JPH066957U - Cold plate - Google Patents

Abstract

(57) [Summary] [Purpose] To facilitate temperature control of electronic equipment. [Structure] When a heat transfer body 6 expands due to heat generated by an electronic device 9 and comes into contact with a heat pipe 7, the heat is transferred to the heat pipe 7. Further, when the temperature of the electronic device 9 decreases due to the heat transfer to the heat pipe 7, the heat transfer body 6 separates from the heat pipe 7. [Effect] Since the temperature control of the electronic device 9 is performed by bringing the heat transfer body 6 into contact with or away from the heat pipe 7, the temperature control of the electronic device 9 can be performed easily.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a cold plate that enables temperature control of a predetermined device such as an electronic device.

[0002]

[Prior art]

 A cold plate is usually used to control the temperature of electronic devices in a space environment where natural heat dissipation cannot be expected.

As shown in FIG. 2, the cold plate has an electronic device a, which is a heat source, attached to a surface c of a cold plate b, and a conduit e, f is provided between the cold plate b and the heat radiating condenser d. An exhaust heat loop for circulating a heat medium is formed, the heat generated by the electronic device a is absorbed by the cold plate b, and the heat is discharged from the heat radiating condenser d to the outer space.

[0004]

[Problems to be solved by the device]

 Therefore, in order to control the temperature of the electronic device a in the above equipment, a temperature detector for detecting the temperature of the heat medium and a control valve for adjusting the flow rate of the heat medium are usually required in the exhaust heat loop. However, there was a problem that the equipment was complicated and large-scale.

The present invention has been made in view of the above circumstances, and an object thereof is to make it possible to easily control the temperature of an electronic device without making the facility complicated and large-scale.

[0006]

[Means for Solving the Problems]

 According to the present invention, a heat pipe and a heat transfer member that is expanded by heat from a device mounted outside the cold plate body and can contact the heat pipe are provided in the cold plate body.

[0007]

[Action]

 When the heat transfer body thermally expands due to the heat generated from the device, the heat transfer body comes into contact with the heat pipe, and the heat from the device is discharged through the heat pipe. Also, when the temperature of the device decreases, the heat transfer body separates from the heat pipe, so the heat from the device is not transferred to the heat pipe.

As described above, the temperature control of the device is easily performed by the heat transfer body coming into contact with the heat pipe or moving away from the heat pipe.

[0009]

【Example】

 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the present invention. The cold plate 1 is composed of flat plates 2 and 3 and flat plates 2 and 3 which form a cold plate main body 1a and which are arranged in parallel with each other at a required interval. The honeycomb plate 5 housed in the space 4 between them, the plate-shaped heat transfer body 6 arranged in the space 4 so as to be in close contact with the back surface of the flat plate 2, and the heat transfer body 6 housed in the space 4 A plurality of heat pipes 7 arranged in parallel with the heat transfer body 6 are provided in the lower portion. If the heat transfer body 6 does not absorb heat, a space between the heat transfer body 6 and the heat pipe 7 is provided. A predetermined gap 8 is formed at the bottom. Further, the heat transfer member 6 is made of a material having a large coefficient of thermal expansion such as brass.

An electronic device 9 is installed on the surface of the flat plate 2 of the cold plate 1 so that the bottom surface 9 a is in close contact with the surface of the flat plate 2 and faces the heat transfer body 6 via the flat plate 2. The electronic device 9 and the heat transfer body 6 are fastened together by a plurality of bolts 10. The bolt 10 is made of, for example, the same material as the heat transfer body 6 so that the bolt 10 can be thermally expanded to the heat pipe 7 side together with the heat transfer body 6.

When the electronic device 9 generates heat, the heat is transferred from the flat plate 2 to the heat transfer body 6, the heat transfer body 6 thermally expands and becomes thicker, and the lower surface of the heat transfer body 6 is provided with the heat pipe 7. Touch the top surface. Then, the liquid in the heat pipe 7 is vaporized by the heat transmitted from the heat transfer body 6 and flows toward the end side (not shown) of the heat pipe 7, and is cooled by the heat medium flowing through the exhaust heat loop (not shown). Then, it radiates heat, condenses into liquid, returns to the lower portion of the electronic device 9, and repeats the above-mentioned cycle again. The heat absorbed by the heat medium of the exhaust heat loop is released to the outer space from the heat radiating condenser as described in FIG.

When the heat from the electronic device 9 is transferred from the heat transfer body 6 to the heat pipe 7 and released to outer space by the exhaust heat loop, the temperature of the electronic device 9 drops. Then, the heat transfer body 6 contracts and separates from the heat pipe 7, and thereafter, the heat from the electronic device 9 is not transferred to the heat pipe 7.

As described above, the heat transfer from the electronic device 9 to the heat pipe 7 is controlled by the heat transfer body 6 coming into contact with or leaving the heat pipe 7, and thus the electronic device 9 Can be controlled to a predetermined temperature.

Further, since it is not necessary to use a temperature detector or a control valve for controlling the temperature, the temperature control of the electronic device 9 can be easily performed and the equipment can be simplified.

In the embodiment of the present invention, the case where brass is used as the heat transfer body has been described, but a material other than brass can be used as long as it has a large coefficient of thermal expansion. May be attached by an adhesive for metal joining instead of bolts, and temperature control can be performed not only for electronic devices but also for general devices. In addition, within the scope not departing from the gist of the present invention. Of course, various changes can be made within.

[0017]

[Effect of device]

 According to the cold plate of the present invention, it is possible to achieve various excellent effects such that the temperature of the device can be easily controlled and the equipment can be simplified.

[Brief description of drawings]

FIG. 1 is a front view of an embodiment of a cold plate of the present invention.

FIG. 2 is a front view of an example of a conventional cold plate.

[Explanation of symbols]

 1 Cold plate 1a Cold plate main body 6 Heat transfer body 7 Heat pipe 9 Electronic equipment (equipment)

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[Procedure amendment]

[Submission date] August 12, 1993

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

Claims (1)

[Scope of utility model registration request] 1. A cold plate main body is provided with a heat pipe and a heat transfer member which is expanded by heat from a device mounted outside the cold plate main body and can contact the heat pipe. plate.