JPH03256740A - Laminate for single surface printed circuit board and manufacture of single surface printed circuit board - Google Patents

Abstract

PURPOSE:To control warp and torsion small by integrating a single surface metallic foil plated laminate of given thickness with one surface applied with the foil integrally and a given laminate through a release film. CONSTITUTION:When a thin single surface printed circuit plate of 0.6mm thickness or less is manufactured, etching is carried out in the state of thick plate in which a single surface metallic foil plated laminate 2 is integrated with a laminate 3 through a release film 4. Rigidity gets larger by said arrangement, and the generation of warp and torsion in etching can be controlled. When the plate thickness of the laminate 3 to be integrated with the single surface metallic foil plate laminate 2 through the release film 4 is less than 0.4mm, control for the warp and torsion is not effective. Also, when the plate thickness of the single surface printed circuit plate to be manufactured is 0.6mm or less, the control effect of warp and torsion is remarkable.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the construction of a laminate suitable for use in single-sided printed circuit boards, and to a method for manufacturing single-sided printed circuit boards using the same.

BACKGROUND OF THE INVENTION Printed circuit boards are manufactured using a laminate in which metal foil is integrated with a layer of a resin-impregnated sheet-like base material by heat-pressing molding. This metal foil is etched to form a predetermined circuit on the laminate.

Incidentally, in recent years, in order to promote the miniaturization and weight reduction of electronic devices, there has been a demand for reducing the thickness of printed circuit boards incorporated into these devices. When manufacturing a single-sided printed circuit board using a single-sided metal foil-covered laminate as a material, the circuit board is likely to warp or twist because the laminate is asymmetric in its thickness direction. In particular, when manufacturing a thin single-sided printed circuit board with a board thickness of 0.611IIT1 or less, warping and twisting tend to increase.

Problems to be Solved by the Invention As mentioned above, in the production of single-sided printed circuit boards, there is a problem in that as the board thickness becomes thinner, warpage and twisting increase, resulting in poor workability.

An object of the present invention is to suppress warping and twisting when obtaining a single-sided printed circuit board with a thickness of 0.6 mm or less, and to provide a laminate for a single-sided printed circuit board suitable for this purpose. That's true.

Means for Solving the Problems As shown in FIG. 1, the laminate for a single-sided printed circuit board according to the present invention has a thickness of 0.6 and has a metal foil 1 integrally pasted on one side.
A single-sided metal foil-clad laminate 2 having a thickness of +mn or less and a laminate 3 having a thickness of 0.4 mm or more are integrated with a release film 4 interposed therebetween.

The metal foil 1 is located on one surface side, and the integration via the release film 4 is performed when the resin-impregnated sheet-like base material layer is heated and pressure-molded to form a laminate. It is being done.

Furthermore, the single-sided printed circuit board according to the present invention is manufactured using the above-mentioned laminate for single-sided printed circuit boards.

This is subjected to conventional printing and etching processes to process the metal foil 1 into a predetermined shape. After forming the circuit, the laminate 3 is peeled off using the release film 4 layer.

The total thickness of the single-sided printed circuit board laminate integrated with the release film 4 interposed therebetween is preferably 0.8 mm or more.

Function As mentioned above, when manufacturing thin single-sided printed circuit boards with a thickness of 0.6 mm or less, the etching process is performed to reduce the thickness of the single-sided metal foil-covered laminate with a release film interposed therebetween. It is done in a thick state. This increases the rigidity and can suppress the occurrence of warpage and twisting during the etching process.

If the thickness of the laminate integrated with the single-sided metal foil-clad laminate via a release film is less than 0.4 mm, there is no effect of suppressing warpage and twisting. In addition, when the thickness of the single-sided printed circuit board to be obtained is 0.6 mm or less, when the technique according to the present invention is adopted, the effect of suppressing warpage and twisting becomes remarkable.

Examples Release films that can be used in the technology according to the present invention include:
Examples include polyvinyl fluoride, polypropylene, polymethylpentene, and polyvinyl alcohol, but are not particularly limited. In addition, when the release film was polyvinyl alcohol-based, it was preferable because the layer of the release film was less likely to peel off during the circuit processing process. In other words, the polyvinyl alcohol film has an affinity for the hydrophilic group of the resin constituting the laminate, so it has appropriate adhesion to the laminate due to the intermolecular interaction. ing.

Peeling of the laminate after the circuit is formed can be done by inserting a sharp wedge-shaped object into the release film layer on the end surface, or by passing the board through a gap in a group of curls for straightening warpage, and making the board corrugated. This can be easily carried out by The peeled laminate can be used as a reinforcing plate for flexible printed circuit boards, etc., and is not wasted.

Examples 1 to 7, Comparative Examples 1 to 5 A resin-impregnated sheet-like base material (prepreg) was prepared as follows. That is, a glass woven fabric was impregnated with a resin varnish prepared by blending 100 parts by weight of an epoxy resin (trade name Epicote 1001, manufactured by Yuka Shell) with 3 parts by weight of dicyandiamide and 0.5 parts by weight of hensyl dimethylamine, and dried. A prepreg with a resin content of 40% by weight was prepared.

The above prepreg layers were placed on both sides of the mold release film (60 μm! polyvinyl alcohol film), and copper foil was placed on the surface of one of the prepreg layers, which was sandwiched between mirror plates. , temperature 160℃, pressure 30k
The molding was carried out under heat and pressure for 0 minutes at g/d. Then, a single-sided printed circuit board laminate was obtained in which the single-sided copper-clad laminate having the thickness shown in Table 1 and the laminate were integrated with a release film interposed therebetween.

The above laminate was cut into a size of 500 x 500 mm and subjected to conventional printing and etching processes to form a circuit. Thereafter, a sharp wedge-shaped object was inserted into the release film layer on the end face to peel and separate the stacked N plates.

After cutting the laminated board for single-sided printed circuit into 500 x 500 mm (step), the circuit is shaped by printing and etching, and after E-0,5/170 treatment (step 2), the laminated board is peeled off and printed on one side. Table 1 also shows the degree of warpage of each circuit board after it was made into a circuit board (step ①). The size of the sled is
When the laminate is placed on a flat surface, it is expressed as the maximum amount of lift on the four sides.

Conventional Examples 1 to 4 Copper foil was placed on one side of the prepreg layer used in the examples! Then, this was heated and press-molded under the same conditions as in the example to obtain a single-sided copper-clad laminate having the thickness shown in Table 1. Table 1 also shows the amount of warpage after the above-mentioned step and after step ①.

Effects of the Invention As described above, according to the technology of the present invention, the plate thickness is 0.6
When manufacturing a thin single-sided printed circuit board with a thickness of mtn or less, circuit processing can be performed in a thick board state, and the occurrence of warping and twisting can be suppressed.

Further, the laminated board separated after manufacturing the single-sided printed circuit board can be used as an insulating board, a reinforcing board for a flexible printed circuit board, etc., and is not wasted.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the structure of a laminate for a single-sided printed circuit board according to the present invention. 1 is a metal foil, 2 is a single-sided metal foil clad laminate, 3 is a laminate,
4 is release film

Claims (4)

[Claims] 1. A single-sided metal foil-clad laminate with a thickness of 0.6 mm or less, in which metal foil is integrated on one side of a resin-impregnated sheet-like base material layer by heat-pressure molding, and a resin-impregnated sheet-like base material layer. A laminate plate having a thickness of 0.4 mm or more obtained by heat-pressing molding is integrated by the heat-pressing molding via a release film, and this integration is performed so that the metal foil is on the surface. Single-sided printed circuit board laminate. 2. Etching the metal foil of the laminate for a single-sided printed circuit board according to claim 1 to form a predetermined circuit, and then peeling off the laminate on the side opposite to the circuit-forming side with a release film layer. A method for manufacturing a single-sided printed circuit board characterized by: 3. 3. The method for producing a single-sided printed circuit board according to claim 2, wherein the total board thickness before peeling off the laminate on the side opposite to the circuit forming side is 0.8 mm or more. 4. 3. The method of manufacturing a single-sided printed circuit board according to claim 2, wherein the release film is made of polyvinyl alcohol.