JPH03244183A - Thick film integrated circuit device - Google Patents
Thick film integrated circuit deviceInfo
- Publication number
- JPH03244183A JPH03244183A JP4176990A JP4176990A JPH03244183A JP H03244183 A JPH03244183 A JP H03244183A JP 4176990 A JP4176990 A JP 4176990A JP 4176990 A JP4176990 A JP 4176990A JP H03244183 A JPH03244183 A JP H03244183A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- printed
- protective glass
- thick film
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000012528 membrane Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】 産業上の利用分野 本発明は厚膜集積回路装置に関するものである。[Detailed description of the invention] Industrial applications The present invention relates to thick film integrated circuit devices.
従来の技術
従来、この種の厚膜集積回路装置は第３図に示すような
構造を有していた。即ち、図において、１はアルミナ基
板であり、アルミナ基板１上にスクリーン印刷により導
体２を所定のパターンで配線し、その上に印刷抵抗３と
４を形成する。また、導体２のリード端子半田付は部２
ａと部品半田付は部２ｂを除く導体２と印刷抵抗３と４
を保護ガラス５で覆っている。また、６は厚膜印刷基板
分割時の分割溝である。第４図は、第３図のＢ−Ｂ’線
の切断断面図である。Prior Art Conventionally, this type of thick film integrated circuit device has had a structure as shown in FIG. That is, in the figure, 1 is an alumina substrate, and conductors 2 are wired in a predetermined pattern on the alumina substrate 1 by screen printing, and printed resistors 3 and 4 are formed thereon. Also, solder the lead terminal of conductor 2 in part 2.
a and parts soldered except for part 2b, conductor 2 and printed resistors 3 and 4.
is covered with a protective glass 5. Further, 6 is a dividing groove when dividing the thick film printed circuit board. FIG. 4 is a cross-sectional view taken along line BB' in FIG. 3.
発明が解決しようとする課題
上記のような従来の構造では、厚膜印刷基板の積み重ね
を行うと、膜に傷が付き外観的不良および品質的不良が
発生するため積み重ねができなかった。Problems to be Solved by the Invention In the conventional structure as described above, stacking of thick film printed circuit boards could not be done because the films would be damaged, causing defects in appearance and quality.
本発明は、このような問題を解決するもので、厚膜印刷
基板の積み重ねを行っても膜に傷が付かず、外観的不良
および品質的不良を防止することを目的とする。The present invention is intended to solve such problems, and aims to prevent the film from being damaged even when thick film printed circuit boards are stacked, thereby preventing defects in appearance and quality.
課題を解決するための手段
上記の課題を解決するために本発明は、アルミナ基板上
に導体、印刷抵抗および保護ガラスの各層を形成するこ
とにより構成され、かつ前記アルミナ基板上の余白部に
前記導体、印刷抵抗および保護ガラスの材料を積層する
ことにより突起を形成したものである。Means for Solving the Problems In order to solve the above problems, the present invention is constructed by forming each layer of a conductor, a printed resistor, and a protective glass on an alumina substrate, and the above-mentioned layers are formed in a blank area on the alumina substrate. The protrusions are formed by laminating conductor, printed resistor, and protective glass materials.
作用
上記の構造により、厚膜印刷基板の積み重ねを行っても
、アルミナ基板上の余白部に突起があるため、傷が付か
ず、外観的不良および品質的不良になることがない。Effect: With the above-described structure, even if thick-film printed circuit boards are stacked, since there are protrusions in the margins on the alumina substrates, no scratches will occur, resulting in poor appearance and quality.
実施例
以下、本発明の一実施例を図面に基づいて説明する。第
１図は、本発明の一実施例による厚膜集積回路装置の厚
膜印刷基板形成時の平面図、第２図は、第１図のＡ−Ａ
’線切断断面図である。第１図および第２図において、
アルミナ基板１１上にスクリーン印刷により導体１２を
所定のパターンにより配線した後、導体１２上に印刷抵
抗１３と１４を形成する。また、導体１２のリード端子
半田付は部１２ａと部品半田付は部１２ｂを除く導体１
２と印刷抵抗１３と１４を保護ガラス１５で覆う。これ
らの工程と同時に、前記アルミナ基板１１上の余白部に
前記導体１２．印刷抵抗１３と１４および保護ガラス１
５の材料を用い、傷付き防止用の突起１７を積層形成す
る。また、１６は厚膜印刷基板分割時の分割溝である。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. FIG. 1 is a plan view of a thick film printed circuit board of a thick film integrated circuit device according to an embodiment of the present invention, and FIG.
It is a sectional view cut along the line. In Figures 1 and 2,
After wiring the conductor 12 in a predetermined pattern on the alumina substrate 11 by screen printing, printed resistors 13 and 14 are formed on the conductor 12. Also, the conductor 12 except for the part 12a for lead terminal soldering and the part 12b for component soldering.
2 and printed resistors 13 and 14 are covered with a protective glass 15. At the same time as these steps, the conductor 12. Printed resistors 13 and 14 and protective glass 1
Using the material No. 5, the protrusions 17 for preventing scratches are laminated. Further, 16 is a dividing groove when dividing the thick film printed circuit board.
発明の効果
以上のように本発明においては、アルミナ基板上に導体
、印刷抵抗および保護ガラスを形成するのと同時に、前
記アルミナ基板上の余白部に前記導体、印刷抵抗および
保護ガラスの材料を積層し、傷付き防止用の突起を形成
することにより、厚膜印刷基板を積み重ねても傷が付く
のを防止することができ、外観的不良および品質的不良
を防止することができる。Effects of the Invention As described above, in the present invention, at the same time that the conductor, printed resistor, and protective glass are formed on the alumina substrate, the conductor, printed resistor, and protective glass materials are laminated on the blank area on the alumina substrate. However, by forming scratch-preventing protrusions, it is possible to prevent scratches even when thick-film printed substrates are stacked, and it is possible to prevent defects in appearance and quality.
第１図は本発明の一実施例による厚膜集積回路装置の厚
膜印刷基板の平面図、第２図は第１図のＡ−Ａ’線切断
断面図、第３図は従来の厚膜印刷基板の平面図、第４図
は第３図のＢ−Ｂ’線切断断面図である。
１１・・・・・・アルミナ基板、１２・・・・・・導体
、２゜１２ａ・・・・・・リード端子半田付は部、１２
ｂ・・・・・・部品半田付は部、１３．１４・・・・・
・印刷抵抗、１５・・・・・・保護ガラス、１６・・・
・・・分割溝、１７・・・・・・突起。FIG. 1 is a plan view of a thick film printed circuit board of a thick film integrated circuit device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA' in FIG. A plan view of the printed circuit board, and FIG. 4 is a sectional view taken along the line BB' in FIG. 3. 11...Alumina board, 12...Conductor, 2゜12a...Lead terminal soldering part, 12
b... Part soldering is part, 13.14...
・Printed resistance, 15... Protective glass, 16...
...Dividing groove, 17...Protrusion.
Claims (1)
各層を形成することにより構成し、かつ前記アルミナ基
板上の余白部に前記導体、印刷抵抗および保護ガラスの
材料を積層することにより突起を形成した厚膜集積回路
装置。It is constructed by forming each layer of a conductor, a printed resistor, and a protective glass on an alumina substrate, and a protrusion is formed by laminating the materials of the conductor, printed resistor, and protective glass in the blank area on the alumina substrate. Membrane integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176990A JPH03244183A (en) | 1990-02-22 | 1990-02-22 | Thick film integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4176990A JPH03244183A (en) | 1990-02-22 | 1990-02-22 | Thick film integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03244183A true JPH03244183A (en) | 1991-10-30 |
Family
ID=12617606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4176990A Pending JPH03244183A (en) | 1990-02-22 | 1990-02-22 | Thick film integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03244183A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2418538A (en) * | 2004-09-22 | 2006-03-29 | Vetco Gray Controls Ltd | Thick-film printed circuit |
-
1990
- 1990-02-22 JP JP4176990A patent/JPH03244183A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2418538A (en) * | 2004-09-22 | 2006-03-29 | Vetco Gray Controls Ltd | Thick-film printed circuit |
| WO2006032836A1 (en) * | 2004-09-22 | 2006-03-30 | Vetco Gray Controls Limited | Thick-film hybrid production process |
| GB2432978A (en) * | 2004-09-22 | 2007-06-06 | Vetco Gray Controls Ltd | Thick-film hybrid production process |
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