JPH03248598A - Manufacture of circuit block - Google Patents

Abstract

PURPOSE:To improve productivity by mounting circuit components and a shielding case on a printed board, executing solder dipping treatment, cutting connecting sections and separating each circuit block. CONSTITUTION:Slits 4 for mounting shteiding cases 10 are bored respectively so as to surround each mounting region 3 to a printed board 2 while leaving the connecting sections 5 of the mounting regions 3 for a plurality of circuit blocks and a non-mounting region. Circuit components 9 and the shielding cases 10 are mounted to the printed board 2 and solder dipping treatment is executed, all parts including the shielding cases 10 are soldered through one-time solder dipping treatment, and each circuit block is separated through the cutting of the connecting sections 5. Accordingly, productivity can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a method of manufacturing a circuit block, and more particularly to a method of manufacturing a circuit block having a shield case with improved productivity.

B9 Summary of the Invention The present invention relates to a method for manufacturing a circuit block, which is an electric circuit having a predetermined function and surrounded by a shield case for electrically and magnetically shielding, the circuit block being a printed circuit block. A slit for mounting the shield case is formed on the printed circuit board so as to surround each mounting area, leaving a connecting part between the mounting area and the non-mounting area of the plurality of circuit blocks, and the circuit components and the shield case are mounted on the printed circuit board. After mounting and applying solder dip processing, the connecting parts are cut and each circuit block is separated, increasing the productivity of circuit blocks by forming multiple circuit blocks from a single printed circuit board. It is.

C0 Conventional technology A circuit block having a predetermined function is capable of handling electrical or magnetic signals from or to other circuits when the frequency of the signal handled by the circuit block is high or the signal level is minute. must be shielded to prevent negative effects. Particularly in recent years, with the miniaturization of electronic devices, stabilization of performance, close arrangement of circuits, etc., it has become increasingly necessary to electrically and magnetically shield circuit blocks. The magnetic material used for this is one with high electrical conductivity and magnetic permeability in order to limit the conditions for the penetration of magnetic waves. Enclosing blocks is done.

For example, an intermediate frequency amplification circuit, a so-called IF circuit, placed between a tuner circuit and a detection circuit in a television receiver,
The frequency of the signals handled is relatively high, and it is necessary to surround it with a shielding case to prevent electrical and magnetic influences on other circuits. Conventionally, a circuit block surrounded by such a shield case is manufactured through the steps shown in FIG.

In FIG. 7, the first step P1 is a printed circuit board manufacturing step. For example, in order to manufacture two circuit blocks from one printed circuit board, as shown in FIG. A so-called perforation 33 is provided to separate the wiring pattern and the like for the IF circuit.

The second step P2 is a circuit component mounting step, in which an electrical component 32, which is a circuit component, is mounted on a printed circuit board 31, as shown in FIG. Note that all parts that can be automatically inserted are mounted by automatic insertion, but for example, as shown in FIG. 9, the power supply and input/output terminals 36, which cannot be automatically inserted because they are mounted from the side of the printed circuit board, are mounted by automatic insertion. This second
It is not implemented in process P2. In addition, claws 35 provided on the part where the power supply and input/output terminals 36 are mounted and the shield case that supports the printed circuit board and connects the shield case 34 and the ground pattern of the mounting area 30 where components are mounted are soldered. The parts to be attached should be masked to prevent them from getting soldered during the solder dip process.

The third step P3 is a solder dip treatment step, in which the printed circuit board 31 on which the electrical component 32 is mounted is passed through a solder dip bath and soldered.

The fourth step P4 is a circuit block separation step, in which the perforations 33 provided on the printed circuit board 31 are cut with nippers or the like.
A printed circuit board 29 is used for two circuit blocks.

The fifth step P5 is the step of attaching the shield case, and as shown in FIG. The printed circuit board is supported using the provided supporting claws 35. Then, the power supply and input/output terminals 36, which are components that cannot be automatically inserted, are mounted manually.

The sixth step P6 is the second solder dip treatment step,
The printed circuit board 29 with the shield case 34 etc. attached is passed through the solder dip tank again and soldered, and the claws 35 of the shield case 34, the ground pattern of the printed circuit board 29, and the power supply and input/output terminals 3 that could not be automatically inserted are connected again.
Solder 6.

The seventh step P7 is the process of attaching the shield case lid.
As shown in FIG. 10, the upper and lower lids 40 and 41 of the shield case 34 are attached.

The eighth step P8 is a circuit adjustment step, in which, for example, adjustment points such as the AGC of the IF circuit are adjusted to obtain desired characteristics, and the circuit block of the IF circuit is completed.

D1 Problems to be Solved by the Invention As described above, in the conventional circuit block manufacturing method, it is necessary to perform the solder dip process twice, and furthermore, it is difficult to achieve 100% automatic insertion including the shield case. This resulted in poor production efficiency. In addition, the circuit characteristics with the shield case attached can be determined by dividing each circuit block.
Adjustment could only be made after the second solder dip process, that is, for each individual circuit block.

The present invention has been made in view of the above circumstances, and provides a highly productive method for manufacturing circuit blocks that can solder all components including the shield case in one solder dip process. For the purpose of providing.

A method for manufacturing a circuit block according to the present invention is a method for manufacturing a circuit block that is an electric circuit having a predetermined function and surrounded by a shield case for electrically and magnetically shielding. Then, the slits for mounting the shield case are formed on the printed circuit board so as to surround each mounting area, leaving a connecting part between the mounting area and the non-mounting area of the plurality of circuit blocks, and the circuit configuration is formed on the printed circuit board. After mounting the components and the above-mentioned shield case and performing a solder dip process, the above-mentioned connecting portions are cut to separate each circuit block, and a plurality of circuit blocks are formed from one printed circuit board.
Solve the above issues.

F0 effect In the method for manufacturing a circuit block according to the present invention, slits for mounting the shield case are formed in the printed circuit board so as to surround each mounting area, leaving a connecting part between the mounting area and the non-mounting area of a plurality of circuit blocks. After installing the circuit components and the shield case on the printed circuit board and applying a solder dip process, all the components including the shield case are soldered in one solder dip process, and then the above connection part is cut. to separate each circuit block.

G. Example Hereinafter, an example of manufacturing a circuit block to which the method for manufacturing a circuit block according to the present invention is applied will be described with reference to the drawings.

FIG. 1 is a process diagram for explaining a method of manufacturing a circuit block.

The circuit block manufactured in this embodiment is, for example, a so-called intermediate frequency amplification circuit (IF circuit) of a television receiver, etc., and the frequency of the signal handled is relatively high, and the circuit block is electrically and magnetically connected to other circuits. It is necessary to prevent negative impacts. That is, the circuit block of the IF circuit is surrounded by a shield case for electrically and magnetically shielding.

In FIG. 1, the first process P1 is a printed circuit board manufacturing process. For example, in order to manufacture nine IF circuits (hereinafter referred to as circuit blocks) from one printed circuit board, the second
As shown in the figure, one printed circuit board 2 is provided with wiring patterns for nine circuit blocks. FIG. 3 is a schematic perspective view enlarging a part of the printed circuit board 2. As shown in FIG. That is, the printed circuit board 2 is provided with so-called bare holes, through holes, and wiring patterns for mounting electrical components (hereinafter, the area where the wiring patterns etc. are provided will be referred to as the mounting area 3).
), and as shown in FIG. A slit 4 is made. Further, this shield case 10 is provided with a notch 15 corresponding to the connecting portion 5 so that the lower side of the shield case 10 facing the printed circuit board 2 can protrude through the slit 4 to the back side of the printed circuit board 2. .

The second step P2 is a component mounting step, and as shown in FIG. 4, each shield case 10 and each electric component 9 are mounted on the printed circuit board 2 provided with the slit 4 etc. for the shield case 10. At this time, the power supply and input/output terminals may be, for example, an angled multi-bin connector 11 as shown in FIG. 3, and the multi-bin connector 11 may be mounted on the printed circuit board 2 from above. , this multi-bin connector 11 for power supply and input/output terminals can also be automatically inserted. As a result, there is no need for masking to prevent solder from attaching during the first solder dip treatment in the conventional circuit block manufacturing process described above.

The third step P3 is a solder dip treatment step, in which the printed circuit board 2 on which each of the shield cases 1O and the electrical components 9 are mounted is passed through a solder dip bath, the electrical components 9 are soldered, and the electrical components 9 are soldered. The projection piece 16 of the shield case 10 inserted into the notch 6 of the mounting area 3 for connecting the shown shield case 10 to the ground pattern of the mounting area 3 is soldered. That is, since all components including the shield case 10 and the multi-pin connector 11 such as power supply terminals are mounted before the solder dip process, the solder dip process is performed only once.

The fourth step P4 is the step of attaching the top cover, in which the shield case 10 of each circuit block after the solder dipping process is
Attach the top cover 12 of the shield 10 shown in FIG. 6, which will be described later.

The fifth step P5 is a circuit adjustment step, in which the AG of each circuit block to which the upper lid 12 is attached, for example, the IF circuit.
Make adjustments such as C. That is, the circuit adjustment of the circuit block can be performed with the shield case 10 and the top cover 12 of the shield case 10 attached. Furthermore, in the state before each circuit block is separated, nine circuit blocks can be set in a test jig etc. with a single operation, and adjustment of nine circuit blocks can be performed simultaneously. , it is possible to efficiently handle circuit blocks.

The sixth process P6 is a circuit block separation process, and as shown in FIG.
0 is used to cut the connecting portion 5 that connects the mounting area 3 and non-mounting area for each circuit block of the printed circuit board 2, and nine circuit blocks are separated at a time.

The seventh step P7 is the step of attaching the lower cover, and as shown in FIG.
The lower cover 13 is attached to complete the circuit block 1 shielded by the shield case 10 and the upper and lower covers 12 and 13 of the shield case 10.

In this way, mounting areas 3 for a plurality of circuit blocks are provided on one printed circuit board 2, and the shield case 10 is mounted so as to surround each mounting area 3, leaving a connection part 5 between these mounting areas 3 and non-mounting areas. By drilling the slits 4 for the shield case 10 when mounting components,
All parts, including , can be inserted automatically. Further, by mounting all the electric circuit components 9 and the shield case 10 on the printed circuit board 2 and performing the solder dip process, the solder dip process can be performed only once. In addition, by attaching the top cover 12 of the shield case 10 to each circuit block l after soldering using a solder dip process,
The circuit blocks 1 can be handled efficiently, such as by being able to adjust the AGC, etc. of the 9 circuit blocks 1 with the shield case 10 and top cover 12 attached before each circuit block 1 is separated. be able to.

Further, the connecting portion 5 can be easily cut using the jig 20, and nine circuit blocks 1 can be separated at one time.

Furthermore, by providing the mounting area 3 for a plurality of circuit boards 1 on one printed circuit board 2 as described above, the width of the printed circuit board 2 can be made to match the standard width of the manufacturer, and the manufacturing line It can be adapted to conveyors installed in By the way, in conventional manufacturing methods, if the printed circuit board is made too large, the printed circuit board will warp during the solder dip process, and when the shield case is later attached, there will be gaps between the claws of the shield case and the printed circuit board, making it impossible to ground the shield case. However, as mentioned above, by attaching the shield case 10 before the solder dip process, the shield case 1o has the effect of preventing warping, and the printed circuit board 2
It is possible to prevent the printed circuit board 2 from warping during solder dip processing due to the increase in the solder depth.

That is, it is possible to provide a method for manufacturing a circuit block with high productivity.

It should be noted that the present invention is not limited to the above-mentioned embodiments, and can be applied to circuit blocks other than IF circuits, such as so-called RF circuits and tuner circuits.

Effects of the H0 Invention As is clear from the above explanation, the method for manufacturing a circuit block according to the present invention manufactures a circuit block that is surrounded by a shield case for electrically and magnetically shielding and has a predetermined function. When installing the shield case, the shield case can be mounted by drilling slits for mounting the shield case on the printed circuit board so as to surround each mounting area while leaving a connecting part between the mounting area and the non-mounting area of the plurality of circuit blocks. All parts can be inserted automatically.

Further, by mounting all the circuit components and the shield case on the printed circuit board and performing the solder dip process, all the components can be soldered in one solder dip process. In addition, by attaching the top cover of the shield case to each circuit block after solder dip processing, it is possible to adjust multiple circuit blocks with the shield case attached before each circuit block is separated. Blocks can be handled efficiently.

Further, the connecting portion can be easily cut using a jig or the like, and a plurality of circuit blocks can be formed at one time.

Furthermore, by mounting multiple circuit blocks on a single printed circuit board, the width of the printed circuit board can match the manufacturer's standard width, making it easier to fit the conveyor installed on the production line. can. Furthermore, a shield case can be attached before the solder dip process, and it is possible to prevent the printed circuit board from warping during the solder dip process.

That is, it is possible to provide a method for manufacturing a circuit block with high productivity.

[Brief explanation of drawings]

FIG. 1 is a process diagram for explaining the method of manufacturing a circuit block according to the present invention, FIG. 2 is a schematic perspective view of a printed circuit board used in the present invention, and FIG. FIG. 4 is a schematic perspective view of a printed circuit board on which a shield case and circuit components are mounted, and FIG. 5 shows each circuit block. FIG. 6 is a schematic front view of a jig for separating, FIG. 6 is a schematic perspective view of a circuit block for explaining the process of attaching the lower cover of the shield case, and FIG. 7 is a conventional perspective view of a circuit block. FIG. 8 is a schematic perspective view of a printed circuit board for explaining a component mounting process in a conventional manufacturing method, and FIG. 9 is a process diagram for explaining a method for manufacturing a circuit block. The shield case mounting method in the method is a schematic perspective view of a circuit block for explaining the process, and FIG. 10 is a circuit block diagram for explaining the process for attaching the upper and lower lids of the shield case in the conventional manufacturing method. FIG. Circuit block printed circuit board mounting area Slit connection area Shield case Upper cover 13 of the shield case Lower cover of the shield case

Claims (1)

[Claims] A method for manufacturing a circuit block, which is an electric circuit having a predetermined function and surrounded by a shield case for electrically and magnetically shielding, comprising: a mounting area of a plurality of circuit blocks on a printed circuit board; A slit for mounting the shield case is formed so as to surround each mounting area, leaving a connecting part between the board and the non-mounting area, and the circuit components and the shield case are mounted on the printed circuit board, and a solder dip process is performed. 1. A method of manufacturing a circuit block, comprising: forming a plurality of circuit blocks from one printed circuit board by cutting the connecting portions and separating each circuit block.