic diagram of the lamination of a composite multilayer printed wiring board according to an embodiment of the present invention before thermocompression bonding, and FIGS. 2 to 5 are diagrams for explaining the manufacturing method of the composite multilayer printed wiring board. Figures 6 to 10 show a conventional composite multilayer bling 1.
- It is a diagram for illustrating the manufacturing method of the wiring board. DESCRIPTION OF SYMBOLS 1...Flexifulpurin-wiring board, 3...Hard printed wiring board, 6...Groove (removal auxiliary means). Agent Patent Attorney Takeshi Sugiyama (1 other person)
Claims (1)
枚の硬質プリント配線板によって両面より挾んで積層接
着してなる複合多層プリント配線板の製造方法において
、 積層接着前の硬質プリント配線板は、フレキシブルプリ
ント配線板の露出部に相対する部分を含み、且つ該部分
は除去補助手段を備えてなり、積層接着及び外形加工後
に、上記硬質プリント配線板のフレキシブルプリント配
線板露出部に相対する部分を除去することを特徴とする
複合多層プリント配線板の製造方法。1. 2 on each side of the flexible printed wiring board.
In a method for manufacturing a composite multilayer printed wiring board in which two rigid printed wiring boards are sandwiched from both sides and laminated and bonded, the rigid printed wiring board before lamination and bonding includes a portion facing the exposed portion of the flexible printed wiring board, The manufacturing of a composite multilayer printed wiring board, characterized in that the part is equipped with a removal assisting means, and after lamination adhesion and external shaping, the part of the rigid printed wiring board facing the exposed part of the flexible printed wiring board is removed. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16200289A JPH0327593A (en) | 1989-06-23 | 1989-06-23 | Manufacture of composite multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16200289A JPH0327593A (en) | 1989-06-23 | 1989-06-23 | Manufacture of composite multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0327593A true JPH0327593A (en) | 1991-02-05 |
Family
ID=15746172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16200289A Pending JPH0327593A (en) | 1989-06-23 | 1989-06-23 | Manufacture of composite multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0327593A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513958A (en) * | 1991-07-04 | 1993-01-22 | Nippon Avionics Co Ltd | Flexible rigid printed board |
| JPH05243737A (en) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
| CN109769356A (en) * | 2019-02-26 | 2019-05-17 | 景旺电子科技(龙川)有限公司 | A kind of production method of soft or hard combination PCB |
-
1989
- 1989-06-23 JP JP16200289A patent/JPH0327593A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0513958A (en) * | 1991-07-04 | 1993-01-22 | Nippon Avionics Co Ltd | Flexible rigid printed board |
| JPH05243737A (en) * | 1992-02-28 | 1993-09-21 | Nippon Avionics Co Ltd | Flexible rigid printed wiring board |
| CN109769356A (en) * | 2019-02-26 | 2019-05-17 | 景旺电子科技(龙川)有限公司 | A kind of production method of soft or hard combination PCB |
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