JPH0324258U - - Google Patents
Info
- Publication number
- JPH0324258U JPH0324258U JP1989084078U JP8407889U JPH0324258U JP H0324258 U JPH0324258 U JP H0324258U JP 1989084078 U JP1989084078 U JP 1989084078U JP 8407889 U JP8407889 U JP 8407889U JP H0324258 U JPH0324258 U JP H0324258U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- pin
- gold plating
- thickness
- joint structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の一実施例を示す図、第２図は
本考案の各工程における状態図、同図ａは初期時
、ｂはベーパーリフロ時、ｃケーブルコネクタ嵌
合時、第３図は本考案が適用される全体構成図、
第４図は従来の構造図、第５図は従来の欠点を示
す図である。
図において、１はマザーボード、２はコネクタ
、３は部品、３ａは先端部、４はスルーホール、
６ａは厚膜金メツキ部、６ｂは薄膜金メツキ部を
それぞれ示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a state chart of each process of the present invention, Fig. 3 shows a in the initial state, b in the vapor reflow state, c in the cable connector mating state, and Fig. 3 is the overall configuration diagram to which the present invention is applied,
FIG. 4 is a structural diagram of the conventional device, and FIG. 5 is a diagram showing the drawbacks of the conventional device. In the figure, 1 is the motherboard, 2 is the connector, 3 is the component, 3a is the tip, 4 is the through hole,
6a shows a thick film gold plating part, and 6b shows a thin film gold plating part.
Claims (1)
、 該スルーホール４に挿通され、且つその外周に
金メツキが施されたピン３を有するコネクタ２と
を有し、 該スルーホール４と該ピン３とが半田にて接合
される半田接合構造に於いて、 前記ピンを被覆する金メツキ厚を、前記スルー
ホール４に収納される部分の金メツキ厚より、該
スルーホール４から突出する部分の金メツキ厚を
厚くしたことを特徴とする半田接合構造。[Claims for Utility Model Registration] A motherboard 1 having a through-hole 4 formed therein, a connector 2 having a pin 3 inserted into the through-hole 4 and having a gold-plated outer periphery; In the solder joint structure in which the hole 4 and the pin 3 are joined by solder, the thickness of the gold plating covering the pin is determined from the thickness of the gold plating of the part accommodated in the through hole 4. A solder joint structure characterized by thicker gold plating on the parts that protrude from the top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989084078U JPH0747801Y2 (en) | 1989-07-19 | 1989-07-19 | Pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989084078U JPH0747801Y2 (en) | 1989-07-19 | 1989-07-19 | Pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0324258U true JPH0324258U (en) | 1991-03-13 |
| JPH0747801Y2 JPH0747801Y2 (en) | 1995-11-01 |
Family
ID=31632269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989084078U Expired - Lifetime JPH0747801Y2 (en) | 1989-07-19 | 1989-07-19 | Pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0747801Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166071U (en) * | 1979-05-17 | 1980-11-29 | ||
| JPS5693976U (en) * | 1979-12-21 | 1981-07-25 | ||
| JPS5797382U (en) * | 1980-12-06 | 1982-06-15 | ||
| JPS619757U (en) * | 1984-06-25 | 1986-01-21 | 康憲 鈴木 | Breaker with uneven shape on the side |
-
1989
- 1989-07-19 JP JP1989084078U patent/JPH0747801Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55166071U (en) * | 1979-05-17 | 1980-11-29 | ||
| JPS5693976U (en) * | 1979-12-21 | 1981-07-25 | ||
| JPS5797382U (en) * | 1980-12-06 | 1982-06-15 | ||
| JPS619757U (en) * | 1984-06-25 | 1986-01-21 | 康憲 鈴木 | Breaker with uneven shape on the side |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0747801Y2 (en) | 1995-11-01 |
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