JPH0323304B2 - - Google Patents

Info

Publication number
JPH0323304B2
JPH0323304B2 JP56135122A JP13512281A JPH0323304B2 JP H0323304 B2 JPH0323304 B2 JP H0323304B2 JP 56135122 A JP56135122 A JP 56135122A JP 13512281 A JP13512281 A JP 13512281A JP H0323304 B2 JPH0323304 B2 JP H0323304B2
Authority
JP
Japan
Prior art keywords
polishing
temperature
cooling water
polishing liquid
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56135122A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5840265A (ja
Inventor
Masaharu Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56135122A priority Critical patent/JPS5840265A/ja
Publication of JPS5840265A publication Critical patent/JPS5840265A/ja
Publication of JPH0323304B2 publication Critical patent/JPH0323304B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP56135122A 1981-08-28 1981-08-28 両面ポリシング装置 Granted JPS5840265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135122A JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135122A JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Publications (2)

Publication Number Publication Date
JPS5840265A JPS5840265A (ja) 1983-03-09
JPH0323304B2 true JPH0323304B2 (cg-RX-API-DMAC7.html) 1991-03-28

Family

ID=15144331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135122A Granted JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Country Status (1)

Country Link
JP (1) JPS5840265A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475860A (ja) * 1990-07-15 1992-03-10 Amitec Kk ベルトサンダー機のパッド冷却装置
JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
JP3923107B2 (ja) * 1995-07-03 2007-05-30 株式会社Ｓｕｍｃｏ シリコンウェーハの製造方法およびその装置
JP2025074660A (ja) * 2023-10-30 2025-05-14 株式会社Sumco ワークの研磨装置及び研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454390A (en) * 1977-10-08 1979-04-28 Shibayama Kikai Kk Cooling water temperature control system for polishing table
JPS5775776A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Temperature detector and controller of polishing machine

Also Published As

Publication number Publication date
JPS5840265A (ja) 1983-03-09

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