JPH03263357A - Manufacture of ceramic package - Google Patents

Abstract

PURPOSE:To obtain a desired continuity resistance after a baking operation without increasing the width of a conductor layer on a green sheet by a method wherein a conductor layer in a desired pattern shape is laminated on the green sheet, a conductor layer in a desired pattern shape is laminated on the conductor layer and the desired continuity resistance is obtained after the baking operation. CONSTITUTION:In the first process, a first conductor layer 12 in a desired pattern shape is first printed on a green sheet 10 by a screen-printing operation or the like. In the second process, an insulating layer 14 is then formed similarly, by a screen-printing operation of the like, on the green sheet 10 substantially in a position except that of forming the first conductor layer 12, i.e., between patterns constituting the first conductor layer 12. The thickness of conductor layers is adjusted so as to obtain a desired continuity resistance by the first conductor layer 12 and a second conductor layer 16. Consequently, according to circumstances, a third conductor layer may be laminated on the second conductor layer 16 after a second insulating layer has been formed additionally in parts excluding parts where the second conductor layer 16 has been formed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention makes it possible to obtain a desired conduction resistance after firing by laminating multiple conductor layers on a green sheet by screen printing or the like. By forming an insulating layer between the patterns forming the conductor layer or between the conductor layers, when overlapping another green sheet on a green sheet having a conductor layer, it is possible to easily stack them tightly without creating a gap. The present invention relates to a method for manufacturing a ceramic package that can avoid the occurrence of cracks and the like after firing.

[Prior Art] Conventionally, when manufacturing a ceramic package, there is a method of metallizing a green sheet in order to obtain a desired conduction resistance after firing.

That is, this is a method of adjusting the conduction resistance by making the metallized portion narrower or wider.

[Problems to be Solved by the Invention] However, in today's world where devices with highly integrated circuits are desired, devices that rely on adjusting the width of the conductor layer to obtain the desired conduction resistance are There is a disadvantage that the size itself cannot be sufficiently miniaturized.

The present invention has been made to overcome the above-mentioned disadvantages, and provides a method for manufacturing a ceramic package that can obtain a desired conduction resistance after firing without increasing the width of the conductor layer on the green sheet. It's about doing.

[Means for Solving the Problems] In order to solve the above problems, the present invention provides at least a first step of laminating a first conductor layer in a desired pattern shape on a green sheet, and a first step of laminating the first conductor layer in a desired pattern shape on a green sheet. and a second step of laminating a second conductor layer in a desired pattern shape on the layer, thereby obtaining a desired conduction resistance after firing.

Further, the present invention is characterized in that a plurality of different third, fourth, or more conductor layers are laminated on the second conductor layer as necessary.

Furthermore, the present invention is characterized in that an insulating layer is formed on the green sheet at a position other than the position where the conductor layer is laminated.

Furthermore, the present invention is characterized in that each time a conductor layer is formed, an insulating layer is formed to fill the void defined between the patterns forming the conductor layer.

Further, the present invention is characterized in that after laminating a plurality of conductor layers to obtain a desired conduction resistance after firing, an insulating layer is formed to fill gaps defined between patterns forming the conductor layers. shall be.

Furthermore, the present invention is characterized in that one or more green sheets having the conductive layer and the insulating layer are closely laminated.

[Function] In the method for manufacturing a ceramic package of the present invention, a plurality of conductor layers are laminated on a green sheet by screen printing or the like, thereby obtaining a desired conduction resistance after firing. Therefore, a highly integrated and miniaturized device can be obtained without particularly increasing the width of the conductor layer on the green sheet.

In the present invention, the gaps between the patterns constituting the conductor layer are further filled with an insulating layer. Therefore, even when green sheets are further laminated, the superimposed green sheets can be adhered to each other, and no cracks or the like will occur after firing.

[Example] Next, a preferred example of the method for manufacturing a ceramic package according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, in the first step, a first conductor layer 12 is formed on a green sheet 10 in a desired pattern shape.
is printed by screen printing or the like.

Next, in a second step, an insulating layer 14 is similarly formed on the green sheet 10 at a position substantially excluding the formation position of the first conductor layer 12, that is, between the patterns constituting the first conductor layer 12. Formed by screen printing or the like. In this case, it is also possible for the insulating layer 14 shown in FIG. 2 to cover a small portion of the first conductive layer 12.

In this embodiment, the insulating layer 14 is made of the same material as the green sheet 10, and the method for forming it is, for example, using a mask used when forming the first conductor layer 12. If so, it is preferable to print using another mask that is negative.

After the absolute layer 4 is formed, a second conductor layer 16 is further formed on the first conductor layer 12 (see FIG. 3).
. That is, these first conductor layer 12 and second conductor layer 16
The thickness of the conductor layer is adjusted so as to have a desired conduction resistance. Therefore, in some cases, the second conductor layer 16
After further forming the second insulating layer except for the region where is formed, the third conductor layer may be laminated on the second conductor layer 16.

Note that, as shown in FIGS. 4a and 4b, after the first conductor layer 12 is laminated in advance and the second conductor layer 16 is further laminated, the first conductor layer 12 and the second conductor layer 16 are not laminated. It is also possible to form an insulating layer 14 made of the same material as the green sheet 10 in that portion.

As explained above, in this embodiment, the first conductor layer 1
2 and the second conductor layer 16, a desired conduction resistance can be obtained.

Further, after printing the first conductor layer 12 on the green sheet 10, an insulating layer 14 made of the same material as the green sheet 10 is formed on the portion where the first conductor layer 12 is not formed.

Therefore, for example, when the green sheet 10 is laminated with another green sheet 18 (see FIG. 3) and integrated by pressing, the opposing green sheets 18
．． 18 is press-contacted via the insulating layer 14, so that it is possible to avoid creating a gap in the vicinity of the first conductor layer 12.

Further, an insulating layer 14 is provided between adjacent first conductor layers 12 and 12.
is intervening. Therefore, when forming the second conductor layer 16 by printing, even if the formation position of the second conductor layer 16 is slightly shifted due to printing misalignment, the adjacent second conductor layer 16 .
16 is insulated by the insulating layer 14,
Inconveniences such as electrical short circuits caused by this printing misalignment can be avoided. In the end, the conduction resistance after firing can be adjusted by adjusting the thickness of the conductor layer, and since an insulating layer is formed between the patterns that make up the conductor layer, there is no cracking caused by voids after firing, increasing the reliability of the product. It also has the effect of improving.

[Effects of the Invention] According to the method for manufacturing a ceramic package according to the present invention, a desired conduction resistance is obtained after firing by laminating a plurality of conductor layers on a green sheet.

Therefore, since there is no need to widen the line width of the pattern constituting the conductor layer, a more compact ceramic package can be obtained even though the length in the height direction is slightly increased. Furthermore, an insulating layer is formed between the conductor layers.

Therefore, even when other green sheets are overlapped, since the gaps between the stacked conductor layers are filled with an insulating layer, no voids are generated between the green sheets. Therefore,
Cracks and delamination that may occur due to the voids can be avoided, resulting in the effect of further improving product reliability and yield.

[Brief explanation of drawings]

FIG. 1 is a vertical cross-sectional view showing a pattern of a conductive layer formed on a green sheet in a preferred embodiment of the method for manufacturing a ceramic package according to the present invention, and FIG. FIG. 3 is a vertical cross-sectional view showing a state in which different conductor layers are laminated in relation to the green sheet and conductor layer shown in FIG. 2; 0 FIG. 4a , b are vertical cross-sectional views showing a state in which conductor layers are laminated on a green sheet and an insulating layer is buried between these conductor layers at once. 0... Green Sea 2... First conductor layer 4... Insulating layer 6... Second conductor layer 8... Green Seat

Claims (6)

[Claims] (1) A first step of laminating a first conductor layer in a desired pattern shape on at least a green sheet, and a second step of laminating a second conductor layer in a desired pattern shape on the first conductor layer. A method for manufacturing a ceramic package, comprising the steps of: obtaining a desired conduction resistance after firing. (2) The method according to claim 1, wherein a plurality of different third, fourth or more conductor layers are laminated on the second conductor layer as necessary. Production method. (3) A method for manufacturing a ceramic package according to claim 1 or 2, characterized in that an insulating layer is formed on the green sheet at a position other than a position where the conductor layer is laminated. (4) The method according to claim 1 or 2, characterized in that each time a conductor layer is formed, an insulating layer is formed to fill a gap defined between patterns forming the conductor layer. How the package is manufactured. (5) In the method according to any one of claims 1 to 3, after laminating a plurality of conductor layers to obtain a desired conduction resistance after firing, a layer defined between the patterns forming the conductor layers is formed. A method for manufacturing a ceramic package, characterized by forming an insulating layer to fill voids. (6) A method for manufacturing a ceramic package according to any one of claims 1 to 5, characterized in that one or more green sheets having the conductive layer and the insulating layer are closely laminated.