JPH03264395A - Ic coin and preparation thereof - Google Patents

Abstract

PURPOSE:To obtain an IC capable of being accurately thrown in a slot by constituting the second transparent or translucent cover body, which is formed on a substrate to cover the display provided on the substrate, so as to allow the same to inwardly protrude from the peripheral edge part of the substrate in the direction separated from a frame body. CONSTITUTION:When a display body 7 is prepared, display 23 is printed on a substrate 22 by offset printing and the second cover body 24 is quantitatively dripped thereon in a molten state. Whereupon, the second cover body 24 becomes a shape protruding in a state inwardly curved from the peripheral edge part of the substrate in the direction separated from a frame body 1 by surface tension. Next, the cover body is irradiated with a small quantity of ultravio let rays to be brought to a semicured state and the substrate 22 is strongly fixed to a recessed part 3 by an adhesive 6 and the second cover body 24 is irradiated with a large quantity of ultraviolet rays to be cured. By this method, electrodes 9 - 13 are inwardly retracted from the opening edge 1A of the frame body 1 on the side of an IC module 4 and the second cover body 24 outwardly protrudes from the opening edge 1B of the frame body 1 on the side of the display body 1 and, therefore, when one side of a slot is formed into an outwardly expanded shape, this coin can be thrown in the slot only when the coin is turned toward the expanded part of the slot on the side of the display body and, as a result, accurate reading and writing can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC coin and a method for manufacturing the same.

Conventional technology This year, an IC coin with an IC chip was announced in the press and has been in the spotlight.

This was formed by mounting an IC module in an opening of a frame, and the IC module was specifically constructed as follows.

That is, it consisted of an electrode, an IC chip provided on the back side of the electrode and electrically connected to the electrode, and a covering body that covered the IC chip on the back side.

and bringing a contact point of a read/write device into contact with the electrode,
Through this contact, data was read from the memory within the IC chip, and conversely, data was written to this memory.

Problems to be Solved by the Invention In IC coins that exceed the above-mentioned problems, it is necessary to contact the contacts of the read/write device with its electrodes as described above.
Coins must be inserted into the slot of the read/write device in the correct direction.

However, for those who do not have such a habit of inserting coins,
``Please put the electrode in with the electrode facing you'' into the input slot.
Even if you write a cautionary note, you may fail.

If an IC coin is inserted into the slot with the orientation reversed, the contacts of the read/write device and the electrodes of the IC coin will not be able to contact each other, making it impossible to read and write correctly as described above. There was a problem.

Therefore, it is an object of the present invention to provide an IC coin that can be correctly inserted into the slot.

Means for solving the problem and distantly related to this object, the present invention provides a frame IC.
A display body is mounted on the side opposite to the module mounting side, and this display body has a substrate and a transparent or semitransparent second covering body that covers the display provided on this substrate, and The covering body projects inward from its peripheral edge in a direction away from the frame body.

If the configuration is as described above, the second covering of the display body protrudes inward from its peripheral edge in a direction away from the frame body, so that the input port of the read/write device also has one side facing outward. If the mold is made to have a bulge, the display can only be placed with the display side facing the bulge side of the slot, and as a result, correct reading and writing will be possible.

Embodiment In FIG. 1, reference numeral 1 denotes a frame made of brass, and a deep recess 2 is formed in one side of the frame 1, and a shallow recess 3 is formed in the other side.

An IC module 4 is fixed to the recess 2 with an adhesive 6! A display body 7 is fixed to the recessed portion 3 with an adhesive 6.

As shown in FIG. 2, circular electrodes 9 to 13 are provided concentrically on the surface side of the substrate 8 of the IC module 40.

Further, although not shown in FIG. 1, electrodes electrically connected to electrodes 9 to 13 through holes 14 to 18 are provided on the back side of this substrate 8, and these electrodes on the back side are provided with ICs. Chips 19 are electrically connected by wires 2o as shown in FIG.

In this state, the IC chip 19 is covered with the first covering body 21 made of resin, thereby completing the IC module 4.

On the other hand, the display body 7 includes a substrate 22 made of synthetic resin or metal film, a display 23 printed on this substrate 22, and a second covering made of ultraviolet curing resin that covers this display 23. 24.

First, a method of manufacturing this display body 7 will be explained.

First, a frog-like display 23 as shown in FIG. 3, for example, is printed on the substrate 22 by offset printing.

Next, a fixed amount of the second coating 24 in a molten state is dropped onto the display 23.

Then, as shown in FIG. 1, the surface tension results in a shape that protrudes from the peripheral edge inwardly in a curved direction away from the frame 1.

Once this state is reached, a small amount of ultraviolet light is irradiated to semi-cure the material.

Next, in this state, firmly attach the substrate 22 to the recess 3 using the adhesive 6.
In this fixed state, a large amount of ultraviolet rays are irradiated onto the second coating 24 to cure it.

This is because when the second coating 24 is cured while the display 7 is separated from the frame 1, the shrinkage rate of the second coating 24 is greater than that of the substrate 22. Since the substrate 22 is curved in a shape, the substrate 22 is firmly fixed to the recess 3 of the frame 1 with an adhesive 6 and then cured.

In the IC coin formed in this manner, the frame 1 is as shown in FIG.
Further, on the display body T side, the opening edge 1B is also covered with the second covering 24.
is protruding outward.

Therefore, the read/write device into which this IC coin is inserted has a convex insertion slot 26 as shown in FIG.

That is, the bottom side 25m of the input port 25 is a flat surface, the side surface 25B is vertically raised, the feeder 26C is horizontal, and the top side 26D is also horizontal.

When inserting an IC coin, align the opening edge 1mm of the frame 1, IB, with the bottom 25mm of the insertion slot 25 and the coin 25G, and insert the coin. In this case, the dimension from the request 25G to the upper side 26D1 is from the opening edge 1B of the IC coin frame 1 to the second cover 2.
Since the protrusion dimension of 4 is also made thicker, the second covering 24 will not come into contact with the upper side 25D and be damaged.

The IC coin thus inserted into the slot 25 in an appropriate orientation advances through the passage within the read/write device and stops with the electrodes 9 to 13 facing downward.

Then, the contacts 26 to 34 of the read/write device rise from below and come into contact with each other, thereby performing reading and writing.

Effects of the Invention As described above, in the present invention, a display body is mounted on the side of the frame body opposite to the side on which the IC module is mounted, and this display body includes a substrate and a transparent or translucent material that covers the display provided on the substrate. the second of
The second covering body has a covering body, and the second covering body projects inward from the peripheral edge thereof in a direction away from the frame body.

Therefore, with the groove bottom as described above, the second covering of the display body protrudes inward from its peripheral edge in a direction away from the frame, and the input port of the read/write device also extends from one side. If you use a mold that bulges out on one side, you can only put the display side toward the bulge side of the slot, and as a result, you will be able to read and write correctly.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the IC coin of the present invention,
FIG. 2 is a back view, FIG. 3 is a front view, and FIG. 4 is a front view of the main parts of the read/write device. 1...Frame body, 4...IC module,
6...Adhesive (adhesive), 7...Display body, 19...IC chip, 21.24...
...First. Second covering.

Claims (2)

[Claims] (1) A frame, an IC module mounted in a recess of the frame, and a display mounted on a side of the frame opposite to the side on which the IC module is mounted, and the IC module includes an electrode;
The display body includes an IC chip provided on the back side of the electrode and electrically connected to the electrode, and a first covering body covering the IC chip on the back side of the electrode. and a transparent or translucent second covering covering the display provided on the substrate, and the second covering extends inward from the peripheral edge in a direction away from the frame. IC coin that stands out. (2) The IC coin display body according to claim 1 first includes:
The substrate is coated with a molten second coating, the molten second coating is semi-cured, and the display body with the second coating semi-cured is bonded. A method for manufacturing an IC coin, in which the IC coin is attached to the frame by adhering it to the frame via a wafer, and then curing the second covering of the display body after this adhesion.