JPH03227588A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03227588A JPH03227588A JP2049890A JP2049890A JPH03227588A JP H03227588 A JPH03227588 A JP H03227588A JP 2049890 A JP2049890 A JP 2049890A JP 2049890 A JP2049890 A JP 2049890A JP H03227588 A JPH03227588 A JP H03227588A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- connection
- metal plate
- solder
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 20
- 230000005855 radiation Effects 0.000 abstract description 4
- 239000004020 conductor Substances 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
Description
【発明の詳細な説明】
（ＩＩ霊〕
銅板等の金属板を内蔵したプリント配線板の接続スルー
ホールの構造に関し、
接続スルーホール内の溶融ｉ田の熱が放熱しにくい構造
として、部品の端子と接続スルーホールとの半田接続の
信頼性を向上させうろことを目的とし、
金属板を内蔵したプリント配線板において、上記金属板
に形成され、低熱伝導度材料が充填された開口の縁にか
かる部位に接続スルーホールを設けてなり、該接続スル
ーホールの全周のうち、−部が上記金属板と導通接続さ
れ、残りが上記低熱紙Ｓ趨材料と接して構成する。[Detailed Description of the Invention] (II Spirit) Regarding the structure of the connection through hole of a printed wiring board incorporating a metal plate such as a copper plate, the structure is such that the heat of the molten iron in the connection through hole is difficult to dissipate. In a printed wiring board with a built-in metal plate, the scale is formed in the metal plate and spans the edge of the opening filled with a low thermal conductivity material. A connecting through hole is provided at the portion, and of the entire circumference of the connecting through hole, a negative portion is conductively connected to the metal plate, and the remaining portion is in contact with the low heat paper S-like material.
本発明は銅板等の金属板を内蔵したプリント配線板の接
続スルーホールの＊ｉに関する。The present invention relates to a connection through hole *i of a printed wiring board incorporating a metal plate such as a copper plate.
近年、マ導体部品の実装の＾密度化及び部品の高容量化
に伴い、プリント配線板は、＾容量の電流を処理できる
機能を有することが不可欠となってきている。これに対
応しうるものとして、銅板を内蔵したプリント配線板が
使用されている。In recent years, as the mounting density of conductor components has increased and the capacitance of components has increased, it has become essential for printed wiring boards to have the ability to handle a large amount of current. A printed wiring board with a built-in copper plate is used as a solution to this problem.
この銅板の存在により、放熱性が非常によくなり、接続
スルーホール内における部品の端ｆの半田付けの信頼性
を損ねる場合もある。そこで、接続用スルーホールの構
造を改善する必要がある。The presence of this copper plate provides very good heat dissipation, which may impair the reliability of soldering the end f of the component within the connection through hole. Therefore, it is necessary to improve the structure of the connection through hole.
第５図（Ａ）、（Ｂ）は従来のプリント配線板１の１続
スルーホールの部分を拡大して丞す。第５図（Ｂ）に同
図（Ａ）中ＶＢ−ＶＢ線に沿う断面図ある。5(A) and 5(B) are enlarged views of the continuous through-hole portion of the conventional printed wiring board 1. FIG. 5(B) is a sectional view taken along the line VB-VB in FIG. 5(A).
３は接続用スルーホールであり、ドリル加［孔４とスル
ーホールメツキ部５とよりなり銅板６に対しては、その
全周に頁って接続されている。Reference numeral 3 denotes a through hole for connection, which consists of a drilled hole 4 and a plated through hole portion 5, and is connected to the copper plate 6 around its entire circumference.
部品７は、第６図に示すように、端子８を接続スルーホ
ール３内に挿入されて、リフロー等によって半田９によ
り半田付けされて実装される。As shown in FIG. 6, the component 7 is mounted by inserting the terminal 8 into the connection through hole 3 and soldering it with solder 9 by reflow or the like.
接続スルーホール３はその全周に自っで銅板６と接続さ
れているため、リフロー時、接続スルーボール３内の溶
融ｒ田の熱が第６図及び第５図（Ａ）中矢印１０で示す
ように、接続用スルーホール３の全周より銅板６内に逃
げてしまう。Since the connection through hole 3 is connected to the copper plate 6 by itself around its entire circumference, during reflow, the heat of the molten metal inside the connection through ball 3 is transferred as indicated by the arrow 10 in Figs. 6 and 5 (A). As shown, it escapes into the copper plate 6 from the entire circumference of the connection through hole 3.
このため、接続用スルーホール３内を毛細管現象により
上がってきた溶融ｉ田は熱を奪われ、粘性が低下し、流
動性が失われ、第６図に示すように、半田上りが不］−
分となり、部品７の喘ｆ８と接続用スルーホール３との
接続が不完全となってしまうことがある。For this reason, the molten i-metal that has risen inside the connection through-hole 3 due to capillary action is deprived of heat, its viscosity decreases, and fluidity is lost, resulting in no solder rising as shown in FIG.
Therefore, the connection between the part f8 of the component 7 and the connection through hole 3 may become incomplete.
本発明は、接続スルーホール内の溶融半田の熱が放熱し
にくいＩｓｆ！とじて、部品の端Ｉと接続用スルーホー
ルとの半田接続の信頼性を向上させるプリント配線板を
提供することを目的とする。In the present invention, the heat of the molten solder in the connection through hole is difficult to dissipate. An object of the present invention is to provide a printed wiring board that improves the reliability of solder connection between an end I of a component and a connection through hole.
〔課題を解決するための手段）
本発明は、金属板を内蔵したプリント配線板において、
上記金属板に形成され、低熱伝導度材料が充填された開
口の緑にかかる部位に接続スルーホールを設けてなり、
該接続スルーホールの全周のうち、一部が上記金属板と
導通接続され、残りが上記低熱伝導度材料と接してなる
構成とする。[Means for Solving the Problems] The present invention provides a printed wiring board with a built-in metal plate, in which a connection through hole is provided in a green portion of an opening formed in the metal plate and filled with a low thermal conductivity material. A part of the entire circumference of the connection through hole is electrically connected to the metal plate, and the remaining part is in contact with the low thermal conductivity material.
〔作用）
接続スルーホールの全周のうら、低熱伝導度材料と接し
ている部分は、接続スルーホール内の溶融＊ｔｆｌの熱
が逃げることが抑制される領域となる。[Function] The area behind the entire circumference of the connection through hole, which is in contact with the low thermal conductivity material, becomes a region where the heat of the molten *tfl in the connection through hole is suppressed from escaping.
これにより、金属板の使用によって半田熱が逃げやすく
なっているにも掬らヂ、半田熱の放射性が効果的に抑制
され、半田が良好に上り接続スルーホール内で部品の端
Ｉは良好に半田付けされる。As a result, even though the solder heat easily escapes due to the use of a metal plate, the radiation of the solder heat is effectively suppressed, and the solder rises well and the edge I of the component inside the connection through hole is well maintained. be soldered.
（実施例〕
第１図（Ａ）、（Ｂ）は本発明の一実施例になるプリン
ト配線板２０の接続スルーホール２１の部分を拡大して
示す。第１Ｆｉ！Ｊ（Ｂ）は、同図（Ａ）やＩｎ−１８
に沿う断面図である。(Embodiment) FIGS. 1(A) and 1(B) are enlarged views of connection through holes 21 of a printed wiring board 20 according to an embodiment of the present invention. Figure (A) and In-18
FIG.
接続スルーホール２１は、ドリル加工孔２２内にスルー
ホールメツキ部２３を形成してなる。The connection through hole 21 is formed by forming a through hole plated portion 23 in the drilled hole 22.
２４は内層の銅板である。24 is an inner layer copper plate.
ここで、この接続スルーボール２１の構造をこの形成工
程に沿って説明する。Here, the structure of this connecting through ball 21 will be explained along with this forming process.
まず、第２図（Ａ）示すように、銅板２４のうち、接続
スルーホールを形成する予定部２５よりずらして（１″
れ量は接続スルーホールが開口の縁にかかる寸法である
）、接続スルーホールの径ｄ＋より若干大なるｔ！ ｄ
２の開口２６を形成し、ここに、同図（Ｂ）に示すよ
うに、低熱伝導度材料であるエボ↑シ＠ｌ１１２７を充
填する。First, as shown in FIG. 2(A), a portion of the copper plate 24 is shifted (1''
The amount of t! is slightly larger than the diameter d+ of the connection through hole (the amount of the connection through hole is the dimension where the connection through hole touches the edge of the opening). d
2 openings 26 are formed, and these are filled with Eboshi@l1127, which is a low thermal conductivity material, as shown in FIG. 2(B).
次いで、同図（Ｃ）に示すように、上記位置２３にドリ
ル加工して、ドリル加［孔２２を形成する。このドリル
孔２２は開口２６の縁２８にかかる部位に形成される。Next, as shown in FIG. 2C, a drill hole 22 is formed by drilling at the position 23. This drill hole 22 is formed at a portion that spans the edge 28 of the opening 26.
ＩＩＩに同図（Ｄ）に示すようにスルーホールメツキを
施して、スルーホールメツキ部２３を形成する。Through-hole plating is applied to III as shown in FIG. 3(D) to form a through-hole plating portion 23.
これにより、接続スルーホール２１は、その全周のうち
、角度αの部分が銅板２４と導通接続され、残りの角度
βの部分がエポキシ樹脂２７と接した状態となる。As a result, the connection through hole 21 is electrically connected to the copper plate 24 at a portion of its entire circumference at an angle α, and the remaining portion at an angle β is brought into contact with the epoxy resin 27.
ここで、ｄｌは０．１ｍ、ｄ、は， Ｏｍ Ｆ ＩＦ）
リ、角度（１１，ｉ約１２０” （＝ ３６０／３
） ｒアル。Here, dl is 0.1m, d is, Om F IF)
ri, angle (11, i approx. 120" (= 360/3
) r al.
この構造により、リフロー間に、↑出が１続スルーホー
ル２１内に毛Ｓｔ管現象により良好に上がり、部品７の
端Ｆ８と接続スルーホール２１とは、第３図に示すよう
に良好に半田付けされる。With this structure, during reflow, the ↑output rises well in the continuous through hole 21 due to the capillary St tube phenomenon, and the end F8 of the component 7 and the connecting through hole 21 are well soldered as shown in FIG. be attached.
ここで、接続スルーホール２１内の熱が逃げるＩＮ！！
１についてみると、エポキシ樹脂２７側には逃げず、専
ら銅板２４内に矢印２９で示すように逃げる。Here, the heat inside the connection through hole 21 escapes IN! !
1, it does not escape to the epoxy resin 27 side, but escapes exclusively into the copper plate 24 as shown by arrow 29.
即ち、接続スルーホール２１内に入り込んだ溶融半田の
熱が放熱する部分は、この全周のうち角度α（約１２０
°）の範囲に限られ、半ｕｌ熱の放熱が従来の約１／３
に抑Ｉｌｌされる。このため、接続用スルーボール２１
内に上がった溶融Ｖ川は、高い温度を雑持し、良好な流
動性を保ら、第３図に示すように、接続用スルーホール
２１の上方の開口にまで土がり、部品７の端Ｆ８と接続
スルーホール２１とＬ１２好に接続される。３０は半田
である。That is, the portion where the heat of the molten solder that has entered the connection through hole 21 radiates is at an angle α (approximately 120
°), and the heat dissipation of half UL is about 1/3 of the conventional one.
will be suppressed. For this reason, the connecting through ball 21
The molten V-river that has risen inside maintains a high temperature and good fluidity, and as shown in FIG. F8 is connected to the connecting through hole 21 and L12. 30 is solder.
第４図は本発明の別の実施例になるプリント配線＠４０
の接続スルーホール４１の部分を拡大して小す。Figure 4 shows printed wiring @40 which is another embodiment of the present invention.
The connection through hole 41 is enlarged and made smaller.
４２．４３は、Ｊボ１−シ樹脂４４．４５が充填された
銅板４６の同日であり、近接して配しである。42 and 43 are the same dates as the copper plates 46 filled with J-boe resin 44 and 45, and they are arranged close to each other.
接続スルーホール４１は、開口４２．４３の間に形成し
てあり、全周のうち、角度γ，γ２の部分が銅板４６と
接続され、残りの角度θ１゜θ２の部分がエポキシ樹脂
４４．４５と接している。The connection through hole 41 is formed between the openings 42 and 43, and the portions of the entire circumference at angles γ and γ2 are connected to the copper plate 46, and the remaining portions at angles θ1 and θ2 are made of epoxy resin 44 and 45. It is in contact with
この接続用スルーホール４１においても、半田熱の放熱
が効果的に抑制され、部品の端子とＦ＃続ススルーホー
ル４１は第３図に示すと同様に良好に接続される。In this connecting through hole 41 as well, the radiation of soldering heat is effectively suppressed, and the terminal of the component and the F# connecting through hole 41 are well connected as shown in FIG.
以上説明した様に、本発明によれば、金属板の使用によ
って半田熱が逃げ易くなっているにも拘らず、低熱伝導
ｆｌ！４１料と接する部分の存在より接続スルーホール
内の溶融半田の放熱を抑制することが出来、然して、接
続スルーホール内において溶ｍ事田が早期に凝固するこ
とを防止出来、溶融半田が接続スルーホール内に十分に
入り込むことが出来、部品の端子の接続スルーホール内
での半田による接続の信頼性を向上させることが出来る
。１As explained above, according to the present invention, even though the soldering heat easily escapes due to the use of the metal plate, the thermal conductivity is low! The presence of the part in contact with the 41 material can suppress the heat dissipation of the molten solder in the connection through-hole, and prevent the molten solder from solidifying early in the connection through-hole, allowing the molten solder to pass through the connection. The solder can fully penetrate into the hole, and the reliability of the connection by soldering in the connection through hole of the terminal of the component can be improved. 1
第１図は本発明のプリント配線板の一実施例を示す図、
第２図は第１図の接続スルーホールの形成を説明する図
、
第３図は第１図の接続スルーホール内における端子の半
田接続状態を示す図、
第４図は本発明のプリント配線板の別の実施例を示す図
、
第５図は従来のプリント配線板の１例を示す図、第６図
は第５図の接続スルーホール内における端ｆの半田接続
状態を示す図である。
図において、
２０．４０はプリント配線板、
２，４１は接続スルーホール、
２２はドリル加工孔、
２３はスルーホールメツ１部、
２４．２６は銅板、
２５は接続スルーホール形成予定部、
２６．４２．４３は開口、
２７．４４．４５は１ボ、１シ樹脂、
２８は縁、
２９は放熱を示す矢印、
３０は半田
を示す。
（Ｂ）
第４図1 is a diagram showing an embodiment of the printed wiring board of the present invention, FIG. 2 is a diagram illustrating the formation of the connection through hole shown in FIG. 1, and FIG. 3 is a diagram showing the terminal in the connection through hole shown in FIG. 1. FIG. 4 is a diagram showing another embodiment of the printed wiring board of the present invention, FIG. 5 is a diagram showing an example of a conventional printed wiring board, and FIG. FIG. 3 is a diagram showing the state of solder connection of the end f in the connection through-hole of FIG. In the figure, 20.40 is a printed wiring board, 2 and 41 are connection through holes, 22 is a drilled hole, 23 is 1 part of a through hole, 24.26 is a copper plate, 25 is a planned connection through hole formation area, 26. 42, 43 is an opening, 27, 44, 45 is 1 board, 1 resin, 28 is an edge, 29 is an arrow indicating heat radiation, and 30 is solder. (B) Figure 4
Claims (1)
いて、 上記金属板に形成され、低熱伝導度材料（２７，４４，
４５）が充填された開口（２６，４２，４３）の縁（２
８）にかかる部位に接続スルーホール（２１，４１）を
設けてなり、 該接続スルーホール（２１，４１）の全周のうち、一部
（α，γ，γ＿２）が上記金属板（２４，４６）と導通
接続され、残り（β，θ＿１，θ＿２）が上記低熱伝導
度材料（２７，４４，４５）と接してなる構成のプリン
ト配線板。[Scope of Claims] A printed wiring board incorporating a metal plate (24, 46), which is formed on the metal plate and has a low thermal conductivity material (27, 44,
The edge (2) of the opening (26, 42, 43) filled with
A connection through hole (21, 41) is provided at a portion corresponding to the metal plate (24, 8), and a part (α, γ, γ_2) of the entire circumference of the connection through hole (21, 41) is connected to the metal plate (24, 41). 46), and the remaining parts (β, θ_1, θ_2) are in contact with the low thermal conductivity material (27, 44, 45).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020498A JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020498A JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03227588A true JPH03227588A (en) | 1991-10-08 |
| JP2761273B2 JP2761273B2 (en) | 1998-06-04 |
Family
ID=12028828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020498A Expired - Fee Related JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2761273B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532517A (en) * | 1993-06-30 | 1996-07-02 | Mitsubishi Denki Kabushiki Kaisha | Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5680200A (en) * | 1979-12-04 | 1981-07-01 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
| JPS56124298A (en) * | 1980-03-05 | 1981-09-29 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
-
1990
- 1990-02-01 JP JP2020498A patent/JP2761273B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5680200A (en) * | 1979-12-04 | 1981-07-01 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
| JPS56124298A (en) * | 1980-03-05 | 1981-09-29 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532517A (en) * | 1993-06-30 | 1996-07-02 | Mitsubishi Denki Kabushiki Kaisha | Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2761273B2 (en) | 1998-06-04 |
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