JPH08148797A - Printed wiring board and its manufacture - Google Patents

Abstract

PURPOSE: To prevent parts from peeling and the like due to mechanical stress and thermal stress by making a printed wiring board with ease and at low cost and providing an excellent soldering strength of inserting parts. CONSTITUTION: In a shape in which the diameter of an opening gradually increases from the approximate center of the thickness direction of an insulating substrate 21 toward a soldering surface 21b side which is on the other side of an inserting part mounting side, and at the same time in which the diameter of the opening gradually increases from the approximate center of the thickness direction of the insulating substrate 21 toward an inserting part mounting surface 21a side, a terminal part 24 of an inserting part 23 is inserted from the inserting part mounting surface 21a side into a through hole 22 in which a copper foil 26 is formed from the periphery of the opening 22a on the soldering surface 21b side toward an internal wall 22b. And the terminal tip 24a is secured by a solder 25 on the soldering surface 21b side. The through hole shape may be such that its opening diameter gradually increases from the inserting part mounting side to ward the opposite side of the inserting part mounting side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a through hole formed in an insulating substrate, and a terminal portion of an insert component is inserted through the through hole formed in the insulating substrate. The present invention relates to a printed wiring board fixed by solder and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in various electronic devices such as a television receiver, a radio receiver, a cassette tape recorder, etc., a printed wiring formed with a predetermined wiring circuit for mounting a number of insertion parts such as electronic parts. Boards are often used.

In the above printed wiring board,
In order to mount the insertion part, the insulating substrate on which a predetermined wiring circuit pattern is formed is simply punched out, the inner wall surface is made of an insulating substrate material, and a through hole called a plane hole is formed, and the insertion part is inserted into this through hole. The terminal part is inserted, and the tip part of the terminal is soldered to the copper foil forming a part of the wiring circuit pattern to mount the insertion part.

As the method of forming the through holes, there are methods such as drilling, laser processing, etching, electron beam, press working, and the like. General and mainstream.

[0005]

However, in the above-mentioned printed wiring board, the soldering strength of the insertion parts is weak and there is a disadvantage that peeling occurs due to mechanical stress and thermal stress.

By the way, in recent years, plated through holes for electrically connecting between wiring circuit patterns of a printed wiring board on which wiring circuit patterns are formed on both surfaces of an insulating substrate are also used as through holes for mounting insertion parts. It is also suggested to do so. In this way, the solder for fixing the terminal tip of the insertion part is arranged on the plating layer, which is the metal layer of the plating through hole, and the soldering strength is good, and mechanical stress and mechanical stress No peeling occurs due to heat stress or the like.

However, the manufacturing process of the printed wiring board having the plated through holes is complicated and the manufacturing cost is high. Therefore, in a printed wiring board that can be manufactured easily and inexpensively, such as a printed wiring board having a through hole for mounting the above-mentioned inserted component, it is desired to improve the soldering strength of the inserted component.

Therefore, the present invention has been proposed in view of the conventional circumstances, and is easy and inexpensive to manufacture, and
An object of the present invention is to provide a printed wiring board in which the soldering strength of the inserted component is good and peeling or the like does not occur due to mechanical stress or thermal stress, and a method for manufacturing the same.

[0009]

In order to solve the above-mentioned problems, the present inventor has conducted extensive studies, and as a result, even in a printed wiring board having a through hole for mounting an insertion component, the terminal tip portion of the insertion component is inserted into the insertion component. When fixing with solder on the side opposite to the mounting side, if the area of the copper foil part where the solder is placed is enlarged, soldering is performed in the same way as when the plated through hole is also used as a through hole for mounting the insertion part. It has been found that the strength can be improved.

That is, according to the first aspect of the present invention, the through hole is formed in the insulating substrate, and the terminal tip portion of the insertion part inserted from one surface to the other surface through the through hole is In the printed wiring board that is fixed by solder on the side opposite to the insertion component mounting side, the opening diameter gradually becomes larger as the through hole goes from the insertion component mounting side to the side opposite to the insertion component mounting side. It is characterized in that a copper foil is formed over the inner wall surface from the peripheral portion of the opening on the side opposite to the side where the insertion component is mounted of the through hole.

Further, according to a second aspect of the present invention, a through hole is formed in the insulating substrate, and a terminal tip portion of an insertion part to be inserted from one surface to the other surface through the through hole is provided. In the printed wiring board that is fixed by solder on the side opposite to the side on which the insert component is mounted, the through hole has a diameter that gradually increases from the approximate center in the thickness direction of the insulating substrate to the side opposite to the side on which the insert component is mounted. Has a large diameter, and the opening diameter gradually becomes larger as it goes from the approximate center in the thickness direction of the insulating substrate to the mounting part mounting side,
It is characterized in that a copper foil is formed from the peripheral portion of the opening on the side opposite to the side where the through-hole is mounted to the through hole to the inner wall surface.

As a result of further intensive studies by the present inventors, in order to form the through hole of the printed wiring board of the present invention as described above, the insulating substrate is formed into a substantially conical shape together with the copper foil on the insulating substrate. It was found that it can be easily formed by punching with a pin.

That is, as a method of manufacturing a printed wiring board according to the first aspect of the present invention, an insulating substrate on which a copper foil is formed on a surface opposite to the insertion component mounting side is used as the insertion component mounting side. Is punched from the opposite side together with the copper foil with a substantially conical pin, and the opening diameter gradually increases from the side where the insertion component is mounted to the side opposite to the side where the insertion component is mounted. A step of forming a through hole formed by forming a copper foil from the opening peripheral portion on the opposite side to the inner wall surface, and through the through hole from the insertion component mounting side to the side opposite to the insertion component mounting side. The step of inserting the terminal part of the insertion part and the terminal tip part of the insertion part is fixed to the copper foil formed over the inner wall surface from the opening peripheral part of the through hole on the side opposite to the insertion part mounting side by soldering. Those with processes are listed It is.

As a method of manufacturing a printed wiring board according to the second aspect of the present invention, the insertion component mounting side is formed on an insulating substrate having a copper foil formed on the surface opposite to the insertion component mounting side. A step of forming a through hole whose opening diameter is increased from the opposite side to the insertion part mounting side, and the insulating substrate is formed from the side opposite to the insertion part mounting side together with the copper foil into a substantially conical pin. Punching out, the opening diameter gradually increases from the approximate center in the thickness direction of the insulating substrate to the side opposite to the mounting side of the insertion component, and the insertion component mounting side from the approximate center of the insulating substrate in the thickness direction. A step of forming a through hole formed by forming a copper foil over the inner wall surface from the peripheral portion of the opening on the side opposite to the side where the insertion component is mounted, Inserted from the component mounting side The step of inserting the terminal part of the insertion part through the through hole to the side opposite to the mounting side, and the terminal tip part of the insertion part, the opening peripheral edge part of the through hole on the side opposite to the insertion part mounting side. To a copper foil formed over the inner wall surface to the inner wall surface of the copper foil.

[0015]

In the printed wiring board of the present invention, the opening diameter gradually increases from the insertion component mounting side to the side opposite to the insertion component mounting side. Insert the terminal part of the insertion part from the insertion part mounting side into the through hole where the copper foil is formed from the peripheral part of the opening part to the inner wall surface, and fix the terminal tip part with solder on the side opposite to the insertion part mounting side. Therefore, the solder is arranged on the copper foil formed from the peripheral portion of the opening of the through hole to the inner wall surface, and the soldering area is larger than that of the conventional printed wiring board, and the soldering strength is improved.

Further, in the printed wiring board of the present invention, the opening diameter is gradually increased and the thickness of the insulating substrate is increased from the approximate center in the thickness direction of the insulating substrate to the side opposite to the mounting side of the inserted component. A shape in which the opening diameter gradually increases from the substantially center in the vertical direction toward the insertion component mounting side, and a copper foil is formed from the opening peripheral portion on the side opposite to the insertion component mounting side to the inner wall surface. Insert the terminal part of the insertion part from the insertion part mounting side into the through hole, and fix the terminal tip part with solder on the side opposite to the insertion part mounting side. Since it is arranged on the formed copper foil, the soldering area is larger than the conventional printed wiring board, and the soldering strength is improved. Further, in this printed wiring board, the through-hole has a shape in which the opening diameter gradually increases from the approximate center in the thickness direction of the insulating substrate toward the insertion component mounting side, so that the terminal portion of the insertion component is Is easy to insert.

Furthermore, in these printed wiring boards of the present invention, the through-hole has an opening diameter that gradually increases from the component mounting side or substantially the center in the thickness direction of the insulating substrate to the side opposite to the insertion component mounting side. Has a large diameter, it is easy for the solder to enter the through holes when the solder is supplied, which also improves the soldering strength.

When manufacturing the printed wiring board of the present invention, if the insulating substrate together with the copper foil on the side opposite to the insertion component mounting side is punched out by a substantially conical pin, the insertion component mounting side is inserted. A through hole having a shape whose opening diameter is gradually increased toward the opposite side is punched out, and the copper foil on the side opposite to the insertion component mounting side is pushed into the through hole, The copper foil is easily formed from the peripheral portion of the opening to the inner wall surface.

Further, when manufacturing the printed wiring board of the present invention, a through hole having an opening diameter increasing from the side opposite to the insertion component mounting side to the insertion component mounting side is formed in the insulating substrate. After that, if the through hole is formed by punching the through hole forming position from the side opposite to the insertion component mounting side with a substantially conical pin, the side opposite to the insertion component mounting side from the approximate center in the thickness direction of the insulating substrate. The opening diameter gradually becomes larger as it goes to, and the opening diameter becomes gradually larger as it goes from the approximate center in the thickness direction of the insulating substrate to the insertion component mounting side. A through hole for forming a copper foil is easily formed from the peripheral edge of the opening on the opposite side to the inner wall surface.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed wiring board to which the present invention is applied and a method for manufacturing the same will be described below in detail with reference to the drawings.

Example 1 As shown in FIG. 1, the printed wiring board of this example has through holes 2 formed in an insulating substrate 1 on one side of which a wiring circuit pattern (not shown) is formed, and one side of the printed circuit board is formed. The terminal portion 4 of the insertion component 3 is inserted from the la 1a into the other surface 1b where the wiring circuit pattern is formed through the through hole 2, and the terminal tip 4a of the insertion component 3 is opposite to the insertion component mounting side. The other surface 1b, which is the side surface (hereinafter referred to as the soldering surface 1b), is fixed by the solder 5.

In the printed wiring board of this embodiment, the through-hole 2 is located on the soldering surface 1b side from the one surface 1a which is the insertion component mounting side (hereinafter referred to as the insertion component mounting surface 1a). The diameter of the opening is gradually increased as it goes to.

Further, in the printed wiring board of this embodiment, the copper foil 6 is formed as the land portion of the wiring circuit pattern from the peripheral portion of the opening 2a of the through hole 2 on the soldering surface 1b side to the inner wall surface 2b. The terminal tip portion 4a is soldered to the copper foil 6.

In the printed wiring board of the present embodiment, the solder resist layer 7 is arranged on the portion of the copper foil 6 which does not require soldering.

Therefore, in the printed wiring board of this embodiment, the solder 5 for fixing the terminal tip portion 4a of the insertion component 3 is formed on the inner wall surface 2b from the peripheral portion of the opening 2a of the through hole 2. Since it will be placed on the foil 6, the soldering area is larger than the conventional printed wiring board,
The soldering strength is improved, and peeling or the like does not occur due to mechanical stress or thermal stress.

Further, in the printed wiring board of this embodiment, since the through hole 2 has a shape in which the opening diameter gradually increases from the insertion component mounting surface 1a side to the soldering surface 1b side. The solder 5 that fixes the terminal tip 4a of the insertion part 3 easily enters the through hole 2, which also improves the soldering strength and causes peeling or the like due to mechanical stress, thermal stress, or the like. Nor.

Next, the method for manufacturing the printed wiring board of the present embodiment will be described in the order of steps. That is, first, the insulating substrate 1 on which the copper foil 6 and the solder resist layer 7 forming the wiring circuit pattern are formed only on the soldering surface 1b as shown in FIG. 2 is prepared.

Then, as shown in FIG. 2, the insulating substrate 1 is arranged in the press machine in which the taper pin 8 and the die plate 9 are arranged so as to face each other so that the soldering surface 1b is on the taper pin 8 side. To do.

At this time, the tapered pin 8 has a shape in which a guide portion 8b having a substantially cylindrical shape is provided at the apex of a pin body 8a having a substantially conical shape, and the guide portion 8b can be inserted into the die plate 9. A guide 10 which is a large hole portion is formed, and these are arranged so as to face the position where the guide portion 8b can be inserted into the guide 10.

That is, when the taper pin 8 is lowered downward in the drawing, the insulating substrate 1 is pressed and punched into a substantially conical shape of the pin body 8a, and the guide portion 8b is fitted into the guide 10. .

Therefore, the insulating substrate 1 after punching has
As shown in FIG. 3, a so-called mortar-shaped through hole 2 is formed whose opening diameter gradually increases from the insertion component mounting surface 1a side to the soldering surface 1b side.

At this time, the taper pin 8 causes
The copper foil 6 on the soldering surface 1b side of the insulating substrate 1 is pushed into the through hole 2 to form the copper foil 6 from the peripheral portion of the opening 2a of the through hole 2 to the inner wall surface 2b.

Then, the terminal portion 4 of the insertion component 3 is inserted from the insertion component mounting surface 1a side to the soldering surface 1b side through the through hole 2, and the terminal tip portion 4a of the insertion component 3 is
The printed wiring board of this embodiment as shown in FIG. 1 is completed by fixing with solder 5 to a copper foil 6 formed from the peripheral portion of the opening 2a of the through hole 2 on the soldering surface 1b side to the inner wall surface 2b.

Therefore, in the method for manufacturing a printed wiring board according to the present embodiment, punching is performed from the soldering surface 1b side by press working so that the soldering surface 1b side gradually becomes closer to the soldering surface 1b side. The through hole 2 having a large opening diameter can be easily formed, and the productivity is high.

Further, in the method of manufacturing a printed wiring board of this embodiment, since the through hole 2 is formed by pressing and punching from the soldering surface 1b side, the soldering surface 1b is formed.
The copper foil 6 on the side is pushed into the through hole 2 and the through hole 2
The copper foil 6 is easily formed from the peripheral edge of the opening 2a to the inner wall surface 2b, and the productivity is high.

Embodiment 2 As shown in FIG. 4, the printed wiring board of this embodiment penetrates the insulating substrate 21 having a wiring circuit pattern (not shown) formed on only one side, as in the printed wiring board of Embodiment 1. Hole 2
2 is formed, the terminal portion 24 of the insert component 23 is inserted from the insert component mounting surface 21a to the soldering surface 21b on which the wiring circuit pattern is formed through the through hole 22, and the terminal of the insert component 23 is formed. The tip portion 24a is fixed by the solder 25 on the soldering surface 21b.

In the printed wiring board of this embodiment, the through hole 22 has an opening diameter gradually increasing from the approximate center of the insulating substrate 21 in the thickness direction toward the soldering surface 21b. At the same time, the opening diameter is gradually increased from the approximate center of the insulating substrate 21 in the thickness direction toward the insertion component mounting surface 21a side.

Further, in the printed wiring board of the present embodiment, the opening 22 of the through hole 22 on the soldering surface 21b side.
A copper foil 26 is formed as a land portion of a wiring circuit pattern from the peripheral edge portion of a to the inner wall surface 22b, and the terminal tip portion 24a is soldered to the copper foil 26.

In the printed wiring board of the present embodiment, the solder resist layer 27 is provided on the portion of the copper foil 26 which does not require soldering.

Therefore, in the printed wiring board of this embodiment, the solder 25 for fixing the terminal tip end portion 24a of the insertion part 23 is formed on the inner wall surface 22b from the peripheral edge portion of the opening 22a of the through hole 22. Since it is arranged on the foil 26, the soldering area is larger than that of the conventional printed wiring board, the soldering strength is improved, and peeling or the like does not occur due to mechanical stress or thermal stress.

Further, in the printed wiring board of the present embodiment, the through hole 22 has an opening diameter gradually increasing from the substantially center in the thickness direction of the insulating substrate 21 toward the soldering surface 21b side. Since the opening diameter of the insulating substrate 21 gradually increases from the approximate center in the thickness direction of the insulating substrate 21 to the insertion component mounting surface 21a side, the terminal tip portion 24a of the insertion component 23 is fixed. Solder 25
However, it is easy to enter the through hole 22, which also improves the soldering strength and prevents peeling or the like due to mechanical stress, thermal stress, or the like.

Furthermore, in the printed wiring board of this embodiment, since the through hole 22 has the above-mentioned shape, the insertion of the terminal portion 24 of the insert component 23 from the insert component mounting surface 21a side becomes easy.

Next, the method for manufacturing the printed wiring board of the present embodiment will be described in the order of steps. That is, first, the insulating substrate 21 on which the copper foil 26 and the solder resist layer 27 forming the wiring circuit pattern are formed only on the soldering surface 21b as shown in FIG. 5 is prepared.

Then, as shown in FIG. 5, the insertion part mounting surface 21a is placed on the primary taper pin 28 side in the press machine in which the primary taper pin 28 and the die plate 29 are arranged so as to face each other. The insulating substrate 21 is arranged in

At this time, the primary taper pin 28 has a shape in which a guide portion 28b having a substantially cylindrical shape is provided at the apex of a pin body 28a having a substantially conical shape, and the die plate 2 is used.
A guide 30 that is a hole portion into which the guide portion 28b can be inserted is formed in 9 and these are arranged so as to face the position where the guide portion 28b can be inserted into the guide 30.

That is, when the primary taper pin 28 is lowered downward in the figure, the insulating substrate 21 is pressed and punched out into a substantially conical shape of the pin body 28a, and the guide portion 28b fits into the guide 30. It will be.

Therefore, as shown in FIG. 6, the insulating substrate 21 after punching has a so-called mortar whose opening diameter gradually increases from the soldering surface 21b side to the insertion component mounting surface 21a side. The first through-holes 31 having the shape of a circle are formed.

Next, as shown in FIG. 7, a secondary taper pin 32 is arranged in place of the primary taper pin 28 in a press machine similar to the above-mentioned press machine, and the secondary taper pin 32 and the secondary taper pin 32 are arranged. The insulating substrate 21 is placed inside a press machine including the die plate 39 so that the soldering surface 21b faces the secondary taper pin 32 side.

The secondary taper pin 32 has a substantially conical pin body 32 like the primary taper pin 28 described above.
The shape is such that a substantially cylindrical guide portion 32b is provided at the apex of a.

That is, when the secondary taper pin 32 is lowered downward in the drawing, the insulating substrate 21 is pressed and punched into a substantially conical shape of the pin body 32a, and the guide portion 32b fits into the guide 40. It will be.

At this time, in the present embodiment, the second
In order to align the punching position by the next taper pin 32 with the formation position of the first through hole 31, the insulating substrate 21 after punching is soldered from the approximate center in the thickness direction of the insulating substrate 21 as shown in FIG. The opening diameter gradually increases toward the surface 21b, and the opening diameter gradually increases from the approximate center of the insulating substrate 21 in the thickness direction toward the insertion component mounting surface 21a. Through hole 2
2 will be completed.

When the insulating substrate 21 is punched out from the soldering surface 21b side by the secondary taper pin 32, the copper foil 26 on the soldering surface 21b side of the insulating substrate 21 is pushed into the through hole 22 and The copper foil 26 is formed from the peripheral edge of the opening 22a of the through hole 22 to the inner wall surface 22b.

Then, the terminal portion 24 of the insertion component 23 is inserted from the insertion component mounting surface 21a side to the soldering surface 21b side through the through hole 22, and the terminal tip end portion 24a of the insertion component 23 is soldered. The printed wiring board of this embodiment as shown in FIG. 4 is completed by fixing with solder 25 to the copper foil 26 formed from the peripheral portion of the opening 22a of the through hole 22 on the attachment surface 21b side to the inner wall surface 22b.

Therefore, in the method for manufacturing a printed wiring board of the present embodiment, punching by press working is performed once from different surfaces, so that the soldering surface 21b side is moved from substantially the center of the insulating substrate 21 in the thickness direction. The opening diameter gradually becomes larger as it goes, and it is easy to form the through hole 22 having a shape in which the opening diameter gradually becomes larger from the approximate center in the thickness direction of the insulating substrate to the insertion component mounting surface 21a side. Can be formed into high productivity.

Further, in the method for manufacturing a printed wiring board of this embodiment, since the through hole 22 is completed by press working from the soldering surface 21b side and punching out, the copper foil 26 on the soldering surface 21b side penetrates the above. The inner wall surface 22b is pushed from the periphery of the opening 22a of the through hole 22 by being pushed into the hole 22.
The copper foil 26 is easily formed over the entire area, and the productivity is high.

In the method for manufacturing a printed wiring board according to the present embodiment, the first through hole having a shape in which the opening diameter gradually increases from the soldering surface 21b side to the insertion component mounting surface 21a side. Insert hole 31 into component mounting surface 21
Although the punching is performed by pressing from the a side with the primary taper pin 28, the method of forming the first through hole 31 is by drilling, laser processing, etching, or electron beam. Methods such as things are also included.

Further, in the printed wiring boards of Examples 1 and 2 described above, the insulating substrate having the copper foil formed only on the soldering surface side is used as the insulating substrate.
Even if an insulating substrate having copper foils formed on both sides is used, the same effects as those of the printed wiring boards of these examples can be obtained.

Furthermore, since the printed wiring boards of Examples 1 and 2 do not require a manufacturing process such as plating, they can be manufactured easily and inexpensively, and have an extremely high industrial value. high.

[0059]

As is apparent from the above description, in the printed wiring board of the present invention, the opening diameter is gradually increased from the insertion component mounting side to the side opposite to the insertion component mounting side. Insert the terminal part of the insert part from the insert part mount side into the through hole where the copper foil is formed from the peripheral edge of the opening opposite to the insert part mount side to the inner wall surface. Since it is fixed by solder on the side opposite to the component mounting side, the solder is placed on the copper foil formed from the peripheral edge of the opening of the through hole to the inner wall surface. Is large, the soldering strength is improved, and peeling or the like does not occur due to mechanical stress, heat stress, or the like.

Further, in the printed wiring board of the present invention, the opening diameter is gradually increased and the thickness of the insulating substrate is increased from the approximate center in the thickness direction of the insulating substrate to the side opposite to the side on which the inserted component is mounted. The opening diameter gradually increases from the approximate center in the vertical direction toward the insert component mounting side, and a copper foil is formed from the peripheral edge of the opening opposite to the insert component mounting side to the inner wall surface. Insert the terminal part of the insertion part from the insertion part mounting side into the through hole, and fix the terminal tip part with solder on the side opposite to the insertion part mounting side. Since it will be placed on the copper foil to be formed, the soldering area is larger than the conventional printed wiring board, the soldering strength is improved, and peeling etc. occurs due to mechanical stress and thermal stress etc. And no. Further, in this printed wiring board, the through-hole has a shape in which the opening diameter gradually increases from the approximate center in the thickness direction of the insulating substrate toward the insertion component mounting side, so that the terminal portion of the insertion component is Is easy to insert.

Furthermore, in these printed wiring boards of the present invention, the through-hole has an opening diameter that gradually increases from the component mounting side or the approximate center in the thickness direction of the insulating substrate to the side opposite to the insertion component mounting side. Has a large diameter, so that when the solder is supplied, the solder easily enters the through hole, which also improves the soldering strength and causes peeling due to mechanical stress and thermal stress. Does not occur.

Then, when manufacturing the printed wiring board of the present invention, if the insulating substrate together with the copper foil on the side opposite to the insertion component mounting side is punched out by a substantially conical pin, the insertion component mounting side is inserted. A through hole having a shape whose opening diameter is gradually increased toward the opposite side is punched out, and the copper foil on the side opposite to the insertion component mounting side is pushed into the through hole, The copper foil is easily formed from the peripheral portion of the opening to the inner wall surface, and the productivity is high.

Further, when manufacturing the printed wiring board of the present invention, a through hole is formed in the insulating substrate so that the opening diameter becomes larger from the side opposite to the insertion component mounting side to the insertion component mounting side. After that, if the through hole is formed by punching the through hole forming position from the side opposite to the insertion component mounting side with a substantially conical pin, the side opposite to the insertion component mounting side from the approximate center in the thickness direction of the insulating substrate. The opening diameter gradually becomes larger as it goes to, and the opening diameter becomes gradually larger as it goes from the approximate center in the thickness direction of the insulating substrate to the insertion component mounting side. A through hole for forming a copper foil is easily formed from the peripheral edge of the opening on the opposite side to the inner wall surface, and the productivity is high.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an essential part showing an example of a printed wiring board to which the present invention is applied.

FIG. 2 shows an example of a method of manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a step of disposing an insulating substrate in a press.

FIG. 3 shows an example of a method of manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a state where a through hole is formed in an insulating substrate.

FIG. 4 is a schematic cross-sectional view of an essential part showing another example of a printed wiring board to which the present invention is applied.

FIG. 5 shows another example of the method of manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a step of disposing an insulating substrate in a press.

FIG. 6 shows another example of the method for manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a state where a first through hole is formed in an insulating substrate.

FIG. 7 shows another example of the method for manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a step of reversing an insulating substrate and placing it in a press.

FIG. 8 shows another example of the method for manufacturing a printed wiring board to which the present invention is applied in the order of steps, and is a schematic cross-sectional view of a main part showing a state where a through hole is formed in an insulating substrate.

[Explanation of symbols]

 1, 21 Insulating substrate 1a, 21a Inserted component mounting surface 1b, 21b Soldering surface 2,22 Through holes 2a, 22a Openings 2b, 22b Inner wall surface 3,23 Inserted component 4,24 Terminal portion 4a, 24a Terminal tip portion 5 , 25 Solder 6,26 Copper foil 8 Tapered pin 28 Primary taper pin 8a, 28a, 32a Pin body 8b, 28b, 32b Guide part 9, 29, 39 Die plate 10, 30, 40 Guide 31 First through hole 32 Secondary taper pin

Claims (4)

[Claims] 1. A through hole is formed in an insulating substrate, and a terminal tip end portion of an insertion component inserted from one surface to the other surface through the through hole is on a side opposite to the insertion component mounting side. In a printed wiring board that is fixed by soldering in, the through hole has a shape in which the opening diameter gradually increases from the insertion component mounting side to the side opposite to the insertion component mounting side, and the insertion of the through hole A printed wiring board, characterized in that a copper foil is formed from the periphery of the opening on the side opposite to the component mounting side to the inner wall surface. 2. A through hole is formed in the insulating substrate, and a terminal tip end portion of an insert component inserted from one surface to the other face through the through hole is on a side opposite to the insert component mounting side. In the printed wiring board that is fixed by solder in, the through hole has a gradually increasing opening diameter as it goes from the approximate center in the thickness direction of the insulating substrate to the side opposite to the insertion component mounting side. Has a shape in which the opening diameter gradually increases from the approximate center in the thickness direction toward the insertion component mounting side, and extends from the peripheral portion of the opening of the through hole opposite to the insertion component mounting side to the inner wall surface. A printed wiring board comprising a copper foil formed thereon. 3. An insulating substrate having a copper foil formed on the surface opposite to the insertion component mounting side is punched together with the copper foil from a side opposite to the insertion component mounting side by a substantially conical pin, and inserted. The opening diameter gradually increases from the component mounting side to the side opposite to the insertion component mounting side, and copper foil is formed from the peripheral edge of the opening on the side opposite the insertion component mounting side to the inner wall surface. The step of forming the through-hole formed by the step of inserting the terminal part of the insertion part from the insertion part mounting side to the side opposite to the insertion part mounting side through the through hole, and the terminal tip part of the insertion part A method for manufacturing a printed wiring board, which comprises a step of fixing, by soldering, to a copper foil formed from the peripheral portion of the opening of the through hole on the side opposite to the side on which the inserted component is mounted to the inner wall surface. 4. The opening diameter of the insulating substrate, on which the copper foil is formed on the surface opposite to the insertion component mounting side, increases from the side opposite to the insertion component mounting side to the insertion component mounting side. The step of forming a through hole, and the insulating board is punched together with the copper foil from the side opposite to the side on which the insertion part is mounted by a substantially conical pin, and the insertion part is mounted on the insertion part from the approximate center in the thickness direction. The opening diameter gradually increases toward the opposite side, and the opening diameter gradually increases from the approximate center in the thickness direction of the insulating substrate toward the insertion component mounting side. The step of forming a through hole formed by forming copper foil from the peripheral edge of the opening on the side opposite to the component mounting side to the inner wall surface, and the through hole from the insertion component mounting side to the side opposite to the insertion component mounting side. Insert the terminal part of the insertion part. Manufacture of a printed wiring board including a step and a step of fixing, by soldering, the terminal tip of the insert component to a copper foil formed over the inner wall surface from the opening peripheral portion of the through hole on the side opposite to the insert component mounting side. Method.