JPH03238891A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPH03238891A
JPH03238891A JP3540590A JP3540590A JPH03238891A JP H03238891 A JPH03238891 A JP H03238891A JP 3540590 A JP3540590 A JP 3540590A JP 3540590 A JP3540590 A JP 3540590A JP H03238891 A JPH03238891 A JP H03238891A
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
printed circuit
directed downward
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3540590A
Other languages
Japanese (ja)
Inventor
Chihiro Sasaki
千尋 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3540590A priority Critical patent/JPH03238891A/en
Publication of JPH03238891A publication Critical patent/JPH03238891A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent dropping of a mounted element even when an electronic component directed downward on the occasion of soldering of the electronic component and thereby to improve operability by a method wherein a specific layer for fixing the electronic component is provided on the packaging surface of a printed circuit board. CONSTITUTION:An element fixing layer 2 for which a material of rubber or resin being transparent or translucent and having a heat resistance, an insulating property and elasticity is stuck on the packaging surface of a printed circuit board 1 by a bonding agent. In the printed circuit board 1, eventually, an electrode terminal 12 of an electronic component 11 is put in a state if being tightened from around by the element fixing layer 2 having elasticity and it is prevented substantially from slipping off. Even when the packaging surface of the printed circuit board 1 is directed downward and consequently the electronic component 11 is directed downward on the occasion of manual packaging of the electronic component 11, it is prevented that the electronic component 11 drops before the end of soldering, according to this constitution, and thereby operability can be improved.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a printed circuit board.

〔従来の技術〕[Conventional technology]

第３図は従来の電子部品を搭載したプリント基板の一例
の断面図である。FIG. 3 is a cross-sectional view of an example of a printed circuit board on which conventional electronic components are mounted.

プリント基板１には半田ランド３、スルーホール４が設
けられている。このプリント基板１のスルーホール３に
電子部品１１の電極端子１２を通し、実装面とは反対側
の面で電極端子１２と基板上の半田ランド３とを半田１
３で固着することによって、電子部品１１の実装を行な
うという構造となっていた。A printed circuit board 1 is provided with solder lands 3 and through holes 4. Pass the electrode terminal 12 of the electronic component 11 through the through hole 3 of this printed circuit board 1, and connect the electrode terminal 12 and the solder land 3 on the board with solder 1 on the surface opposite to the mounting surface.
3, the electronic component 11 is mounted.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のプリント基板は、電子部品の実装を手作
業で行なう場合、実装面を下向きにして半田付けを行な
うので、その際に電子部品１１も下向きになってしまう
為、半田付けを１行なうまでの間に電子部品が落下して
しまうことがあり、作業性が悪くなるという問題点があ
った。In the conventional printed circuit board described above, when electronic components are mounted manually, soldering is performed with the mounting surface facing downward, and the electronic component 11 also faces downward at that time, so soldering is performed only once. There was a problem in that the electronic components may fall during the process, resulting in poor workability.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のプリント基板は、電子部品を搭載する側の面上
に透明または半透明で、耐熱性と絶縁性と弾力性を持つ
ゴム系または樹脂系の素材で作られた素子固定層を設け
たことを特徴とする。The printed circuit board of the present invention has an element fixing layer made of a transparent or translucent rubber-based or resin-based material having heat resistance, insulation, and elasticity on the side on which electronic components are mounted. It is characterized by

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.

この実施例のプリント基板は、従来のプリント基板の実
装面上に、透明または半透明で耐熱性と絶縁性と弾力性
を持ち、ゴム系または樹脂系の素材を用いた素子固定層
２が、接着剤で貼り付けられているという構造を有して
いる。The printed circuit board of this embodiment has an element fixing layer 2 on the mounting surface of a conventional printed circuit board, which is transparent or translucent and has heat resistance, insulation, and elasticity, and is made of a rubber or resin material. It has a structure in which it is attached with adhesive.

このようなプリント基板１に電子部品１１を手作業で実
装する場合には、第２図に示すように、まず電子部品１
１の電極端子１２が素子固定層２を突き破ってから、ス
ルーホール４を通る。そしてプリント基板１の実装面側
を下向きにし、実装面側とは反対側の面で電極端子１２
とプリント基板上の半田ランド３とを半田３を用いて半
田付けする。When mounting electronic components 11 on such a printed circuit board 1 manually, as shown in FIG.
After one electrode terminal 12 breaks through the element fixing layer 2, it passes through the through hole 4. Then, with the mounting surface side of the printed circuit board 1 facing downward, the electrode terminal 12 is placed on the surface opposite to the mounting surface side.
and a solder land 3 on the printed circuit board using solder 3.

つまり、このプリント基板は、電子部品１１の電極端子
１２が弾力性を持つ素子固定層２によって周りから絞め
付けられた状態となり、抜けにくくなる為、電子部品１
１の実装を手作業で行なう際に、プリント基板１の実装
面が下向きになり、電子部品１１が下向きになっても半
田付けを行なるまでの間に電子部品１１が落下してしま
うことを防止することができる。In other words, in this printed circuit board, the electrode terminals 12 of the electronic component 11 are squeezed from the surroundings by the elastic element fixing layer 2, making it difficult for the electronic component 11 to come out.
When mounting 1 by hand, even if the mounting surface of the printed circuit board 1 is facing downward and the electronic component 11 is facing downward, the electronic component 11 will not fall before soldering. It can be prevented.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、プリント基板の実装面
上に電子部品を固定する為の層を設けたので、電子部品
を半田付けする際に、電子部品が下向きになっても搭載
素子が落下することがなくなり、作業性が向上するとい
う効果がある。As explained above, the present invention provides a layer for fixing electronic components on the mounting surface of a printed circuit board, so even if the electronic component is turned downward when soldering the electronic component, the mounted element will not be damaged. This has the effect of preventing falling and improving work efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の断面図、第２図は第１図の
一実施例の使用例の断面図、第３図は従来の電子部品を
搭載したプリント基板の一例の断面図である。 １・・・基板部、２・・・素子固定層、３・・・半田ラ
ンド、４・・・スルーホール、１１・・・電子部品、１
２・・・電極端子、１３・・・半田。Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of an example of use of the embodiment of Fig. 1, and Fig. 3 is a sectional view of an example of a conventional printed circuit board on which electronic components are mounted. It is. DESCRIPTION OF SYMBOLS 1... Board part, 2... Element fixing layer, 3... Solder land, 4... Through hole, 11... Electronic component, 1
2... Electrode terminal, 13... Solder.

Claims (1)

【特許請求の範囲】[Claims] 　電子部品を搭載する側の面上に透明または半透明で、
耐熱性と絶縁性と弾力性を持つゴム系または樹脂系の素
材で作られた素子固定層を設けたことを特徴とするプリ
ント基板。Transparent or translucent on the side where electronic components are mounted,
A printed circuit board characterized by having an element fixing layer made of a rubber or resin material that has heat resistance, insulation, and elasticity.
JP3540590A 1990-02-15 1990-02-15 Printed circuit board Pending JPH03238891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3540590A JPH03238891A (en) 1990-02-15 1990-02-15 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3540590A JPH03238891A (en) 1990-02-15 1990-02-15 Printed circuit board

Publications (1)

Publication Number Publication Date
JPH03238891A true JPH03238891A (en) 1991-10-24

Family

ID=12440990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3540590A Pending JPH03238891A (en) 1990-02-15 1990-02-15 Printed circuit board

Country Status (1)

Country Link
JP (1) JPH03238891A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009028499A1 (en) * 2009-08-13 2011-02-17 Endress + Hauser Gmbh + Co. Kg Mixedly assembled printed circuit boards assembling and soldering method, involves inserting connection pins of through-hole-technique-components into solderable clamping devices and soldering connection pins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009028499A1 (en) * 2009-08-13 2011-02-17 Endress + Hauser Gmbh + Co. Kg Mixedly assembled printed circuit boards assembling and soldering method, involves inserting connection pins of through-hole-technique-components into solderable clamping devices and soldering connection pins

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