JPH0325018B2 - - Google Patents

Info

Publication number
JPH0325018B2
JPH0325018B2 JP746385A JP746385A JPH0325018B2 JP H0325018 B2 JPH0325018 B2 JP H0325018B2 JP 746385 A JP746385 A JP 746385A JP 746385 A JP746385 A JP 746385A JP H0325018 B2 JPH0325018 B2 JP H0325018B2
Authority
JP
Japan
Prior art keywords
cull
frame
belt
carrying
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP746385A
Other languages
Japanese (ja)
Other versions
JPS61168230A (en
Inventor
Kunio Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP746385A priority Critical patent/JPS61168230A/en
Publication of JPS61168230A publication Critical patent/JPS61168230A/en
Publication of JPH0325018B2 publication Critical patent/JPH0325018B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、マルチポツトモールド装置におけ
るパツケージングされたリードフレームとカル
(樹脂部)とを分離し搬出する方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for separating and transporting a packaged lead frame and cull (resin part) in a multi-pot molding device.

〔従来の技術〕[Conventional technology]

現在の一つの動向としてトランスフアーモール
ド金型は、生産効率を上げるために一度の成形で
多数取りを行なうための金型の大型化が採用され
つつある。しかし金型の大型化に伴ないローデイ
ングフレームが重くなり作業の負担が大きくなる
ので、人手による作業を自動化する考えがある。
この自動化方法は文献(「LSI工場自動化」新プ
ロセス技術集成、昭和59、3、31初版発行、発行
人村川順之、製作KKエデイポツク参照)に記載
されているが、設備として大型化になりやすく床
面積効率を低下させるおそれがある。また投資効
率としても悪いが、現状工程を変更しないで比較
的取組みやすい方法である。この方法で完全無人
化を図るには下記の項目の自動化を必要とする。
(a)ローデイングフレームへのリードフレームセツ
ト、(b)ローデイングフレームのモールド金型への
セツト、(c)タブレツト(樹脂)のプリヒートおよ
び金型への投入、(d)モールド装置の作動、(e)パツ
ケージングされたリードフレームとローデイング
フレームの取出し、(f)金型のクリーニング、(g)カ
ル、ランナー、ゲートなどの分離が必要となる。
One of the current trends is that transfer molds are becoming larger in size in order to mold a large number of molds at one time in order to increase production efficiency. However, as the size of the mold increases, the loading frame becomes heavier and the workload becomes heavier, so there is an idea to automate the manual work.
This automation method is described in the literature (see "LSI Factory Automation" New Process Technology Collection, first edition published March 31, 1981, publisher: Yoshiyuki Murakawa, producer: KK Edipock), but it tends to result in larger equipment. This may reduce floor space efficiency. It is also a method that is relatively easy to implement without changing the current process, although it is not efficient in terms of investment. In order to achieve complete unmanned operation using this method, the following items need to be automated.
(a) Setting the lead frame into the loading frame, (b) Setting the loading frame into the mold, (c) Preheating the tablet (resin) and charging it into the mold, (d) Operating the molding device, (e) Removing the packaged lead frame and loading frame, (f) cleaning the mold, and (g) separating the cull, runner, gate, etc.

第3図は上記の工程を経て形成されたICフレ
ームを示す。図において、1はリードフレーム、
2はモールドされたIC、3はゲート部分、4は
カル部である。第4図は上記リードフレーム1と
カル部4、ゲート部分3とを分離して次工程に搬
出する装置を示す。図において、モールド装置よ
りパツケージングされたフレーム1は1対のベル
ト5,5a上に送り込まれ突上げブロツク6で固
定ブロツク7に突当てられる。その後、カル分離
ブロツク8,8aでフレーム1およびカル部4、
ゲート部分3とを分離するためにリードフレーム
1を押下げてフレームとカル、ゲート部分とを分
離し、フレーム1部分のみベルト5,5a上に落
下し、押えベルト9,9aでフレーム1を押えな
がら次工程へ送られる。次に突上げブロツク6で
固定ブロツク7に固定されていたカル部分4が突
上げブロツク6の下降に伴ない傾斜ブロツク10
に当りカル収納ボツクス11に収容される。な
お、12はリードフレーム送りガイド、13は駆
動ベルトである。
FIG. 3 shows an IC frame formed through the above steps. In the figure, 1 is a lead frame;
2 is a molded IC, 3 is a gate part, and 4 is a cull part. FIG. 4 shows an apparatus for separating the lead frame 1, cull portion 4, and gate portion 3 and transporting them to the next process. In the figure, a frame 1 packaged by a molding device is fed onto a pair of belts 5, 5a and abutted against a fixed block 7 by a push-up block 6. After that, the frame 1 and the cull part 4 are separated by the cull separation blocks 8 and 8a.
In order to separate the gate part 3, the lead frame 1 is pushed down to separate the frame, cull, and gate part, and only the frame 1 part falls onto the belts 5, 5a, and the frame 1 is held down by the presser belts 9, 9a. It is then sent to the next process. Next, the cull portion 4 that was fixed to the fixed block 7 by the uplift block 6 is moved to the inclined block 10 as the upthrust block 6 is lowered.
It is stored in the storage box 11. Note that 12 is a lead frame feeding guide, and 13 is a drive belt.

上記のような装置ではカル部分とリードフレー
ムとを分離し不要となつたカル部分を自重落下さ
せていることと、モールド時における樹脂硬化に
よりフレーム全体が弓なりに反るので、これらを
いかに搬出するかが重要である。因みに次工程で
整列されたリードフレーム1はカル分離された残
部がフレーム端部に残るのでバリ取り工程に送ら
れる。
In the above-mentioned equipment, the cull part and lead frame are separated and the unnecessary cull part is allowed to fall under its own weight, and the entire frame warps due to resin curing during molding, so how can these be transported? is important. Incidentally, the lead frame 1 that has been aligned in the next process is sent to the deburring process because the deburred residue remains at the end of the frame.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、上記の装置ではリードフレーム
1とカル部分4、ゲート部分3との分離後、カル
部を落下させて傾斜ブロツク10に当てて収納ボ
ツクス11に収容する際にカルのバリ部分が傾斜
ブロツク10に引掛つて落ちないで次に送られた
リードフレームのカル分離時に突上げブロツクで
押上げられてフレームが変形したり、カル分離ミ
スあるいは搬出ミス等が生じる問題点があつた。
また、カル分離したリードフレームがモールド時
に起つた反り現象を防止するために上部よりフレ
ーム1を押え込むローラが必要となる。
However, in the above device, after separating the lead frame 1 from the cull portion 4 and the gate portion 3, when the cull is dropped and placed against the inclined block 10 and stored in the storage box 11, the burr portion of the cull is removed from the inclined block 10. However, when the next lead frame is separated from the lead frame, it is pushed up by the push-up block and the frame is deformed, resulting in a mistake in the separation of the lead frame or a mistake in carrying out the lead frame.
Furthermore, a roller is required to press down the frame 1 from above in order to prevent the lead frame separated from the cull from warping that occurs during molding.

この発明は、以上述べたようにカル部分の引掛
かりを防止し、確実に除去すべくカル部を強制排
出するようにしてリードフレームの次工程へ支障
なく搬送するようにしたカル分離搬出方法を提供
することを目的とする。
As described above, the present invention provides a method for separating and transporting lead frames by forcibly discharging the cull to prevent the cull from getting caught and to ensure removal, thereby transporting the lead frame to the next process without any trouble. The purpose is to provide.

〔問題点を解決するための手段〕[Means for solving problems]

この発明におけるカル分離搬出方法は、IC部
とカル部とを備えたICフレームのカル部をカル
搬出ベルト上へ、IC部をIC搬出ベルト上へ装填
する工程と、カル部を下部ブロツクで押上げ、上
部ブロツクとの間で挾みつけるようなICフレー
ムを持ち上げる工程と、IC部を押下げカル部か
ら分離してIC搬出ベルト上へ降ろす工程と、カ
ル部を持ち上げた状態でIC部をIC搬出ベルトで
次工程へ搬出する工程と、カル部をカル搬出ベル
ト上へ降ろし搬出する工程とよりなる。
The method for separating and carrying out culls in this invention includes the steps of loading the cull part of an IC frame having an IC part and a cull part onto a cull carrying belt, loading the IC part onto the IC carrying belt, and pushing the cull part with a lower block. The process of lifting the IC frame and sandwiching it between the IC frame and the upper block, the process of pushing down the IC part to separate it from the cull part and lowering it onto the IC carry-out belt, and the process of lifting the IC part with the cull part lifted. It consists of a step of transporting the cull to the next process using a transport belt, and a step of lowering the cull onto the cull transport belt and transporting it.

〔作用〕[Effect]

この発明の作用は、上記各工程を経ることによ
り、カル部が上部ブロツクと下部ブロツクと挾み
付けられた状態でIC部と確実に分離され、そし
てカル部はカル搬出ベルトに降された後、強制的
に排出されるものである。
The function of this invention is that by going through each of the above steps, the cull part is reliably separated from the IC part while being sandwiched between the upper block and the lower block, and after the cull part is unloaded onto the cull carrying belt. , which are forcibly discharged.

〔実施例〕〔Example〕

第1図はこの発明の一実施例を示す各工程図で
あり、第2図は側面図である。図において、1は
モールド装置より送られたIC部、4は左右のIC
部1が連接されているカル部である。14は左右
のIC部1が乗架し搬送されるIC搬出ベルトで、
軸15に支持した左右1対のプーリ16に無端状
に掛回されており、軸15の外端にIC部1の案
内板17を備えている。18はプーリ16の軸1
5に同軸に支持されたプーリ19に掛回したカル
部4の搬出のためのカル搬出ベルト、20はカル
部4を押上げる昇降自在の下部ブロツクである。
この下部ブロツク20の上方には該ブロツク20
と共にカル部4を挾みつける上部ブロツク21が
ある。22はカル部4をIC部1から分離するカ
ル分離ブロツク、23はIC部1をIC搬出ベルト
14の上から迎えてIC部の反りを矯正すると共
に昇降自在の搬出すフレーム搬出ベルトである。
FIG. 1 is a process diagram showing an embodiment of the present invention, and FIG. 2 is a side view. In the figure, 1 is the IC part sent from the molding machine, 4 is the left and right IC
This is the cull part to which part 1 is connected. 14 is an IC transport belt on which the left and right IC sections 1 are mounted and transported;
It is endlessly wound around a pair of left and right pulleys 16 supported on a shaft 15, and a guide plate 17 for the IC section 1 is provided at the outer end of the shaft 15. 18 is the shaft 1 of the pulley 16
A cull carrying belt 20 for carrying out the cull 4 is wound around a pulley 19 coaxially supported at 5, and 20 is a lower block that can be raised and lowered to push up the cull 4.
Above this lower block 20 is the block 20.
There is also an upper block 21 that clamps the cull portion 4. 22 is a cull separation block that separates the cull section 4 from the IC section 1; and 23 is a frame carry-out belt that picks up the IC section 1 from above the IC carry-out belt 14, corrects warping of the IC section, and carries out the frame which can be raised and lowered.

次に各工程図に従つてカル分離搬出方法を説明
する。まず、第1図aに示すようにモールド装置
からIC搬出ベルト14に乗つて送られてきたIC
フレームは、bのように下部ブロツク20の上昇
によりカル部4を押上げて上部ブロツク21と共
に挾み付けてICフレームを持ち上げる。この状
態においてcに示すようにカル分離ブロツク22
を下降してカル部4よりIC部1を分離して該IC
部をIC搬出ベルト14上に落下させ、引続いて
dに示すようにフレーム搬出ベルト23を下降し
てIC部1をIC搬出ベルト14と共に挾んで次工
程へ搬出する。この際IC部1の搬出において該
IC部の反りが矯正される。一方、eに示すよう
に上、下部ブロツク20,21で挾まれて残つた
カル部4は、fのように下部ブロツク20の下降
によりカル搬出ベルト18上に乗り、その後ベル
ト18の回動で搬出されて第2図に示すようにカ
ル部4は排出ボツクス24内に廃棄される。
Next, the method for separating and transporting cals will be explained according to each process diagram. First, as shown in FIG.
As shown in b, as the lower block 20 rises, the frame pushes up the cull portion 4 and is clamped together with the upper block 21 to lift the IC frame. In this state, as shown in c, the cal separation block 22
is lowered to separate the IC part 1 from the cull part 4 and remove the IC.
Then, as shown in d, the frame carrying-out belt 23 is lowered to sandwich the IC part 1 together with the IC carrying-out belt 14 and carried out to the next process. At this time, when carrying out the IC section 1,
The warpage of the IC part is corrected. On the other hand, as shown in e, the remaining cull portion 4 that has been sandwiched between the upper and lower blocks 20 and 21 is placed on the cull delivery belt 18 by the lower block 20 descending as shown in f, and then by the rotation of the belt 18. After being carried out, the cull portion 4 is disposed of in a discharge box 24 as shown in FIG.

このように上記のカル分離搬出方法において
は、IC部1とカル部4とを分離してIC部のみを
先に搬出し、その後からカル部4を強制的に専用
のベルトに乗せて排出するようにしたので、IC
部とカル部とが混在することが全くない。また、
IC部1は搬出ベルト14のフレーム搬出ベルト
23とが挾まれて搬出するようにしたのでIC部
の反り等も搬出中において矯正できる。
In this way, in the above-mentioned cull separation and transport method, the IC section 1 and the cull section 4 are separated and only the IC section is carried out first, and then the cull section 4 is forcibly placed on a special belt and discharged. I did it like this, so the IC
There is no possibility that the part and the cull part are mixed together. Also,
Since the IC part 1 is carried out while being held between the frame carry-out belt 23 of the carry-out belt 14, warping of the IC part can be corrected during carrying out.

〔発明の効果〕〔Effect of the invention〕

以上説明したようにこの発明のカル分離搬出方
法では、カル部を専用のベルトに乗せて強制的に
所定の排出ボツクス内に廃棄できる。また、搬出
に際しカル部を押えたままで先にIC部を次工程
へ搬出し、その後からカル部を搬出するのでIC
部にカル部が混在するようなことも全くなく、一
連の操作が確実に支障なく行なえる。これによつ
て能率よくカル分離が行なえる。
As explained above, in the method for separating and carrying out culls of the present invention, the cull portions can be placed on a special belt and forcibly disposed of in a predetermined discharge box. Also, when carrying out, the IC part is carried out to the next process while holding down the cull part, and then the cull part is carried out, so the IC
There is no possibility that there are any cull parts mixed in, and a series of operations can be carried out reliably and without any problems. This allows efficient cal separation.

【図面の簡単な説明】[Brief explanation of drawings]

第1図a〜fはこの発明の方法を示す各工程
図、第2図は側面図、第3図は従来のリードフレ
ームの平面図、第4図は従来のカル分離方法を示
す図である。 1……IC部、4……カル部、14……IC搬出
ベルト、17……案内板、18……カル搬出ベル
ト、20……下部ブロツク、21……上部ブロツ
ク、22……カル分離ブロツク、23……フレー
ム搬出ベルト。
Fig. 1 a to f are process diagrams showing the method of the present invention, Fig. 2 is a side view, Fig. 3 is a plan view of a conventional lead frame, and Fig. 4 is a diagram showing a conventional cull separation method. . 1...IC section, 4...Cull section, 14...IC carry-out belt, 17...Guidance plate, 18...Cull carry-out belt, 20...Lower block, 21...Upper block, 22...Cull separation block , 23...Frame carry-out belt.

Claims (1)

【特許請求の範囲】[Claims] 1 IC部とカル部とを備えたICフレームのカル
部をカル搬出ベルト上へ、IC部をIC搬出ベルト
上へそれぞれ装填する工程と、カル部を上記カル
搬出ベルトから下部ブロツクで押上げ、かつ上部
ブロツクとの間に挾み込むように上記ICフレー
ムを持ち上げる工程と、ICフレームが持ち上げ
られた状態でIC部を押上げカル部から分離して
上記IC搬出ベルト上へ降ろす工程と、カル部を
持ち上げた状態でIC部をIC搬出ベルトで次の工
程へ搬出する工程、およびカル部をカル搬出ベル
ト上へ降ろし搬出し廃棄する工程とよりなるカル
分離搬出方法。
1 Loading the cull part of an IC frame equipped with an IC part and a cull part onto a cull carrying-out belt, loading the IC part onto the IC carrying-out belt, and pushing the cull part up from the cull carrying belt with a lower block, and a step of lifting the IC frame so as to sandwich it between the IC frame and the upper block, a step of pushing up the IC part while the IC frame is lifted, separating it from the cull part, and lowering it onto the IC carry-out belt. A method for separating and carrying out culls, which comprises the steps of: transporting the IC part with the IC part lifted up to the next process using an IC carry-out belt; and lowering the cull part onto the cull carrying belt, carrying it out, and disposing of it.
JP746385A 1985-01-21 1985-01-21 Separating and carrying method of cull Granted JPS61168230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP746385A JPS61168230A (en) 1985-01-21 1985-01-21 Separating and carrying method of cull

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP746385A JPS61168230A (en) 1985-01-21 1985-01-21 Separating and carrying method of cull

Publications (2)

Publication Number Publication Date
JPS61168230A JPS61168230A (en) 1986-07-29
JPH0325018B2 true JPH0325018B2 (en) 1991-04-04

Family

ID=11666506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP746385A Granted JPS61168230A (en) 1985-01-21 1985-01-21 Separating and carrying method of cull

Country Status (1)

Country Link
JP (1) JPS61168230A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100578509B1 (en) 2004-08-16 2006-05-12 비전세미콘 주식회사 Apparatus for gathering wirechip in wire bonding equipment for semiconductor pakcages
JP5760277B2 (en) * 2011-04-26 2015-08-05 アピックヤマダ株式会社 Degate method, degate device, transfer mold device, and semiconductor package manufacturing method

Also Published As

Publication number Publication date
JPS61168230A (en) 1986-07-29

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