JPS6059825A - Manufacture of high frequency equipment - Google Patents
Manufacture of high frequency equipmentInfo
- Publication number
- JPS6059825A JPS6059825A JP16881383A JP16881383A JPS6059825A JP S6059825 A JPS6059825 A JP S6059825A JP 16881383 A JP16881383 A JP 16881383A JP 16881383 A JP16881383 A JP 16881383A JP S6059825 A JPS6059825 A JP S6059825A
- Authority
- JP
- Japan
- Prior art keywords
- board
- soldering
- frame
- frame body
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Receivers (AREA)
Abstract
Description
【発明の詳細な説明】
ＶＨＦチューナー、ＲＦモジュレーター等の高周波回路
をシールドする高周波機器の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing high frequency equipment that shields high frequency circuits such as VHF tuners and RF modulators.
この判ｌの高周波機器の製造方法は第１図に示すように
、まず電子部品の端子１を複数取り用基板２に差し込み
、電子部品の端子１と基板２とを半田付けし、この電子
部品を装着した基板２を分割して複数の分＝’ｌ した
基板２ａを得て、この各基板ムを第２図に示すように各
々枠体３にそれぞれ取り付は半田付けにより固定してい
る。しかしながら、従来の方法では電子部品の端子１と
基板２との半田付は工程、及び基板２ａと枠体３との半
田付は工程と、２度半田付は作業を要すため、捷だ各枠
体と分割された基板との半田付けが別々なため、生産効
率を低下させる州に々る。As shown in Figure 1, the manufacturing method for this sized high-frequency device is as follows: First, the terminal 1 of the electronic component is inserted into the board 2 for multiple mounting, the terminal 1 of the electronic component and the board 2 are soldered, and the electronic component The board 2 on which is mounted is divided to obtain a plurality of boards 2a, each of which is fixed to the frame 3 by soldering as shown in Figure 2. . However, in the conventional method, soldering the terminal 1 of the electronic component and the board 2 requires a process, and soldering the board 2a and the frame 3 requires a process, and soldering twice requires work. Since the frame body and the divided board are soldered separately, this reduces production efficiency.
そこで、本発明は上記従来の問題点に着目してなされた
ものであり、電子部品の端子と基板との半田付は及び基
板と枠体との半田付けを同時に行う事により生産効率を
向上させる高周波機器の製造方法を提供することを目的
としている。Therefore, the present invention has been made by focusing on the above-mentioned conventional problems, and improves production efficiency by simultaneously soldering the terminals of electronic components to the board and soldering the board to the frame. The purpose is to provide a method for manufacturing high frequency equipment.
本発明による高周波機器の製造方法は枠体の挿入を基板
の分割の前に行う事により複数取り用基板に於ける電子
部品の端子と基板との半田付は及び基板と枠体との半田
付けを同時に行う事を可能にしたものである。The method for manufacturing high-frequency equipment according to the present invention inserts the frame before dividing the board, so that soldering between terminals of electronic components and the board in a multi-board board and soldering between the board and the frame is performed. This makes it possible to do both at the same time.
以下本発明の１実施例を第３図以下の図面によって説明
する。第３図は枠体と複数取り用基板との絹込み前の状
態を示す斜視図である。枠体１０は金属板を四角筒状に
成形したものである。枠体１０の下端には後述する基板
に枠体１ρを挿入する際の位置決めを行い、また基板に
挿入後半田付けにより基板と枠体１０とを固定するため
の脚片１１が複数個設けである。１２は基板で、この基
板１２は複数個取りされ、分割される回路基板１２ａの
外縁部に複数１β１の角状の挿入孔１３を設は枠体１０
の脚片１１が挿入出来る様になっている。また、この基
板１２ａの外縁部にはミシン目、凹溝等の切断部１４が
形成されている。即ち、切断部１４は枠体１０の下端に
略沿って格子状に形成されている。An embodiment of the present invention will be described below with reference to FIG. 3 and the subsequent drawings. FIG. 3 is a perspective view showing the state of the frame body and the multi-capture board before they are tied together. The frame body 10 is a metal plate formed into a rectangular tube shape. A plurality of leg pieces 11 are provided at the lower end of the frame 10 for positioning when inserting the frame 1ρ into a board to be described later, and for fixing the board and the frame 10 by soldering after insertion into the board. be. Reference numeral 12 denotes a board, and a plurality of boards 12 are taken out, and a plurality of angular insertion holes 13 of 1β1 are provided at the outer edge of the divided circuit board 12a.
The leg piece 11 can be inserted. Further, a cut portion 14 such as a perforation or a groove is formed on the outer edge of the substrate 12a. That is, the cutting portions 14 are formed in a lattice shape approximately along the lower end of the frame 10.
次に本発明の製造方法を説明すると、第４図に示すよう
に、基板１２の挿入孔１３に枠体１０の脚片１１を挿入
して、位置決めするとともに、基板１２に電子部部品の
端子１５を挿入する。その後、この基板１２を搬送して
半田槽上を通過させ、電子部品の端子１５と基板１２の
銅箔部、及び基板１２の銅箔部と枠体１０の脚片１１を
それぞれ同時に半田１６付けする。Next, to explain the manufacturing method of the present invention, as shown in FIG. Insert 15. Thereafter, the board 12 is transported and passed over a solder bath, and the terminals 15 of the electronic components and the copper foil part of the board 12, and the copper foil part of the board 12 and the leg pieces 11 of the frame 10 are soldered 16 at the same time. do.
次に基板１２を切断部１４を切り離し、高周波機器を得
るものでおる。Next, the substrate 12 is cut off at the cut portion 14 to obtain a high frequency device.
以上の様に本考案によれば、枠体の下端に脚片を設は複
数ケ取りした基板に挿入孔を設ける事により、複数ケ取
りの基板に枠体を取ｐ付けた状態で半田付けを行う事が
出来る。よって部品の半田付けと同時に行う事が出来、
生産効率の向上となる。As described above, according to the present invention, by providing the leg pieces at the lower end of the frame and providing insertion holes in the board with multiple holes, the frame can be soldered with the frame attached to the board with multiple holes. can be done. Therefore, it can be done at the same time as soldering the parts.
This will improve production efficiency.
第１図及び第２図は従来高周波機器の製造工程を示す説
明図、第３図以下は本発明の一実施例を示し、第３図は
組込み前の斜視図、第４図及び第５図は同製造工程を示
す説明図である。Figures 1 and 2 are explanatory diagrams showing the manufacturing process of conventional high-frequency equipment, Figure 3 and the following diagrams show an embodiment of the present invention, Figure 3 is a perspective view before assembly, Figures 4 and 5 is an explanatory diagram showing the same manufacturing process.
Claims (1)
した金属の枠体を電子部品の端子に差し込んだ複数取り
用基板に形成した挿入孔に挿入し、その後電子部品の端
子と基板、及び基板と枠体とを同時に半田付けし、複数
取り用基板に形成したミシン目、凹溝等の切断部で取付
けた複数取９用基板を切り離して分割することを特徴と
する高周波機器の製造方法。A metal frame housing the A+ frequency circuit board and having leg pieces protruding from the lower end is inserted into the insertion hole formed in the multi-insertion board that is inserted into the terminal of the electronic component, and then the terminal of the electronic component and the board are inserted. A method for manufacturing a high-frequency device, characterized by simultaneously soldering a board and a frame body, and separating and dividing the board for multiple mounting 9, which is attached at a cutting part such as a perforation or groove formed on the board for multi-mounting. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16881383A JPS6059825A (en) | 1983-09-13 | 1983-09-13 | Manufacture of high frequency equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16881383A JPS6059825A (en) | 1983-09-13 | 1983-09-13 | Manufacture of high frequency equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6059825A true JPS6059825A (en) | 1985-04-06 |
Family
ID=15874966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16881383A Pending JPS6059825A (en) | 1983-09-13 | 1983-09-13 | Manufacture of high frequency equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059825A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581875A (en) * | 1994-02-18 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Method of manufacturing circuit module |
-
1983
- 1983-09-13 JP JP16881383A patent/JPS6059825A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5581875A (en) * | 1994-02-18 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Method of manufacturing circuit module |
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