JPH03247994A - Sandwich panel having heat pipe function - Google Patents

Sandwich panel having heat pipe function

Info

Publication number
JPH03247994A
JPH03247994A JP4248790A JP4248790A JPH03247994A JP H03247994 A JPH03247994 A JP H03247994A JP 4248790 A JP4248790 A JP 4248790A JP 4248790 A JP4248790 A JP 4248790A JP H03247994 A JPH03247994 A JP H03247994A
Authority
JP
Japan
Prior art keywords
core
temperature part
sandwich panel
heat
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4248790A
Other languages
Japanese (ja)
Inventor
Shoichiro Asada
浅田 正一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP4248790A priority Critical patent/JPH03247994A/en
Publication of JPH03247994A publication Critical patent/JPH03247994A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To obtain a sandwich panel, in which operating fluid is circulated between parts having temperature difference, improved in heat conductive characteristics and easy in manufacturing, by a method wherein wicks are provided on the inner surface of a space formed of a core consisting of a sheet having recesses and protrusions and a face sheet while the operating fluid is sealed into the space. CONSTITUTION:A sandwich panel is provided with a corrugated core 1, face sheets 2, fixed to both surfaces of the core 1, a screen wick 4, formed by welding it to the inner surfaces of the face sheets 2 and the surface of said core 1, and operating fluid 3, sealed into a space formed between the face sheets 2 and the core 1. When there are high-temperature part and low-temperature part on the surface of the sandwich panel, the liquidous operating fluid in the screen wick 4 is evaporated in the high-temperature part while absorbing heat, then, the operating fluid 3 moves from the high-temperature part into the low- temperature part and is liquefied in the low-temperature part while dissipating heat, then, is absorbed into the screen wick 4.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高熱伝導性を必要とする電子機器の搭載パネ
ル及びラジェター等に適用されるヒートパイプ機能を有
するサンドインチパネルに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sandwich panel having a heat pipe function, which is applied to mounting panels and radiators for electronic devices that require high thermal conductivity.

〔従来の技術〕[Conventional technology]

従来のヒートパイプ機能を持た々いサンドインチパネル
としては、第5図に示すように波形コア02の両側をフ
ェースシートo1で挾んだものがあり、また、ヒートパ
イプ機能を有するサンドインチパネルとしては、第6図
に示すようにハニカムコア03のサンドインチパネルに
ヒートバイブ04を埋め込んだもの、及び第7図に示す
内部Vcfll:動流体o7を封入するものがあった。
As a conventional sand inch panel that does not have a heat pipe function, there is one in which a corrugated core 02 is sandwiched on both sides by face sheets o1, as shown in Figure 5, and as a sand inch panel that has a heat pipe function. As shown in FIG. 6, there is a heat vibrator 04 embedded in a sand inch panel of a honeycomb core 03, and as shown in FIG. 7, an internal Vcfll: moving fluid O7 is sealed.

一般のサンドインチパネルの場合には、パネルの熱伝導
は、第5図に示すパネルの面に沿った方向08及びパネ
ルを貫通する方向o9いずれもフェースシート及びコア
材料のみの熱伝導特性に従い、熱伝導は必ずしも良好で
はないため、サンドインチパネルを人工衛星の電子機器
搭載パネル等として用い、一方向の熱伝導特性を向上さ
せたい場合には、第6図に示すようなヒートバイブ04
をパネルに埋め込んだ本のを用いていた。
In the case of a general sand inch panel, the heat conduction of the panel both in the direction 08 along the surface of the panel and in the direction o9 penetrating the panel shown in FIG. 5 follows the heat conduction characteristics of only the face sheet and core material. Heat conduction is not necessarily good, so if you want to use a sandwich panel as a panel for mounting electronic equipment on an artificial satellite and want to improve its unidirectional heat conduction characteristics, use Heat Vibe 04 as shown in Figure 6.
They used a book with a panel embedded in it.

また、多方向の熱伝導を向上させたものを必要とする場
合には、米国文献AIAA−83−1430”Hi g
hCapacity Honeycomb Panel
 )ieat Pipes forSpace Rad
iators’、 AIAA−85−0978@Hor
+eycombpanel )leat Pipe l
)evelopment  for 5paceRad
iarors’  に発表されているようにサンドイン
チパネルそのものにピー5フ541機能を持たせたもの
が考案されている。こnは、WJ8図に示スように、フ
ェースシート01及びノ・ニカムコア03にスクリーン
ウインク06を溶接し、ハニカムコア03に穴05を設
け、サンドインチパネル内部に作動流体を封じ込むこと
により、サンドインチパネル全体をヒートパイプ化さぜ
るものであった。
In addition, if a device with improved multidirectional heat conduction is required, please refer to the U.S. document AIAA-83-1430"High
hCapacity Honeycomb Panel
)ieat Pipes for Space Rad
iators', AIAA-85-0978@Hor
+eycombpanel )leat Pipe l
) development for 5paceRad
As announced in IARORS', a sandwich panel itself has been devised to have the P5F541 function. This is done by welding the screen wink 06 to the face sheet 01 and the honeycomb core 03, providing holes 05 in the honeycomb core 03, and sealing the working fluid inside the sand inch panel, as shown in Figure WJ8. The entire sand inch panel was converted into a heat pipe.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の多方向の熱伝導が良好なサントノくネルにおいて
は、ハニカムコアにスクリーンウインクの溶接が必要で
あり、ノ・ニカムコア製作上に多くのコストとノウ/〜
つが必要であり、また内部に対人した作動流体の流れを
確保するためにハニカムコアに穴を設ける必要があり、
更に作動流体は別懇されて気化しサンドインチ・;ネル
の面内方向に流れるが、ノ・ニカムコアの穴で音速限界
に達しチョークするため、熱−送能力上にも課題があっ
た。
Conventional solar panels with good multi-directional heat conduction require screen wink welding to the honeycomb core, which requires a lot of cost and know-how in manufacturing the honeycomb core.
It is also necessary to provide holes in the honeycomb core to ensure the flow of working fluid inside.
Furthermore, the working fluid is separated and vaporized and flows in the in-plane direction of the sand inch flannel, but it reaches the sonic speed limit in the holes in the nicum core and chokes, which poses problems in terms of heat transfer ability.

また、ヒートパイプを埋め込んたサンドインチパネルに
おいては、熱伝導が部分的であり、また一方向に限られ
、更にヒートパイプの重量がサンドインチパネルに加算
されるという課題があった。
Furthermore, in a sand inch panel in which a heat pipe is embedded, heat conduction is partial and limited to one direction, and the weight of the heat pipe is added to the sand inch panel.

本発明は上記の課題を解決しようとするものである。The present invention seeks to solve the above problems.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のヒートパイプ機能を有するサンドインチパネル
は、その面に凹凸が形成された板よりなるコア、同コア
の面に固着さ九同コアとの間に連通した空間を形成する
平板状のフェースシート、同空間を形成する上記コアと
フェースシートの面に設けられたウィフク、および同空
間内に封入された作動流体を備えたことを特徴としてい
る。
The sandwich panel having a heat pipe function of the present invention has a core made of a plate with unevenness formed on its surface, and a flat face fixed to the surface of the core to form a space communicating with the same core. The present invention is characterized by comprising a seat, a groove provided on the surfaces of the core and face sheet forming the same space, and a working fluid sealed in the space.

〔作用〕[Effect]

上記において、本発明のサンドインチパネルの面に高温
部分と低温部分がある場合、高温部分ではウィング内の
液状の作動流体が吸熱しながら蒸発し、そのガス状の作
動流体は高温部分より低温部分へ移動し、低温部分にて
放熱して液化し、ウィング内に吸収される。低温部分で
スクリーンウィック内に吸収された作動流体は再び高温
部分へ移動し、吸熱して蒸発するため、熱輸送が行われ
る。
In the above, when there is a high temperature part and a low temperature part on the surface of the sand inch panel of the present invention, the liquid working fluid in the wing evaporates while absorbing heat in the high temperature part, and the gaseous working fluid is more concentrated in the lower temperature part than in the high temperature part. It radiates heat and liquefies in the low-temperature part, and is absorbed into the wing. The working fluid absorbed into the screen wick in the low-temperature section moves again to the high-temperature section, absorbs heat, and evaporates, resulting in heat transport.

上記により、作動流体は温度差のあるサンドインチパネ
ルの部分間で循環し熱伝導を容易とするため、熱伝導特
性が向上し製作が容易なサンドインチパネルを実現する
ことができた。
As a result of the above, the working fluid circulates between the parts of the sand inch panel where there is a temperature difference and facilitates heat conduction, making it possible to realize a sand inch panel that has improved heat conduction characteristics and is easy to manufacture.

〔実施例〕〔Example〕

本発明の一実施例を第1図及び第2図に示す。 An embodiment of the present invention is shown in FIGS. 1 and 2.

第1図及び第2図に示す本実施例は、2次元波形に成形
されたコア1、同コア1の両面に固着されたフェースシ
ート2、同フェースシート2の内面と上記コア10面に
溶接して形成されたスクリーンウィック4、および上記
フェースシート2とコア1の間に形成された空間に封入
された作動流体4を備えている。上記において、本実施
例のサンドインチパネルの面に高温部分と低温部分があ
る場合、高温部分ではスクリンウィック4内の液状の作
動流体4が吸熱しながら蒸発し、そのガス状の作動流体
4は高温部分より低温部分へ移動し、低温部分にて放熱
して液化し、スクリーンウィック4内に吸収される。低
温部分でスクリーンウィック4内に吸収された作動流体
4は再び高温部分へ移動し、吸熱して蒸発するため、熱
輸送が行われる。
The present embodiment shown in FIGS. 1 and 2 includes a core 1 formed into a two-dimensional waveform, a face sheet 2 fixed to both sides of the core 1, and welded to the inner surface of the face sheet 2 and the surface of the core 10. A screen wick 4 is formed, and a working fluid 4 is sealed in a space formed between the face sheet 2 and the core 1. In the above, when there is a high temperature part and a low temperature part on the surface of the sand inch panel of this embodiment, the liquid working fluid 4 in the screen wick 4 evaporates while absorbing heat in the high temperature part, and the gaseous working fluid 4 evaporates while absorbing heat. It moves from the high-temperature part to the low-temperature part, radiates heat in the low-temperature part, liquefies, and is absorbed into the screen wick 4. The working fluid 4 absorbed into the screen wick 4 in the low-temperature portion moves again to the high-temperature portion, absorbs heat, and evaporates, so that heat transport is performed.

上記により、作動流体は温度差のあるサンドインチパネ
ルのあらゆる部分と間で循環し、あらゆる部分の間にお
ける熱伝導を容易とするため、熱伝導特性が向上し製作
が容易なサンドインチパネルを実現することができた。
As a result of the above, the working fluid circulates between all parts of the sand inch panel where there is a temperature difference, facilitating heat conduction between all parts, resulting in a sand inch panel that has improved heat conduction properties and is easy to manufacture. We were able to.

本発明の他の実施例を第3図及び第4図に示す。Another embodiment of the invention is shown in FIGS. 3 and 4.

第3図及び第4図に示す本実施例は、第1図及び第2図
に示す上記一実施例におけるコア1を一次元波形に成形
されたコア5とし、その−方の面にフェースシート2を
固着したものであす、上記フェースシート2とコア5に
より形成された空間の内面にスクリーンウインク4が形
成されたものである。不実施例の場合には、熱輸送の方
向は一方向に限ら九るがコアの成形と固着が容易である
という利点がある。
In the present embodiment shown in FIGS. 3 and 4, the core 1 in the embodiment shown in FIGS. A screen wink 4 is formed on the inner surface of the space formed by the face sheet 2 and the core 5. In the case of the non-embodiment, the direction of heat transport is limited to one direction, but there is an advantage that the core can be easily formed and fixed.

〔発明の効果〕〔Effect of the invention〕

本発明のヒートパイプ機能を有するサンドインチパネル
は、面が凹凸した板よりなるコアとフェースシートによ
って形成された空間の内面にウィックが設けられ、同空
間に作動流体が封入されることによって、作動流体が温
度差のあるサンドインチパネルの部分間で循環し熱伝導
を容易とするため、熱伝導特性が向上し製作が容易なサ
ンドインチパネルを実現することができた。
The sandwich panel having a heat pipe function of the present invention has a wick on the inner surface of the space formed by the core and the face sheet, which are made of a plate with an uneven surface, and the working fluid is sealed in the space. Because the fluid circulates between parts of the sand inch panel that have different temperatures and facilitates heat conduction, we were able to realize a sand inch panel that has improved heat conduction properties and is easy to manufacture.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の説明図、第2図は第1図の
N部分の詳細図、第3図は本発明の他の実施例の説明図
、第4図は83図のN部分の詳細面、第5図は従来のヒ
ートパイプ機能を持たないサンドインチパネルの説明図
、第6図は従来のヒートパイプを埋め込んだサンドイン
第7図の1部分の詳細図である。 1・・・2次元波形コア、2・・−フェースシート、3
・・・作動流体、4・・−スクリーンウインク、5・・
・1次元波形コア。
Fig. 1 is an explanatory diagram of one embodiment of the present invention, Fig. 2 is a detailed diagram of the N portion of Fig. 1, Fig. 3 is an explanatory diagram of another embodiment of the invention, and Fig. 4 is a diagram of Fig. 83. 5 is an explanatory diagram of a conventional sand inch panel without a heat pipe function, and FIG. 6 is a detailed diagram of a portion of the sand inch panel shown in FIG. 7 in which a conventional heat pipe is embedded. 1... Two-dimensional corrugated core, 2...-Face sheet, 3
... working fluid, 4...-screen wink, 5...
・One-dimensional waveform core.

Claims (1)

【特許請求の範囲】[Claims] その面に凹凸が形成された板よりなるコア、同コアの面
に固着され同コアとの間に連通した空間を形成する平板
状のフェースシート、同空間を形成する上記コアとフェ
ースシートの面に設けられたウイツク、および同空間内
に封入された作動流体を備えたことを特徴とするヒート
パイプ機能を有するサンドイッチパネル。
A core made of a plate with unevenness formed on its surface, a flat face sheet that is fixed to the surface of the core and forms a space communicating with the core, and a surface of the core and face sheet that forms the space. 1. A sandwich panel having a heat pipe function, characterized by comprising a heat pipe provided in the space, and a working fluid sealed in the same space.
JP4248790A 1990-02-26 1990-02-26 Sandwich panel having heat pipe function Pending JPH03247994A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4248790A JPH03247994A (en) 1990-02-26 1990-02-26 Sandwich panel having heat pipe function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4248790A JPH03247994A (en) 1990-02-26 1990-02-26 Sandwich panel having heat pipe function

Publications (1)

Publication Number Publication Date
JPH03247994A true JPH03247994A (en) 1991-11-06

Family

ID=12637421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4248790A Pending JPH03247994A (en) 1990-02-26 1990-02-26 Sandwich panel having heat pipe function

Country Status (1)

Country Link
JP (1) JPH03247994A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6256201B1 (en) * 1998-10-21 2001-07-03 Furukawa Electric Co., Ltd. Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe
US9277676B2 (en) 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
US9277675B2 (en) 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
JP2018204841A (en) * 2017-06-01 2018-12-27 古河電気工業株式会社 Plane type heat pipe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6256201B1 (en) * 1998-10-21 2001-07-03 Furukawa Electric Co., Ltd. Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe
US9277676B2 (en) 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
US9277675B2 (en) 2012-08-23 2016-03-01 Kabushiki Kaisha Toshiba Electronic apparatus
JP2018204841A (en) * 2017-06-01 2018-12-27 古河電気工業株式会社 Plane type heat pipe
US11137215B2 (en) 2017-06-01 2021-10-05 Furukawa Electric Co., Ltd. Flat heat pipe

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