JPH03264140A - Method for cutting lead of semiconductor device - Google Patents

Method for cutting lead of semiconductor device

Info

Publication number
JPH03264140A
JPH03264140A JP9063125A JP6312590A JPH03264140A JP H03264140 A JPH03264140 A JP H03264140A JP 9063125 A JP9063125 A JP 9063125A JP 6312590 A JP6312590 A JP 6312590A JP H03264140 A JPH03264140 A JP H03264140A
Authority
JP
Japan
Prior art keywords
lead
cut
cutting
cut surface
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9063125A
Other languages
Japanese (ja)
Other versions
JPH0832348B2 (en
Inventor
Saonori Hieda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2063125A priority Critical patent/JPH0832348B2/en
Publication of JPH03264140A publication Critical patent/JPH03264140A/en
Publication of JPH0832348B2 publication Critical patent/JPH0832348B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To improve the reliability in quality by imparting such a plastic deforming force that the cut face of a lead subjected to an external plating treatment has a slope having a grade descending toward the front end part of the lead to the lead at the time of cutting the above-mentioned lead by means of a cutting die.
CONSTITUTION: The semiconductor device having the lead 11 for external connection which is previously subjected to the external plating treatment is mounted on a receiving die 4. This lead 11 is then cut by the cutting die 12. Such plastic deforming force which the cut surface 11a of the lead has the slope having the grade descending toward the front end of the lead is imparted to the lead 11, by which the lead is cut. Since plating 1 can be stuck to the cut surface 11a of the lead 11 at the time of cutting of the lead, the cut surface 11a of the lead 11 can be coated with the plating 1 and the solder adhesiveness of the ensuring stage is assured. An increase in electric resistance, a decrease in joining strength, corrosion of the cut surface or the generation of a appearance defect is prevented in this way and the reliability in quality is improved.
COPYRIGHT: (C)1991,JPO&Japio
JP2063125A 1990-03-14 1990-03-14 Lead cutting method for semiconductor device Expired - Fee Related JPH0832348B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2063125A JPH0832348B2 (en) 1990-03-14 1990-03-14 Lead cutting method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2063125A JPH0832348B2 (en) 1990-03-14 1990-03-14 Lead cutting method for semiconductor device

Publications (2)

Publication Number Publication Date
JPH03264140A true JPH03264140A (en) 1991-11-25
JPH0832348B2 JPH0832348B2 (en) 1996-03-29

Family

ID=13220243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2063125A Expired - Fee Related JPH0832348B2 (en) 1990-03-14 1990-03-14 Lead cutting method for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0832348B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010033943A (en) * 2008-07-30 2010-02-12 Yazaki Corp Method of manufacturing connector terminal, and connector terminal
JP2013215742A (en) * 2012-04-05 2013-10-24 Eiko Yamada Method of manufacturing slab for solvent cored welding wire
JP2015153913A (en) * 2014-02-14 2015-08-24 セイコーインスツル株式会社 Resin sealed type semiconductor device and method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010033943A (en) * 2008-07-30 2010-02-12 Yazaki Corp Method of manufacturing connector terminal, and connector terminal
JP2013215742A (en) * 2012-04-05 2013-10-24 Eiko Yamada Method of manufacturing slab for solvent cored welding wire
JP2015153913A (en) * 2014-02-14 2015-08-24 セイコーインスツル株式会社 Resin sealed type semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JPH0832348B2 (en) 1996-03-29

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