KR19990030207U - Tuner's PCB Structure - Google Patents
Tuner's PCB Structure Download PDFInfo
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- KR19990030207U KR19990030207U KR2019970042880U KR19970042880U KR19990030207U KR 19990030207 U KR19990030207 U KR 19990030207U KR 2019970042880 U KR2019970042880 U KR 2019970042880U KR 19970042880 U KR19970042880 U KR 19970042880U KR 19990030207 U KR19990030207 U KR 19990030207U
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- tuner
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Abstract
본 고안은 튜너의 인쇄회로기판 결합구조에 있어서, 내측으로 다수개의 엠보싱(111)을 형성시키고 엠보싱(111)에 크림솔더(112)를 도포하여 삽입부품과 동시에 솔더링하도록 하는 섀시(110)와, 상기 섀시(110)의 엠보싱(111)에 대향되는 삽입이 용이하도록 하는 가이드홈(121)을 가장자리에 형성시킨 인쇄회로기판(120)으로 구성하여 튜너의 섀시와 인쇄회로기판을 조립하는 공정 수를 최소화시켜 생산성과 조립성을 향상시켜 코스트를 저감시킬 수 있을 뿐만 아니라 설비를 최소화하여 공간효율을 극대화시키는 효과가 있다.According to the present invention, in a printed circuit board coupling structure of a tuner, a plurality of embossings 111 are formed inward and a cream solder 112 is applied to the embossings 111 to simultaneously solder the inserts and the chassis 110. The number of steps of assembling the tuner chassis and the printed circuit board by configuring the printed circuit board 120 formed at the edge of the guide groove 121 to facilitate the insertion opposite to the embossing 111 of the chassis 110. By minimizing the productivity and assemblability to reduce the cost, it is also effective to maximize the space efficiency by minimizing the equipment.
Description
본 고안은 튜너의 인쇄회로기판 결합구조에 관한 것으로, 상세하게는 튜너의 섀시에 인쇄회로기판을 정확하게 결합시키고 공정 수를 최소화시켜 생산성과 조립성을 극대화시킬 수 있도록 하는 튜너의 인쇄회로기판 결합구조에 관한 것이다.The present invention relates to a printed circuit board coupling structure of the tuner, and more specifically, to a tuner printed circuit board coupling structure that accurately couples the printed circuit board to the tuner chassis and minimizes the number of processes to maximize productivity and assembly. It is about.
도 1은 종래의 튜너 인쇄회로기판 결합구조를 나타낸 단면도이다.1 is a cross-sectional view showing a conventional tuner printed circuit board coupling structure.
도 1에 나타낸 바와 같이 종래의 튜너용 인쇄회로기판 결합구조는 섀시(110)에 인쇄회로기판(120)을 조립하기 전에 삽입 부품용 크림솔더(112)를 도포하여 이를 경화로에 통과시켜 크림솔더를 녹여 삽입부품을 솔더링한 다음 인쇄회로기판(120)을 섀시(110)에 삽입하고 섀시(120)의 내주연 소정위치에 크림솔더(112)를 도포하며 이를 경화로에 통과시켜 섀시(110)와 인쇄회로기판(120)을 견고하게 결합시켰다.As shown in FIG. 1, the conventional tuner printed circuit board coupling structure applies a cream solder 112 for insert parts before assembling the printed circuit board 120 on the chassis 110 and passes the cream solder 112 through a hardening furnace. Melt the solder and then insert the printed circuit board 120 into the chassis 110, and apply the cream solder 112 in a predetermined position on the inner periphery of the chassis 120 and passes through the hardening furnace to the chassis 110 And the printed circuit board 120 are firmly coupled.
그러나 이러한 종래의 인쇄회로기판(120) 결합구조는 섀시(110)와 인쇄회로기판(120)의 조립전에 인쇄회로기판(120)에 부품을 삽입하여 삽입부품용 크림솔더(112)를 도포하고 경화로에 통과시켜 삽입부품이 솔더링 되도록 한 다음에 섀시(110)와 인쇄회로기판(120)을 크림솔더(112)로 결합시킴으로써 작업공정이 많아 비효율적일 뿐만 아니라 이로 인하여 생산성과 조립성이 저하되고 코스트가 상승되는 문제점이 있었다.However, such a conventional printed circuit board 120 coupling structure inserts a component into the printed circuit board 120 before assembling the chassis 110 and the printed circuit board 120 to apply and harden the cream solder 112 for inserts. After passing through the furnace to solder the insert, the chassis 110 and the printed circuit board 120 are combined with the cream solder 112, which is not only inefficient but also inefficient and costly. There was a problem that is elevated.
따라서 본 고안의 주 목적은 튜너의 섀시와 인쇄회로기판을 조립하는 공정수를 최소화시켜 생산성과 조립성을 향상시켜 코스트를 저감시킬 수 있도록 하는데 있다.Therefore, the main purpose of the present invention is to minimize the number of processes of assembling the tuner chassis and the printed circuit board to improve the productivity and assembling to reduce the cost.
본 고안의 다른 목적은 설비를 최소화하여 공간효율을 극대화시킬 수 있도록 하는데 있다.Another object of the present invention is to minimize the installation to maximize the space efficiency.
도 1은 종래의 튜너 인쇄회로기판 결합구조를 나타낸 단면도.1 is a cross-sectional view showing a conventional tuner printed circuit board coupling structure.
도 2는 본 고안의 튜너 인쇄회로기판 결합구조를 나타낸 단면도.Figure 2 is a cross-sectional view showing a tuner printed circuit board coupling structure of the present invention.
도 3은 본 고안의 튜너 인쇄회로기판 결합구조를 나타낸 평면도.Figure 3 is a plan view showing a tuner printed circuit board coupling structure of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
100 : 튜너110 : 섀시100: tuner 110: chassis
111 : 엠보싱112 : 크림솔더111: embossing 112: cream solder
120 : 인쇄회로기판121 : 가이드홈120: printed circuit board 121: guide groove
위와 같은 목적을 달성하기 위하여 본 고안은 튜너의 인쇄회로기판 결합구조에 있어서, 내측으로 다수개의 엠보싱을 형성시킨 섀시와, 상기 섀시의 엠보싱에 대향되는 가이드홈을 가장자리에 형성시킨 인쇄회로기판으로 구성함을 그 기술적 구성상의 기본 특징으로 한다.In order to achieve the above object, the present invention is a printed circuit board coupling structure of a tuner, comprising a chassis formed with a plurality of embossing inward, and a printed circuit board formed with a guide groove facing the embossing of the chassis at the edge The basic features of the technical construction.
위와 같이 구성된 본 고안의 바람직한 실시예를 첨부된 도면을 참조하면서 상세히 설명하면 다음과 같다.When described in detail with reference to the accompanying drawings a preferred embodiment of the present invention configured as described above are as follows.
도 2는 본 고안의 튜너 인쇄회로기판 결합구조를 나타낸 단면도이고, 도 3은 본 고안의 튜너 인쇄회로기판 결합구조를 나타낸 평면도이다.2 is a cross-sectional view showing a tuner printed circuit board coupling structure of the present invention, Figure 3 is a plan view showing a tuner printed circuit board coupling structure of the present invention.
도 2과 도 3에 나타낸 바와 같이, 본 고안은 튜너(100)의 인쇄회로기판(120) 결합구조에 있어서, 내측으로 다수개의 엠보싱(111)을 형성시키고 엠보싱(111)에 크림솔더(112)를 도포하여 삽입부품과 동시에 솔더링하도록 하는 섀시(110)와, 상기 섀시(110)의 엠보싱(111)에 대향되는 삽입이 용이하도록 하는 가이드홈(121)을 가장자리에 형성시킨 인쇄회로기판(120)으로 구성한다.As shown in FIG. 2 and FIG. 3, in the present invention, in the coupling structure of the printed circuit board 120 of the tuner 100, a plurality of embossings 111 are formed inward and a cream solder 112 is formed on the embossings 111. A printed circuit board 120 having a chassis 110 formed at the edge of the chassis 110 to allow soldering at the same time as the insert part and a guide groove 121 for easy insertion opposite to the embossing 111 of the chassis 110. Consists of.
상기 인쇄회로기판(120)의 가이드홈(121)은 삽입이 자유롭게 하기 위하여 섀시(110)의 엠보싱(111)보다 약간 크게 형성한다.The guide groove 121 of the printed circuit board 120 is formed slightly larger than the embossing 111 of the chassis 110 in order to be free to insert.
상기 섀시(110)의 엠보싱(111)은 인쇄회로기판(120)의 삽입시 인쇄회로기판(120)보다 약간 상측에 위치되게 하여 크림솔더(112)의 용해하여 흘러내림으로써 결합되게 한다.The embossing 111 of the chassis 110 is positioned slightly above the printed circuit board 120 upon insertion of the printed circuit board 120 so that the cream solder 112 melts and flows down.
이러한 본 고안의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention is as follows.
먼저 인쇄회로기판(120)에 삽입부품을 삽입한 다음 삽입부품의 솔더링위치에 크림솔더(112)를 도포함과 동시에 섀시(110)의 엠보싱(111)에도 크림솔더(112)를 도포하다.First, the insertion part is inserted into the printed circuit board 120, and then the cream solder 112 is also applied to the embossing 111 of the chassis 110 while the cream solder 112 is included at the soldering position of the insert.
크림솔더(112)의 도포가 완료되면 인쇄회로기판(120)를 섀시(110)에 삽입한다음 경화로에 통과시켜 도포된 크림솔더(112)를 용해시켜 인쇄회로기판(120)에 삽입된 부품을 솔더링 함과 동시에 섀시(110)의 엠보싱(111)과 인쇄회로기판(120)을 솔더링하여 결합시킨다.When the application of the cream solder 112 is completed, the printed circuit board 120 is inserted into the chassis 110, and then passed through a curing furnace to dissolve the applied cream solder 112, and then inserted into the printed circuit board 120. Solder the solder and at the same time solder the embossing 111 and the printed circuit board 120 of the chassis 110 to combine.
따라서 인쇄회로기판(120)의 삽입부품과 섀시(110)를 동시에 솔더링하므로 공정 수를 최소화시킨다.Therefore, the soldering part and the chassis 110 of the printed circuit board 120 at the same time to minimize the number of processes.
이상에서 살펴본 바와 같이, 본 고안은 튜너(100)의 인쇄회로기판(120) 결합구조에 있어서, 내측으로 다수개의 엠보싱(111)을 형성시키고 엠보싱(111)에 크림솔더(112)를 도포하여 삽입부품과 동시에 솔더링하도록 하는 섀시(110)와, 상기 섀시(110)의 엠보싱(111)에 대향되는 삽입이 용이하도록 하는 가이드홈(121)을 가장자리에 형성시킨 인쇄회로기판(120)으로 구성하여 튜너의 섀시와 인쇄회로기판을 조립하는 공정 수를 최소화시켜 생산성과 조립성을 향상시켜 코스트를 저감시킬 수 있을 뿐만 아니라 설비를 최소화하여 공간효율을 극대화 시키는 효과가 있다.As described above, in the present invention, in the coupling structure of the printed circuit board 120 of the tuner 100, a plurality of embossings 111 are formed inward and the cream solder 112 is applied to the embossings 111 to be inserted. The tuner comprises a chassis 110 for soldering simultaneously with components and a printed circuit board 120 formed at an edge of a guide groove 121 for easy insertion opposite to the embossing 111 of the chassis 110. By minimizing the number of processes for assembling the chassis and printed circuit boards, the productivity and assemblability can be improved to reduce the cost and minimize the equipment to maximize the space efficiency.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970042880U KR19990030207U (en) | 1997-12-30 | 1997-12-30 | Tuner's PCB Structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970042880U KR19990030207U (en) | 1997-12-30 | 1997-12-30 | Tuner's PCB Structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19990030207U true KR19990030207U (en) | 1999-07-26 |
Family
ID=69696416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970042880U KR19990030207U (en) | 1997-12-30 | 1997-12-30 | Tuner's PCB Structure |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19990030207U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040072195A (en) * | 2003-02-10 | 2004-08-18 | 삼성전기주식회사 | Chip type gps module |
-
1997
- 1997-12-30 KR KR2019970042880U patent/KR19990030207U/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040072195A (en) * | 2003-02-10 | 2004-08-18 | 삼성전기주식회사 | Chip type gps module |
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