JPH0324259U - - Google Patents

Info

Publication number
JPH0324259U
JPH0324259U JP1989084079U JP8407989U JPH0324259U JP H0324259 U JPH0324259 U JP H0324259U JP 1989084079 U JP1989084079 U JP 1989084079U JP 8407989 U JP8407989 U JP 8407989U JP H0324259 U JPH0324259 U JP H0324259U
Authority
JP
Japan
Prior art keywords
hole
motherboard
pin
joint structure
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989084079U
Other languages
Japanese (ja)
Other versions
JPH0722044Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989084079U priority Critical patent/JPH0722044Y2/en
Publication of JPH0324259U publication Critical patent/JPH0324259U/ja
Application granted granted Critical
Publication of JPH0722044Y2 publication Critical patent/JPH0722044Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の第一の実施例を示す図、第２
図は第１図における各工程の状態図、同図ａは初
期時、同図ｂはベーパーリフロ時、同図ｃケーブ
ルコネクタ嵌合時、第３図は本考案の他の実施例
を示す図、第４図は本考案が適用される全体構成
図、第５図は従来の構造図、第６図ａおよびｂは
従来の欠点を示す図である。 図において、１はマザーボード、２はコネクタ
、３は部品、３ａは先端部、４はスルーホール、
７は硬質クロムメツキ、１２は突起をそれぞれ示
す。 Fig. 1 shows the first embodiment of the present invention; Fig. 2 shows the first embodiment of the present invention;
The figures are state diagrams of each process in Figure 1, Figure a shows the initial state, Figure b shows vapor reflow, Figure c shows the cable connector fitted, and Figure 3 shows another embodiment of the present invention. , FIG. 4 is an overall configuration diagram to which the present invention is applied, FIG. 5 is a conventional structural diagram, and FIGS. 6 a and 6 b are diagrams showing the drawbacks of the conventional method. In the figure, 1 is the motherboard, 2 is the connector, 3 is the component, 3a is the tip, 4 is the through hole,
7 indicates hard chrome plating, and 12 indicates a protrusion.

Claims (1)

【実用新案登録請求の範囲】 (1) スルーホール４が形成されたマザーボード
１と、 該スルーホール４を貫通し、且つその外周に金
メツキ６が施されたピン３を有するコネクタ２と
を有し、 該スルーホール４と該ピン３とが半田９にて接
合される半田接合構造に於いて、 金メツキ６がその外周に施されてなる前記ピン
３上に、前記マザーボード１に挿入した際、当該
マザーボード１上に形成された前記スルーホール
４を挟み込む少なくとも ２ケ所に半田漏れ性の悪い材質を塗布したこと
を特徴とする半田接合構造。 (2) 前記スルーホール４の内壁に突起部１２が
形成されてなることを特徴とする請求項１記載の
半田接合構造。[Scope of Claim for Utility Model Registration] (1) A motherboard 1 having a through hole 4 formed therein, and a connector 2 having a pin 3 passing through the through hole 4 and having a gold plating 6 on its outer periphery. However, in the solder joint structure in which the through hole 4 and the pin 3 are joined with solder 9, when the pin 3 having the gold plating 6 applied to its outer periphery is inserted into the motherboard 1. A solder joint structure characterized in that a material with poor solder leakage is applied to at least two locations sandwiching the through hole 4 formed on the motherboard 1. (2) The solder joint structure according to claim 1, wherein a protrusion 12 is formed on the inner wall of the through hole 4.
JP1989084079U 1989-07-19 1989-07-19 Solder joint structure Expired - Lifetime JPH0722044Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989084079U JPH0722044Y2 (en) 1989-07-19 1989-07-19 Solder joint structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989084079U JPH0722044Y2 (en) 1989-07-19 1989-07-19 Solder joint structure

Publications (2)

Publication Number Publication Date
JPH0324259U true JPH0324259U (en) 1991-03-13
JPH0722044Y2 JPH0722044Y2 (en) 1995-05-17

Family

ID=31632270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989084079U Expired - Lifetime JPH0722044Y2 (en) 1989-07-19 1989-07-19 Solder joint structure

Country Status (1)

Country Link
JP (1) JPH0722044Y2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213070A (en) * 1995-02-03 1996-08-20 Dai Ichi Denshi Kogyo Kk Solder run-up preventive structue of electronic part terminal
JPH10294142A (en) * 1997-04-18 1998-11-04 Hirose Electric Co Ltd Electric connector for circuit board
JPH11167944A (en) * 1997-10-03 1999-06-22 Fujitsu Ltd I/o pin with solder dam for connecting boards
JP2006216729A (en) * 2005-02-03 2006-08-17 Fuji Electric Device Technology Co Ltd Semiconductor device and manufacturing method thereof
JP2008226681A (en) * 2007-03-14 2008-09-25 Japan Aviation Electronics Industry Ltd Connector
JP2010212723A (en) * 2010-05-17 2010-09-24 Fuji Electric Systems Co Ltd Method of manufacturing semiconductor device
JP2011151247A (en) * 2010-01-22 2011-08-04 Sumitomo Wiring Syst Ltd Terminal metal fitting and connection structure of terminal metal fitting
JP2013093232A (en) * 2011-10-26 2013-05-16 Toyota Motor Corp Connector terminal
JP2019083308A (en) * 2017-10-31 2019-05-30 乾坤科技股▲ふん▼有限公司 Current detection resistor and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693976U (en) * 1979-12-21 1981-07-25
JPS5797382U (en) * 1980-12-06 1982-06-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693976U (en) * 1979-12-21 1981-07-25
JPS5797382U (en) * 1980-12-06 1982-06-15

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213070A (en) * 1995-02-03 1996-08-20 Dai Ichi Denshi Kogyo Kk Solder run-up preventive structue of electronic part terminal
JPH10294142A (en) * 1997-04-18 1998-11-04 Hirose Electric Co Ltd Electric connector for circuit board
JPH11167944A (en) * 1997-10-03 1999-06-22 Fujitsu Ltd I/o pin with solder dam for connecting boards
JP2006216729A (en) * 2005-02-03 2006-08-17 Fuji Electric Device Technology Co Ltd Semiconductor device and manufacturing method thereof
JP4600065B2 (en) * 2005-02-03 2010-12-15 富士電機システムズ株式会社 Semiconductor device and manufacturing method thereof
JP2008226681A (en) * 2007-03-14 2008-09-25 Japan Aviation Electronics Industry Ltd Connector
JP2011151247A (en) * 2010-01-22 2011-08-04 Sumitomo Wiring Syst Ltd Terminal metal fitting and connection structure of terminal metal fitting
JP2010212723A (en) * 2010-05-17 2010-09-24 Fuji Electric Systems Co Ltd Method of manufacturing semiconductor device
JP2013093232A (en) * 2011-10-26 2013-05-16 Toyota Motor Corp Connector terminal
JP2019083308A (en) * 2017-10-31 2019-05-30 乾坤科技股▲ふん▼有限公司 Current detection resistor and manufacturing method thereof

Also Published As

Publication number Publication date
JPH0722044Y2 (en) 1995-05-17

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