JPH03227036A - Transfer of wafer - Google Patents
Transfer of waferInfo
- Publication number
- JPH03227036A JPH03227036A JP2023524A JP2352490A JPH03227036A JP H03227036 A JPH03227036 A JP H03227036A JP 2023524 A JP2023524 A JP 2023524A JP 2352490 A JP2352490 A JP 2352490A JP H03227036 A JPH03227036 A JP H03227036A
- Authority
- JP
- Japan
- Prior art keywords
- fork
- wafers
- transferring
- wafer
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 83
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000007547 defect Effects 0.000 abstract 2
- 239000000284 extract Substances 0.000 abstract 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はウェーハを半導体製造用縦型高温加熱装置に出
し入れする際のウェーハ移載方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer transfer method for loading and unloading wafers into and out of a vertical high-temperature heating apparatus for semiconductor manufacturing.
従来この種のウェーハ移載方法は、第２図（ａ）の外観
図に示すように、ウェーハカセット４とボート１との間
で１枚のみ移載用フォーク８を用いて移載ウェーハ５を
１枚ずつ移し替える方法か、あるいは、第２図（ｂ）の
外観図に示すように、多数枚のウェーハを多数枚同時移
載用フォーク６により一括して移し替える方法かのいず
れかであった。また、それぞれフォークの動作は、フォ
ーク駆動機構９により、Ｘ、Ｙ、Ｚ、θ方向に移動可能
となっている。Conventionally, this type of wafer transfer method uses only one transfer fork 8 to transfer wafers 5 between the wafer cassette 4 and the boat 1, as shown in the external view of FIG. 2(a). Either one method is to transfer the wafers one by one, or a method is to transfer a large number of wafers at once using a fork 6 for simultaneous transfer, as shown in the external view of FIG. 2(b). Ta. Further, each fork can be moved in the X, Y, Z, and θ directions by a fork drive mechanism 9.
上述した従来のウェーハ移載方法は、ウェーハ１枚のみ
移載用のフォークを使用する場合には、百数十枚のウェ
ーハを移載しようとすると、長時間を要するという欠点
がある。The above-described conventional wafer transfer method has the disadvantage that if a fork for transferring only one wafer is used, it takes a long time to transfer a hundred or more wafers.
又、ウェーハ多数枚同時移載用のフォークを使用する場
合には、移載に要する時間は短時間であるが、ウェーハ
１枚のみの移載やウェーハとウェーハの間に歯抜けが有
る場合、そこを補うための移載が不可能であるという欠
点がある。In addition, when using a fork for transferring multiple wafers at the same time, the time required for transfer is short, but if only one wafer is transferred or there is a gap between the wafers, There is a drawback in that it is impossible to transfer to compensate for this.
上述した従来のウェーハ移載方法に対し、本発明はウェ
ーハ１枚のみ移載用フォークとウェーハ多数枚を同時に
移載する為のフォークの両方の動作を組み合わせて使用
するという相違点を有する。The present invention differs from the conventional wafer transfer method described above in that it uses a combination of operations of both a fork for transferring only one wafer and a fork for transferring a large number of wafers at the same time.
本発明のウェーハ移載方法は、ウェーハ１枚のみ移載用
フォークとウェーハ多数枚同時移載用フォークの両方を
有する移載装置を使用し、ウェーハの同時移載枚数が多
数枚有る場合は、多数枚同時移載用フォークを用い、又
、ウェーハの移載枚数が多数枚同時移載用フォークの１
回当りの移載枚数に満たない場合は、ウェーハ１枚のみ
移載用フォークを用いるようにしたものである。The wafer transfer method of the present invention uses a transfer device having both a fork for transferring only one wafer and a fork for transferring multiple wafers at the same time. A fork for transferring multiple wafers at the same time is used, and the number of wafers to be transferred at the same time is
If the number of wafers to be transferred per transfer is less than the number, the transfer fork is used for only one wafer.
〔実施例〕 次に本発明について図面を参照して説明する。〔Example〕 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を説明するためのウェーハ移
載装置の外観図である。移載ウェーハ５は、ボート１と
ウェーハカセット４との間を移載され、相手方にウェー
ハ２として搭載される。本実施例では、多数枚移載用フ
ォークとして５枚同時移載用フォークを例にとり説明す
る。本実施例に使用する装置は、移載用フォークとして
５枚移載用フォーク６と１枚のみ移載用フォーク８との
両方を備え、フォーク駆動用機構９により、ボート１と
ウェーハカセット４との間で、ｘ、ｙ。FIG. 1 is an external view of a wafer transfer device for explaining one embodiment of the present invention. The transferred wafer 5 is transferred between the boat 1 and the wafer cassette 4, and is loaded as a wafer 2 on the other party. In this embodiment, a fork for simultaneously transferring five sheets will be explained as an example of a fork for transferring a large number of sheets. The apparatus used in this embodiment is equipped with both a five-sheet transfer fork 6 and a single-sheet transfer fork 8, and a fork drive mechanism 9 is used to connect the boat 1 and wafer cassette 4. Between x, y.
Ｚ、θ方向の動作が可能である。Operation in Z and θ directions is possible.
５枚同時移載用フォーク６は、同時移載ウェーハが５枚
以上有る場合前後に動作し、ウェーハカセット４から移
載ウェーハを抜き取り、５枚−括してボート１に移す移
載動作を行なう。１枚のみ移載用フォーク８は、同時移
載ウェーハが５枚未満の場合前後に動作しウェーハカセ
ット４から移載ウェーハを抜き取り１枚ずつボート１に
移す移載動作を行なう。The fork 6 for simultaneous transfer of five wafers moves back and forth when there are five or more wafers to be transferred simultaneously, and performs a transfer operation to extract the transferred wafers from the wafer cassette 4 and transfer them to the boat 1 in groups of five wafers. . When the number of wafers to be transferred at the same time is less than five, the fork 8 for transferring only one wafer moves back and forth to carry out the transfer operation of extracting the transferred wafers from the wafer cassette 4 and transferring them to the boat 1 one by one.
以上説明したように本発明は、ウェーハ多数枚同時移載
用フォークと１枚のみ移載用フォークとの両方を有する
装置を使用する事により、ウェーハの同時移載枚数が多
数枚同時移載用フォークの１回当りの移載枚数以上であ
る場合は多数枚同時移載用フォークを用いる事ができる
。その為、従来は１枚のみ移載用フォークしか使えなか
った場合でも多数枚同時移載用フォークが使えるように
なり、ウェーハ移載時の工程を従来の１／４〜１１５に
短縮でき、移載時間も１／４〜１１５に短縮できる効果
がある。As explained above, the present invention can increase the number of wafers to be transferred simultaneously by using a device having both a fork for transferring a large number of wafers and a fork for transferring only one wafer. If the number of sheets to be transferred is greater than the number of sheets that can be transferred at one time using a fork, a fork for transferring multiple sheets at the same time can be used. Therefore, even if previously only a fork for transferring one wafer could be used, a fork for transferring multiple wafers at the same time can now be used, reducing the process for transferring wafers to 1/4 to 115 times compared to conventional methods. It has the effect of shortening the loading time to 1/4 to 115 times.
又、ウェーハ移載枚数が多数枚同時移載用フォーク１回
当りの移載枚数未満である場合や、歯ぬけの部分にウェ
ーハを移載する場合は、１枚のみ移載用フォークを用い
る事ができる為、多数枚同時移載用フォークの欠点を補
う事ができるという効果がある。In addition, if the number of wafers to be transferred is less than the number of wafers to be transferred per one fork for transferring multiple wafers at the same time, or if wafers are to be transferred to a gap in the tooth, use only one fork for transferring wafers. This has the effect of compensating for the drawbacks of forks for transferring multiple sheets at the same time.
第１図は本発明の一実施例を説明するためのウェーハ移
載装置の外観図、第２図（ａ）、（ｂ）は、従来の方法
を説明するためのウェーハ移載装置の外観図である。
１・・・ボート、２・・・ウェーハ、４・・・ウェーハ
カセット、５・・・移載ウェーハ、６・・・５枚同時移
載用フォーク、８・・・１枚のみ移載用フォーク、９・
・・フォーク駆動機構。FIG. 1 is an external view of a wafer transfer device for explaining an embodiment of the present invention, and FIGS. 2(a) and (b) are external views of a wafer transfer device for explaining a conventional method. It is. 1... Boat, 2... Wafer, 4... Wafer cassette, 5... Wafer transfer, 6... Fork for transferring 5 wafers at the same time, 8... Fork for transferring only 1 wafer. , 9・
...Fork drive mechanism.
Claims (1)
用フォークの両方を備えたウェーハ移載装置を使用し、
ウェーハカセットとボートとの間のウェーハ同時移載枚
数が多数枚同時移載用フォークの移載枚数より多い場合
は多数枚同時移載用フォークを使用することを特徴とす
るウェーハ移載方法。 ２、ウェーハ同時移載枚数が多数枚同時移載用フォーク
の１回当りの移載枚数に見たない場合は１枚のみ移載用
フォークを使用することを特徴とするウェーハ移載方法
。 ３、１枚のみ移載用フォークを多数枚同時移載用フォー
クの補助に使用する請求項１記載のウェーハ移載方法。[Claims] 1. Using a wafer transfer device equipped with both a fork for transferring only one wafer and a fork for transferring multiple wafers at the same time,
A wafer transfer method characterized in that when the number of wafers simultaneously transferred between a wafer cassette and a boat is greater than the number of wafers transferred by the fork for simultaneous multi-wafer transfer, a fork for simultaneous multi-wafer transfer is used. 2. A wafer transfer method characterized in that only one wafer transfer fork is used when the number of wafers to be simultaneously transferred does not correspond to the number of wafers transferred at one time by the multiple wafer transfer fork. 3. The wafer transfer method according to claim 1, wherein the fork for transferring only one wafer is used to assist the fork for transferring multiple wafers at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023524A JP2654217B2 (en) | 1990-01-31 | 1990-01-31 | Wafer transfer method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023524A JP2654217B2 (en) | 1990-01-31 | 1990-01-31 | Wafer transfer method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03227036A true JPH03227036A (en) | 1991-10-08 |
| JP2654217B2 JP2654217B2 (en) | 1997-09-17 |
Family
ID=12112835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023524A Expired - Fee Related JP2654217B2 (en) | 1990-01-31 | 1990-01-31 | Wafer transfer method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2654217B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002507846A (en) * | 1998-03-20 | 2002-03-12 | ブルックス オートメーション インコーポレイテッド | Substrate transfer method with different holding end effectors |
| JP2007005582A (en) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | Substrate transfer apparatus and semiconductor substrate manufacturing apparatus mounted with the same |
| JP2007150369A (en) * | 2007-03-14 | 2007-06-14 | Renesas Technology Corp | Method of manufacturing semiconductor device |
| JP2010251790A (en) * | 1998-07-10 | 2010-11-04 | Brooks Automation Inc | Dual arm substrate handling robot with batch loader |
| JP2010541201A (en) * | 2007-09-22 | 2010-12-24 | ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー | Delivery mechanism with the ability to handle multiple wafers |
| US9656386B2 (en) | 2010-10-08 | 2017-05-23 | Brooks Automation, Inc. | Coaxial drive vacuum robot |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02151049A (en) * | 1988-12-02 | 1990-06-11 | Tel Sagami Ltd | Substrate transfer device |
| JPH0348439A (en) * | 1989-07-17 | 1991-03-01 | Tokyo Electron Sagami Ltd | Shifting device |
-
1990
- 1990-01-31 JP JP2023524A patent/JP2654217B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02151049A (en) * | 1988-12-02 | 1990-06-11 | Tel Sagami Ltd | Substrate transfer device |
| JPH0348439A (en) * | 1989-07-17 | 1991-03-01 | Tokyo Electron Sagami Ltd | Shifting device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002507846A (en) * | 1998-03-20 | 2002-03-12 | ブルックス オートメーション インコーポレイテッド | Substrate transfer method with different holding end effectors |
| JP2016154248A (en) * | 1998-03-20 | 2016-08-25 | ブルックス オートメーション インコーポレイテッド | Substrate transfer device with different holding end effectors |
| JP2010251790A (en) * | 1998-07-10 | 2010-11-04 | Brooks Automation Inc | Dual arm substrate handling robot with batch loader |
| JP2013093615A (en) * | 1998-07-10 | 2013-05-16 | Brooks Automation Inc | Substrate extraction method of substrate handling robot |
| JP2007005582A (en) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | Substrate transfer apparatus and semiconductor substrate manufacturing apparatus mounted with the same |
| JP2007150369A (en) * | 2007-03-14 | 2007-06-14 | Renesas Technology Corp | Method of manufacturing semiconductor device |
| JP2010541201A (en) * | 2007-09-22 | 2010-12-24 | ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー | Delivery mechanism with the ability to handle multiple wafers |
| US9656386B2 (en) | 2010-10-08 | 2017-05-23 | Brooks Automation, Inc. | Coaxial drive vacuum robot |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2654217B2 (en) | 1997-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |