JPH0322700B2 - - Google Patents
Info
- Publication number
- JPH0322700B2 JPH0322700B2 JP3347183A JP3347183A JPH0322700B2 JP H0322700 B2 JPH0322700 B2 JP H0322700B2 JP 3347183 A JP3347183 A JP 3347183A JP 3347183 A JP3347183 A JP 3347183A JP H0322700 B2 JPH0322700 B2 JP H0322700B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- resin sealing
- sealing frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 238000007789 sealing Methods 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347183A JPS59158579A (ja) | 1983-02-28 | 1983-02-28 | 半導体搭載用プリント配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347183A JPS59158579A (ja) | 1983-02-28 | 1983-02-28 | 半導体搭載用プリント配線基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22963790A Division JPH03114248A (ja) | 1990-08-30 | 1990-08-30 | 半導体搭載用プリント配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158579A JPS59158579A (ja) | 1984-09-08 |
| JPH0322700B2 true JPH0322700B2 (cs) | 1991-03-27 |
Family
ID=12387453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3347183A Granted JPS59158579A (ja) | 1983-02-28 | 1983-02-28 | 半導体搭載用プリント配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158579A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG76530A1 (en) * | 1997-03-03 | 2000-11-21 | Hitachi Chemical Co Ltd | Circuit boards using heat resistant resin for adhesive layers |
-
1983
- 1983-02-28 JP JP3347183A patent/JPS59158579A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158579A (ja) | 1984-09-08 |
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