TW202201664A - Fingerprint sensing chip module for a smart card and packaging method of the same - Google Patents
Fingerprint sensing chip module for a smart card and packaging method of the same Download PDFInfo
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- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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本發明係關於一種指紋感測晶片模組,尤其針對用於智慧卡之指紋感測晶片模組的封裝方法。The present invention relates to a fingerprint sensing chip module, in particular to a packaging method for a fingerprint sensing chip module for smart cards.
人們日常生活中充斥著許多卡片的使用,傳統的卡片僅僅作為資訊記載介面,例如卡片使用者的姓名、使用期限等等,而隨著科技的進步,卡片不再是傳統的紙本卡片,加入了晶片來提供運算、存取控制及儲存資料等功能,而構成現有技術之智慧卡。智慧卡相較於傳統卡片而言,能攜帶更多資訊、也能降低被偽造的機率,進而提昇了智慧卡的使用率及普及率。但隨著智慧卡使用的普及,逐漸出現不肖之徒盜取進而冒用他人智慧卡的現象,同時人們也無可避免的會不經意的遺失智慧卡,導致智慧卡被拾獲者盜用的可能,因此智慧卡本身的驗證功能也相形重要。現有技術中,已有將指紋感測晶片模組整合於智慧卡上,進而提供使用者在使用智慧卡時作為身份驗證使用。People's daily life is full of the use of many cards. The traditional card is only used as an interface for recording information, such as the card user's name, expiration date, etc. With the advancement of technology, the card is no longer a traditional paper card. A chip is used to provide functions such as computing, access control, and data storage, and constitute a smart card in the prior art. Compared with traditional cards, smart cards can carry more information and reduce the chance of being counterfeited, thereby increasing the usage and popularity of smart cards. However, with the popularization of the use of smart cards, the phenomenon of unscrupulous people stealing and using other people's smart cards has gradually appeared. At the same time, people will inevitably lose the smart cards inadvertently, resulting in the possibility of the smart cards being stolen by the finder. Therefore, the verification function of the smart card itself is also important. In the prior art, a fingerprint sensor chip module has been integrated on a smart card, so as to provide a user for identity verification when using the smart card.
請參閱圖14所示,現有技術中設置於智慧卡上的指紋感測晶片模組91,該指紋感測晶片模組91中具有指紋感測晶片911,製程中需先將指紋感測晶片911設置於硬質基板92上,再進行第一道封裝並切割單體化(singulation)而構成單顆帶有封裝的指紋感測晶片模組91後,再設置於捲帶式封裝的軟板93(FPC,Flexible Printed Circuit)上,再進行打線及第二道封裝,進而設於智慧卡上。Please refer to FIG. 14 , the fingerprint
然而,現有技術中設置於智慧卡上的指紋感測晶片模組91中,其需經過兩次封裝則製程較為複雜,且其封膠體厚度也較厚。再者,指紋感測晶片911的主動面(具有感應陣列)與使用者可接觸之面的距離H除了指紋感測晶片模組911的封膠體厚度外,還包含軟板93的厚度,一般而言在現有技術中該距離H為160μm,故感測的距離較大,導致感應靈敏度較差。However, in the fingerprint
有鑑於此,本發明係針對現有技術設置於智慧卡之指紋感測晶片模組的結構及封裝方法加以改良,以期解決製程複雜與厚度的問題。In view of this, the present invention is aimed at improving the structure and packaging method of the fingerprint sensor chip module disposed in the smart card in the prior art, in order to solve the problems of complex manufacturing process and thickness.
為達到上述之發明目的,本發明所採用的技術手段為提供一種用於智慧卡之指紋感測晶片模組的封裝方法,其包括以下步驟:a. 提供一軟質基板;b. 設置多個指紋感測晶片於該軟質基板上,其中所述指紋感測晶片係呈間隔排列,且所述指紋感測晶片之背面朝向該軟質基板,而所述指紋感測晶片之主動面遠離該軟質基板;c. 其中該指紋感測晶片之主動面上包含有感應陣列,於所述感應陣列與該軟質基板間形成電連接;d. 形成多個封膠體分別覆蓋於各該指紋感測晶片外,且各該封膠體各自獨立且不相連接,各該封膠體覆蓋相對應之指紋感測晶片的主動面及側面。In order to achieve the above purpose of the invention, the technical means adopted by the present invention is to provide a packaging method for a fingerprint sensing chip module for smart cards, which includes the following steps: a. providing a flexible substrate; b. setting a plurality of fingerprints The sensing chip is on the flexible substrate, wherein the fingerprint sensing chips are arranged at intervals, the backside of the fingerprint sensing chip faces the flexible substrate, and the active surface of the fingerprint sensing chip is away from the flexible substrate; c. A sensing array is included on the active surface of the fingerprint sensing chip, and an electrical connection is formed between the sensing array and the flexible substrate; d. A plurality of encapsulation bodies are formed to cover the fingerprint sensing chips respectively, and Each of the encapsulation bodies is independent and not connected, and each of the encapsulation bodies covers the active surface and the side surface of the corresponding fingerprint sensing chip.
進一步而言,本發明提供一種指紋感測晶片模組,其包括:一軟質基板;一指紋感測晶片,其具有一主動面、一背面及側邊,該主動面包含有感應陣列,該指紋感測晶片之背面朝向該軟質基板設置,該指紋感測晶片之感應陣列與該軟質基板形成電連接;一封膠體,其覆蓋於該指紋感測晶片之主動面及側邊,該指紋感測晶片之主動面朝向該封膠體之頂面。Further, the present invention provides a fingerprint sensor chip module, which includes: a flexible substrate; a fingerprint sensor chip, which has an active surface, a back surface and a side, the active surface includes a sensor array, the fingerprint sensor The backside of the sensing chip faces the flexible substrate, and the sensing array of the fingerprint sensing chip forms an electrical connection with the flexible substrate; a colloid covers the active surface and the side of the fingerprint sensing chip, and the fingerprint sensing chip forms an electrical connection. The active surface faces the top surface of the sealing body.
本發明的優點在於,藉由指紋感測晶片直接設置於軟質基板上,並進行各自獨立封裝,而簡化為單一封裝製程,進而縮短製程時間及製程費用,且有效縮短指紋感測晶片之感應陣列與指紋感測晶片模組表面的距離,則可縮短感應距離,而在配置相同感應陣列的前提下,指紋感測晶片模組可提高感度。The advantage of the present invention is that the fingerprint sensor chip is directly disposed on the flexible substrate and packaged independently, thereby simplifying a single packaging process, thereby shortening the process time and cost, and effectively shortening the sensing array of the fingerprint sensor chip. The distance from the surface of the fingerprint sensing chip module can shorten the sensing distance, and on the premise of configuring the same sensing array, the fingerprint sensing chip module can improve the sensitivity.
以下配合圖式及本發明之實施例,進一步闡述本發明為達成預定發明目的所採取的技術手段,其中圖式僅為了說明目的而已被簡化,並通過描述本發明的元件和組件之間的關係來說明本發明的結構或方法發明,因此,圖中所示的元件不以實際數量、實際形狀、實際尺寸以及實際比例呈現,尺寸或尺寸比例已被放大或簡化,藉此提供更好的說明,已選擇性地設計和配置實際數量、實際形狀或實際尺寸比例,而詳細的元件佈局可能更複雜。The technical means adopted by the present invention to achieve the predetermined purpose of the present invention are further described below in conjunction with the drawings and the embodiments of the present invention, wherein the drawings are simplified for the purpose of illustration only, and describe the relationship between the elements and components of the present invention. to illustrate the structure or method invention of the present invention, therefore, the elements shown in the figures are not presented in the actual number, actual shape, actual size and actual scale, and the size or size ratio has been exaggerated or simplified to provide a better description. , has been selectively designed and configured actual quantity, actual shape or actual size ratio, while the detailed component layout may be more complex.
請參閱圖1所示,本發明之指紋感測晶片模組1主要係應用於智慧卡上,其包含有一軟質基板10、一指紋感測晶片20、一封膠體30及一塗覆層40。Please refer to FIG. 1 , the fingerprint
前述之軟質基板10具有一第一側面11及一第二側面12,該第一側面11設有預設電路(圖中未示),該第二側面12上可設有數個接腳13,所述預設電路透過所述接腳13與外部線路(例如智慧卡的內部電路《inlay》)相連接。在一實施例中,該軟質基板10為軟性印刷電路板(FPC,Flexible Printed Circuit),但不在此限。The aforementioned
前述之指紋感測晶片20設置於該軟質基板10之第一側面11上,該指紋感測晶片20透過該軟質基板10中預設電路與所述接腳13形成電連接。該指紋感測晶片20具有一主動面21及一背面22,該指紋感測晶片20係以該背面22設置於該軟質基板10之第一側面11上,在一實施例中,該指紋感測晶片20之背面22透過一膠體23設置於該軟質基板10之第一側面11上。該指紋感測晶片20之主動面21上設置感應陣列24,在一實施例中,所述感應陣列24由縱橫交錯的感應電極所組成,所述感應陣列24係用以感測手指接觸時所產生的電容變化,由於指紋之波峰和波谷所產生的電容變化量不同,故透過所述感應陣列24偵測到在各個位置的電容變化量,來鉤勒出所接觸之手指的指紋影像。該感應陣列24係與該軟質基板10形成電連接。在一實施例中(如圖1所示),該感應陣列24以至少一導線241與該軟質基板10形成電連接,該感應陣列24可透過左右兩側各至少一導線(圖中未示)與該軟質基板10形成電連接。在一實施例中(如圖2所示),該指紋感測晶片20A具有一矽穿孔25A(TSV),該矽穿孔25A係貫穿該主動面21A及該背面22A,該矽穿孔25A之內壁面設有導電材251A,該感應陣列24A透過該導電材251A與該軟質基板10A形成電連接。The aforementioned
前述之封膠體30係包覆該指紋感測晶片20,並設於該軟質基板10之第一側面11上。前述之塗覆層40係設置於該封膠體30之表面,用以設置所欲呈現的顏色或圖案於該封膠體30之表面,或者用以形成硬質表面來保護該封膠體30。在一實施例中,由該感測陣列24表面至該封膠體30之表面的距離h為40至120μm,距離h可為60μm。該塗覆層40之厚度則視其所需呈現的顏色、圖案或保護效果而定,在一實施例中,該塗覆層40之厚度為20μm。The
再者,請參閱圖3所示,指紋感測晶片模組1B可包含一電子元件50B,該電子元件50B藉由一導線51B與該軟質基板10B形成電連接。在一實施例中(如圖3所示),該電子元件50B係設於該軟質基板10B之第一側面11B上,並相對位於該指紋感測晶片20B旁側;在另一實施例中(如圖4所示),該電子元件50C設置於該軟質基板10B上,並以一絕緣體52C(例如DAF《晶片黏結薄膜》)包覆該電子元件50C,該指紋感測晶片20C堆疊於該絕緣體52C上。該電子元件50B、50C可為使用指紋感測晶片20B、20C所需配合使用的電子元件,例如增壓元件(charge pump)等,如此將該電子元件50B、50C和該指紋感測晶片20B、20C整合於單一封裝結構中,以提昇單一封裝結構所能提供的功能。Furthermore, as shown in FIG. 3 , the fingerprint
因此,本發明藉由將該指紋感測晶片20直接設置於該軟質基板10上,來有效縮短該指紋感測晶片20之感應陣列24與該封膠體23頂面之間的距離,由於手指接觸該指紋感測晶片模組1之位置為該塗覆層40之表面,故縮短該指紋感測晶片20之感應陣列24與該封膠體23頂面之間的距離即意味著減少手指與該感應陣列24之間的距離,則在配置相同感應陣列的前提下,可有效提升指紋感測晶片模組1的感度,進而提供較準確的指紋感應結果。Therefore, the present invention effectively shortens the distance between the
本發明之用於智慧卡之指紋感測晶片模組的封裝方法包含以下步驟:The packaging method for the fingerprint sensing chip module of the smart card of the present invention comprises the following steps:
提供一軟質基板帶體100(如圖5所示):由於智慧卡結構受限於基板厚度,其指紋感測晶片的基板必須為軟板,故該軟質基板帶體100可構成捲帶式的軟性印刷電路板(FPC,Flexible Printed Circuit)。Provide a flexible substrate tape body 100 (as shown in FIG. 5 ): Since the smart card structure is limited by the thickness of the substrate, the substrate of the fingerprint sensing chip must be a flexible board, so the flexible
設置多個指紋感測晶片20於該軟質基板帶體100上(如圖6所示):所述多個指紋感測晶片20係以其背面22朝向該軟質基板帶體100設置,各該指紋感測晶片20之主動面21上具有一感測陣列24。在一實施例中,所述指紋感測晶片20之背面22先設有膠體23,再透過該膠體23將該指紋感測晶片20設置於該軟質基板帶體100上。Arrange a plurality of
於所述指紋感測晶片20與所述軟質基板帶體100間形成電連接(如圖7所示):在本實施例中,係以打線方式(wire bonding)構成導線241於所述指紋感測晶片20之感應陣列24與該軟質基板帶體100之間,以形成電連接。各該指紋感測晶片20可以一側導線241(如圖7所示)或以兩側導線(圖中未示)與該軟質基板帶體100形成電連接。An electrical connection is formed between the
形成多個封膠體23分別覆蓋於各該指紋感測晶片20外(如圖8及圖9所示):係於各該指紋感測晶片20外分別構成一個封膠體23獨立覆蓋之,各該封膠體23之間各自獨立且不相連接,各該封膠體23覆蓋相對應之指紋感測晶片20的主動面及側面。在一實施例中,係先覆蓋一注膠模具60於該軟質基板帶體100上,該注膠模具60具有多個互不相通之模穴61,各該模穴61分別對應覆蓋該其中一指紋感測晶片20及與其連接之導線241,各該模穴61上設有一注膠孔62。在一實施例中,該注膠孔62位於該模穴61之頂面。在一實施例中,各該模穴61旁側可設有一排氣孔(圖中未示),用以供注膠時排出該模穴61內多餘之氣體。由各該注膠孔62對各該膜穴61注膠後,再將該注膠模具60移除,而完成該封膠體23設置的步驟。A plurality of sealing
切割、塗布及設置接腳步驟:請參閱圖1及圖9所示,於該指紋感測晶片20上設置該封膠體23後,可藉由一切割單元70對應各該指紋感測晶片20而切割出各自獨立的指紋感測晶片模組1,所述切割單元70可為切割刀、雷射或沖床等。再者,可於各該封膠體23表面塗布有該塗覆層40,在塗布該塗覆層40前,可先對該封膠體23之頂面進行研磨,以削減該封膠體23之厚度,同時能修整該封膠體23之頂面的平整度。而該軟質基板10之底側可設置接腳13以與外部電路形成電連接。前述之塗布、研磨、及設置接腳等步驟,均可於切割步驟之前或之後進行。Steps of cutting, coating and setting pins: please refer to FIG. 1 and FIG. 9 , after disposing the
在另一實施例中,請參閱圖10至圖13配合圖2所示,各該指紋感測晶片20A係具有矽穿孔25A,故於形成電連接之步驟中,係於各該矽穿孔25A的孔壁設置導電材251A,以使該感應陣列24A透過該導電材251A與該軟質基板帶體100A形成電連接。隨後仍以具有多個獨立模穴61A之注膠模具60A來覆蓋各該指紋感測晶片20A,並由該注膠孔62A完成注膠構成封膠體23A,再進行後續的切割、塗布、研磨、設置接腳等步驟後,完成指紋感測晶片模組的封裝。In another embodiment, please refer to FIG. 10 to FIG. 13 in conjunction with FIG. 2 , each of the
在又一實施例中,如欲設置如圖3或圖4所示之電子元件50B、50C,則可於設置指紋感測晶片之步驟前或後設置於軟質基板帶體上,並於構成電連接步驟中一併構成電子元件50B、50C與軟質基板帶體之間的電連接,且於構成封膠體步驟中將各電子元件50B、50C與相對應的指紋感測晶片覆蓋於同一封膠體中。In yet another embodiment, if
因此,本發明藉由前述步驟,可在單一封裝製程中將指紋感測晶片模組加以封裝完成,以簡化製程及縮短封裝時間。另外,在本發明單一封裝製程中亦可減少手指與該指紋感測晶片20之間的封裝材厚度,且讓該指紋感測晶片20及該接腳13位於該軟質基板帶體100的相對二側面,進而達到縮短該指紋感測晶片20之感應陣列24與手指之間的距離的目的,藉此有效提高感度。Therefore, the present invention can package the fingerprint sensor chip module in a single packaging process through the aforementioned steps, so as to simplify the process and shorten the packaging time. In addition, in the single packaging process of the present invention, the thickness of the packaging material between the finger and the
以上所述僅是本發明的實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以實施例揭露如上,然而並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above description is only an embodiment of the present invention, and is not intended to limit the present invention in any form. Although the present invention has been disclosed as above by embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field, Within the scope of not departing from the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, according to the technical essence of the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solutions of the present invention.
1:指紋感測晶片模組
10、10A、10B:軟質基板
100、100A:軟質基板帶體
11:第一側面
12:第二側面
13:接腳
20、20A:指紋感測晶片
21、21A:主動面
22、22A:背面
23:膠體
24:感應陣列
241:導線
25A:矽穿孔
251A:導電材
30:封膠體
40:塗覆層
50B、50C:電子元件
51B:導線
52C:絕緣體
60、60A:注膠模具
61、61A:模穴
62、62A:注膠孔
70:切割單元
91:指紋感測晶片模組
911:指紋感測晶片
92:基板
93:軟板1: Fingerprint
圖1為本發明之指紋感測晶片模組之第一實施例的側視部份元件剖面圖; 圖2為本發明之指紋感測晶片模組之第二實施例的側視部份元件剖面圖; 圖3為本發明之指紋感測晶片模組之第三實施例的側視部份元件剖面圖; 圖4為本發明之指紋感測晶片模組之第四實施例的側視部份元件剖面圖; 圖5至圖9為本發明之用於智慧卡之指紋感測晶片模組的封裝方法之流程步驟示意圖; 圖10至圖13為本發明之用於智慧卡之指紋感測晶片模組的封裝方法之另一實施例的流程步驟示意圖; 圖14為現有技術之指紋感測晶片模組的側視剖面圖。FIG. 1 is a side cross-sectional view of part of the components of the first embodiment of the fingerprint sensing chip module of the present invention; 2 is a side cross-sectional view of a part of components of a second embodiment of the fingerprint sensing chip module of the present invention; FIG. 3 is a side cross-sectional view of part of components of a third embodiment of the fingerprint sensing chip module of the present invention; 4 is a side cross-sectional view of a part of the components of the fourth embodiment of the fingerprint sensing chip module of the present invention; FIG. 5 to FIG. 9 are schematic flow charts of the packaging method of the fingerprint sensing chip module for smart card according to the present invention; 10 to 13 are schematic flowcharts of flow steps of another embodiment of a packaging method for a fingerprint sensing chip module for a smart card according to the present invention; 14 is a side cross-sectional view of a fingerprint sensing chip module of the prior art.
1:指紋感測晶片模組1: Fingerprint sensor chip module
10:軟質基板10: Soft substrate
11:第一側面11: The first side
12:第二側面12: Second side
13:接腳13: Pin
20:指紋感測晶片20: Fingerprint sensor chip
21:主動面21: Active side
22:背面22: Back
23:膠體23: Colloid
24:感應陣列24: Induction Array
241:導線241: Wire
30:封膠體30: Sealing body
40:塗覆層40: Coating
Claims (17)
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TWI364360B (en) * | 2010-05-03 | 2012-05-21 | Powertech Technology Inc | Transfer mold tooling having 3d runners |
TWM484793U (en) * | 2014-05-23 | 2014-08-21 | Dynacard Co Ltd | Package module of fingerprint recognition chip |
TWI567834B (en) * | 2014-06-13 | 2017-01-21 | 新東亞微電子股份有限公司 | Manufacturing method for packaging module of fingerprint identification chip |
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