JP2761273B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2761273B2 JP2761273B2 JP2020498A JP2049890A JP2761273B2 JP 2761273 B2 JP2761273 B2 JP 2761273B2 JP 2020498 A JP2020498 A JP 2020498A JP 2049890 A JP2049890 A JP 2049890A JP 2761273 B2 JP2761273 B2 JP 2761273B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- connection
- printed wiring
- wiring board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔概要〕 銅板等の金属板を内蔵したプリント配線板の接続スル
ーホールの構造に関し、 接続スルーホール内の溶融半田の熱が放熱しにくい構
造として、部品の端子と接続スルーホールとの半田接続
の信頼性を向上させうることを目的とし、 金属板を内蔵したプリント配線板において、上記金属
板に形成され、低熱伝導度材料が充填された開口の縁に
かかる部位に接続スルーホールを設けてなり、該接続ス
ルーホールの全周のうち、一部が上記金属板と導通接続
され、残りが上記低熱伝導度材料と接して構成する。DETAILED DESCRIPTION OF THE INVENTION [Overview] Regarding the structure of a connection through-hole of a printed wiring board incorporating a metal plate such as a copper plate, the structure has a structure in which the heat of the molten solder in the connection through-hole is difficult to radiate, and is connected to the terminal of the component For the purpose of improving the reliability of the solder connection with the through-hole, in a printed wiring board incorporating a metal plate, a portion formed on the metal plate and over an edge of an opening filled with a low thermal conductivity material. A connection through hole is provided, and a part of the entire circumference of the connection through hole is conductively connected to the metal plate, and the rest is in contact with the low thermal conductivity material.
本発明は銅板等の金属板を内蔵したプリント配線板の
接続スルーホールの構造に関する。The present invention relates to a structure of a connection through hole of a printed wiring board incorporating a metal plate such as a copper plate.
近年、半導体部品の実装の高密度化及び部品の高容量
化に伴い、プリント配線板は、高容量の電流を処理でき
る機能を有することが不可欠となってきている。これに
対応しうるものとして、銅板を内蔵したプリント配線板
が使用されている。In recent years, as the mounting density of semiconductor components and the capacity of the components have been increased, it has become essential for printed wiring boards to have a function of processing a high-capacity current. To cope with this, a printed wiring board having a built-in copper plate is used.
この銅板の存在により、放熱性が非常によくなり、接
続スルーホール内における部品の端子の半田付けの信頼
性を損ねる場合もある。そこで、接続用スルーホールの
構造を改善する必要がある。Due to the presence of the copper plate, the heat dissipation becomes very good, and the reliability of the soldering of the terminal of the component in the connection through hole may be impaired. Therefore, it is necessary to improve the structure of the connection through hole.
第５図（Ａ），（Ｂ）は従来のプリント配線板１の接
続スルーホールの部分を拡大して示す。第５図（Ｂ）に
同図（Ａ）中ＶB−ＶB線に沿う断面図である。FIGS. 5A and 5B show enlarged portions of connection through holes of the conventional printed wiring board 1. FIG. FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG.
３は接続用スルーホールであり、ドリル加工孔４とス
ルーホールメッキ部５とよりなり銅板６に対しては、そ
の全周に亘って接続されている。部品７は、第６図に示
すように、端子８を接続スルーホール３内に挿入され
て、リフロー等によって半田９により半田付けされて実
装される。Reference numeral 3 denotes a through hole for connection, which comprises a drilled hole 4 and a plated through portion 5, and is connected to the copper plate 6 over the entire circumference. As shown in FIG. 6, the component 7 is mounted with the terminal 8 inserted into the connection through hole 3 and soldered by solder 9 by reflow or the like.
接続スルーホール３はその全周に亘って銅板６と接続
されているため、リフロー時、接続スルーホール３内の
溶融半田の熱が第６図及び第５図（Ａ）中矢印10で示す
ように、接続用スルーホール３の全周より銅板６内に逃
げてしまう。Since the connection through-hole 3 is connected to the copper plate 6 over its entire circumference, the heat of the molten solder in the connection through-hole 3 during reflow is indicated by an arrow 10 in FIGS. 6 and 5A. In addition, it escapes into the copper plate 6 from the entire periphery of the connection through hole 3.
このため、接続用スルーホール３内を毛細管現象によ
り上がってきた溶融半田は熱を奪われ、粘性が低下し、
流動性が失われ、第６図に示すように、半田上りが不十
分となり、部品７の端子８と接続用スルーホール３との
接続が不完全となってしまうことがある。For this reason, the molten solder that has risen in the connection through-hole 3 due to the capillary phenomenon is deprived of heat, and its viscosity is reduced.
The fluidity is lost, and as shown in FIG. 6, the soldering may be insufficient, and the connection between the terminal 8 of the component 7 and the connection through hole 3 may be incomplete.
本発明は、接続スルーホール内の溶融半田の熱が放熱
しにくい構造として、部品の端子と接続用スルーホール
との半田接続の信頼性を向上させるプリント配線板を提
供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a printed wiring board having a structure in which the heat of the molten solder in the connection through-hole is difficult to radiate, thereby improving the reliability of the solder connection between the terminal of the component and the connection through-hole.
本発明は、金属板を内蔵しており接続スルーホールが
形成されたプリント配線板において、該金属板を、上記
接続スルーホールが形成される予定の近くに貫通して形
成された開口内に低熱伝導度材料が充填された構成と
し、上記接続スルーホールを、上記開口の縁にかかる部
位に設けてなり、該接続スルーホールの全周のうち、一
部が上記金属板と導通接続され、残りが上記低熱伝導度
材料と接してなる構成である。The present invention relates to a printed wiring board having a built-in metal plate and having a connection through hole formed therein, wherein the metal plate is inserted into an opening formed near the portion where the connection through hole is to be formed. It is configured to be filled with a conductive material, and the connection through-hole is provided at a portion corresponding to an edge of the opening, and a part of the entire circumference of the connection through-hole is conductively connected to the metal plate, and the remaining Are in contact with the low thermal conductivity material.
接続スルーホールの全周のうち、低熱伝導度材料と接
している部分は、接続スルーホール内の溶融半田の熱が
逃げることが抑制される領域となる。A portion of the entire periphery of the connection through hole that is in contact with the low thermal conductivity material is a region where the escape of the heat of the molten solder in the connection through hole is suppressed.
これにより、金属板の使用によって半田熱が逃げやす
くなっているにも拘らず、半田熱の放射性が効果的に抑
制され、半田が良好に上り接続スルーホール内で部品の
端子は良好に半田付けされる。This effectively suppresses the radiation of solder heat, despite the fact that the use of a metal plate makes it easier for solder heat to escape. Is done.
第１図（Ａ），（Ｂ）は本発明の一実施例になるプリ
ント配線板20の接続スルーホール21の部分を拡大して示
す。第１図（Ｂ）は、同図（Ａ）やI B−I Bに沿う断面
図である。1A and 1B are enlarged views of a connection through hole 21 of a printed wiring board 20 according to an embodiment of the present invention. FIG. 1B is a cross-sectional view along FIG. 1A and IB-IB.
接続スルーホール21は、ドリル加工孔22内にスルーホ
ールメッキ部23を形成してなる。The connection through-hole 21 is formed by forming a through-hole plated portion 23 in a drilled hole 22.
24は内層の銅板である。 24 is an inner copper plate.
ここで、この接続スルーホール21の構造をこの形成工
程に沿って説明する。Here, the structure of the connection through-hole 21 will be described along this forming step.
まず、第２図（Ａ）示すように、銅板24のうち、接続
スルーホールを形成する予定部25よりずらして（ずれ量
は接続スルーホールが開口の縁にかかる寸法である）、
接続スルーホールの径d1より若干大なる径d2の開口26を
形成し、ここに、同図（Ｂ）に示すように、伝熱伝導度
材料であるエポキシ樹脂27を充填する。First, as shown in FIG. 2 (A), the copper plate 24 is shifted from a portion 25 where a connection through hole is to be formed (the amount of shift is the dimension of the connection through hole over the edge of the opening).
Connection slightly than the diameter d 1 of the through hole to form an opening 26 having a large becomes diameter d 2, where, as shown in FIG. (B), filling the epoxy resin 27 is heat transfer conductivity material.
次いで、同図（Ｃ）に示すように、上記位置23にドリ
ル加工して、ドリル加工孔22を形成する。このドリル孔
22は開口26の縁28にかかる部位に形成される。Next, as shown in FIG. 2C, a drilling hole 22 is formed by drilling the position 23. This drill hole
Reference numeral 22 denotes a portion formed on the edge 28 of the opening 26.
最後に同図（Ｄ）に示すようにスルーホールメッキを
施して、スルーホールメッキ部23を形成する。Finally, through-hole plating is performed to form a through-hole plated portion 23 as shown in FIG.
これにより、接続スルーホール21は、その全周のう
ち、角度αの部分が銅板24と導通接続され、残りの角度
βの部分がエポキシ樹脂27と接した状態となる。As a result, the connection through hole 21 is electrically connected to the copper plate 24 at the angle α in the entire circumference, and the remaining angle β is in contact with the epoxy resin 27.
ここで、d1は0.7mm,d2は1.0mmであり、角度αは約120
゜（＝360/3）である。Here, d 1 is 0.7 mm, d 2 is 1.0 mm, and the angle α is about 120
゜ (= 360/3).
この構造により、リフロー時に、半田が接続スルーホ
ール21内に毛細管現象により良好に上がり、部品７の端
子８と接続スルーホール21とは、第３図に示すように良
好に半田付けされる。With this structure, at the time of reflow, the solder rises favorably into the connection through-hole 21 due to the capillary phenomenon, and the terminal 8 of the component 7 and the connection through-hole 21 are satisfactorily soldered as shown in FIG.
ここで、接続スルーホール21内の熱が逃げる経路につ
いてみると、エポキシ樹脂27側には逃げず、専ら銅板24
内に矢印20で示すように逃げる。Here, the path through which the heat in the connection through hole 21 escapes does not escape to the epoxy resin 27 side, but only the copper plate 24 does not escape.
Escape as shown by arrow 20 inside.
即ち、接続スルーホール21内に入り込んだ溶融半田の
熱が放熱する部分は、この全周のうち角度α（約120
゜）の範囲に限られ、半田熱の放熱が従来の約1/3に抑
制される。このため、接続用スルーホール21内に上がっ
た溶融半田は、高い温度を維持し、良好な流動性を保
ち、第３図に示すように、接続用スルーホール21の上方
の開口にまで上がり、部品７の端子８と接続スルーホー
ル21とは良好に接続される。30は半田である。That is, the portion where the heat of the molten solder that has entered the connection through hole 21 radiates heat is the angle α (approximately 120
It is limited to the range of 抑制), and the heat radiation of the solder heat is suppressed to about 1/3 of the conventional one. For this reason, the molten solder that has risen into the connection through-hole 21 maintains a high temperature, maintains good fluidity, and rises to the opening above the connection through-hole 21 as shown in FIG. The terminal 8 of the component 7 and the connection through hole 21 are connected well. 30 is solder.
第４図は本発明の別の実施例になるプリント配線板40
の接続スルーホール41の部分を拡大して示す。FIG. 4 shows a printed wiring board 40 according to another embodiment of the present invention.
A portion of the connection through hole 41 of FIG.
42,43は、エポキシ樹脂44,45が充填された銅板46の開
口であり、近接して配してある。Reference numerals 42 and 43 denote openings of the copper plate 46 filled with the epoxy resins 44 and 45, which are arranged close to each other.
接続スルーホール41は、開口42,43の間に形成してあ
り、全周のうち、角度γ1,γ２の部分が銅板46と接続さ
れ、残りの角度θ1,θ２の部分がエポキシ樹脂44,45と
接している。The connection through-hole 41 is formed between the openings 42 and 43. Of the entire circumference, the portions at angles γ 1 and γ 2 are connected to the copper plate 46, and the remaining portions at angles θ 1 and θ 2 are epoxy. It is in contact with resins 44 and 45.
この接続用スルーホール41においても、半田熱の放熱
が効果的に抑制され、部品の端子と接続スルーホール41
とは第３図に示すと同様に良好に接続される。Also in this connection through hole 41, heat radiation of solder heat is effectively suppressed, and the terminal of the component and the connection through hole 41 are connected.
Are connected well as shown in FIG.
〔発明の効果〕 以上説明した様に、本発明によれば、金属板の使用に
よって半田熱が逃げ易くなっているにも拘らず、低熱伝
導度材料と接する部分の存在より接続スルーホール内の
溶融半田の放熱を抑制することが出来、然して、接続ス
ルーホール内において溶融半田が早期に凝固することを
防止出来、溶融半田が接続スルーホール内に十分に入り
込むことが出来、部品の端子の接続スルーホール内での
半田による接続の信頼性を向上させることが出来る。[Effects of the Invention] As described above, according to the present invention, despite the fact that the use of a metal plate facilitates the escape of solder heat, the presence of the portion in contact with the low thermal conductivity material causes The heat radiation of the molten solder can be suppressed, so that the molten solder can be prevented from solidifying early in the connection through hole, the molten solder can sufficiently enter the connection through hole, and the connection of the terminal of the component can be performed. The reliability of connection by solder in the through hole can be improved.
第１図は本発明のプリント配線板の一実施例を示す図、 第２図は第１図の接続スルーホールの形成を説明する
図、 第３図は第１図の接続スルーホール内における端子の半
田接続状態を示す図、 第４図は本発明のプリント配線板の別の実施例を示す
図、 第５図は従来のプリント配線板の１例を示す図、 第６図は第５図の接続スルーホール内における端子の半
田接続状態を示す図である。 図において、 20,40はプリント配線板、 21,41は接続スルーホール、 22はドリル加工孔、 23はスルーホールメッキ部、 24,26は銅板、 25は接続スルーホール形成予定部、 26,42,43は開口、 27,44,45はエポキシ樹脂、 28は縁、 29は放熱を示す矢印、 30は半田 を示す。FIG. 1 is a view showing an embodiment of the printed wiring board of the present invention, FIG. 2 is a view for explaining the formation of the connection through-hole in FIG. 1, and FIG. 3 is a terminal in the connection through-hole in FIG. FIG. 4 is a view showing another embodiment of the printed wiring board of the present invention, FIG. 5 is a view showing an example of a conventional printed wiring board, and FIG. 6 is FIG. FIG. 5 is a diagram showing a solder connection state of a terminal in a connection through hole of FIG. In the figure, 20, 40 is a printed wiring board, 21, 41 is a connection through hole, 22 is a drilled hole, 23 is a plated through hole, 24, 26 is a copper plate, 25 is a portion where a connection through hole is to be formed, 26, 42 Reference numerals 43, 43 indicate openings, 27, 44, 45 indicate epoxy resin, 28 indicates edges, 29 indicates arrows indicating heat radiation, and 30 indicates solder.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大澤 知徳 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (56)参考文献 特開 昭56−80200（ＪＰ，Ａ) 特開 昭56−124298（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/11,3/40,3/42,1/05,3/44──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tomonori Osawa 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (56) References JP-A-56-80200 (JP, A) JP-A-56-124298 (JP, A) (58) Fields surveyed (Int. Cl. 6 , DB name) H05K 1/11, 3/40, 3/42, 1/05, 3/44
Claims (1)
形成されたプリント配線板において、 該金属板を、上記接続スルーホールが形成される予定の
近くに貫通して形成された開口内に低熱伝導度材料が充
填された構成とし、 上記接続スルーホールを、上記開口の縁にかかる部位に
設けてなり、 該接続スルーホールの全周のうち、一部が上記金属板と
導通接続され、残りが上記低熱伝導度材料と接してなる
構成のプリント配線板。1. A printed wiring board having a built-in metal plate and a connection through hole formed therein, wherein the metal plate is inserted into an opening formed through the vicinity of a place where the connection through hole is to be formed. A configuration filled with a low thermal conductivity material, wherein the connection through-hole is provided at a portion over an edge of the opening, and a part of the entire circumference of the connection through-hole is conductively connected to the metal plate; A printed wiring board having a structure in which the rest is in contact with the low thermal conductivity material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020498A JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020498A JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03227588A JPH03227588A (en) | 1991-10-08 |
| JP2761273B2 true JP2761273B2 (en) | 1998-06-04 |
Family
ID=12028828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020498A Expired - Fee Related JP2761273B2 (en) | 1990-02-01 | 1990-02-01 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2761273B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722096A (en) * | 1993-06-30 | 1995-01-24 | Mitsubishi Electric Corp | Hybrid integrated circuit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5680200A (en) * | 1979-12-04 | 1981-07-01 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
| JPS56124298A (en) * | 1980-03-05 | 1981-09-29 | Nippon Electric Co | Method of manufacturing multilayer printed circuit board |
-
1990
- 1990-02-01 JP JP2020498A patent/JP2761273B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03227588A (en) | 1991-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |