JPH03226479A - Chip carrier tray - Google Patents

Abstract

PURPOSE:To make the transit or storage of chip carrier possible without causing damages to the electronic circuit parts mounted thereon by a method wherein a chip carrier tray is provided in its surface with a recess for receiving a chip carrier therein and the recess is provided with a pair of the sloping faces opposite each other and inclined to the surface of the chip carrier tray and meeting at the bottom thereof. CONSTITUTION:When a recess 13 receives a rectangular chip carrier 12 therein, it receiver the carrier 12 with the chip carrier 13 inclined to the surface 11a of a chip carrier tray 11. Of all the faces of the chip carrier 12 in the recess 13, the two faces 12a extending upward to meet each other are out of contact with any of the faces of the recess 13. Therefore, when electronic circuit parts 15 such as semiconductor chip are mounted on these two faces 12a, such chip carrier 12 keeps the electronic circuit parts 15 out of contact with the tray 11 to avoid damages thereto, thereby permitting the transit or storage of the chip carrier 12 mounted on the tray 11.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention provides a method for storing or transporting a chip carrier on which a chip-shaped electronic circuit component is mounted. Relating to carrier trays.

[Conventional technology]

FIG. 3 shows a conventional chip carrier tray on which chip carriers are mounted. As shown in the figure, a conventional chip carrier tray (hereinafter simply referred to as a tray) 1 has a plurality of recesses 3 for receiving chip carriers 2 therein. The recess 3 is composed of a bottom surface 3a and side surfaces 3b perpendicular to the bottom surface 3a.

On the other hand, the chip carrier 2 accommodated in the recess 3 is usually formed in the shape of a rectangular parallelepiped.

[Problem to be solved by the invention]

Therefore, while the tray 1 containing the chip carriers 2 in the recesses 3 is being transported, etc., the chip carriers 2 are transferred to the recesses 3.
The side surface 2b of the chip carrier 2 contacts the side surface 3b of the recess 3. Therefore, if electronic circuit components such as semiconductor chips are mounted not only on the top surface 2a of the chip carrier 2 but also on multiple surfaces, the electronic circuit components mounted on the side surface 2b of the chip carrier 2 may overlap the side surface 3b of the recess 3. There was a high risk of damage from contact. For this reason, as shown in the figure, conventionally, the electronic circuit components 5 can be mounted on the chip carrier 2 only on the top surface 2a of the chip carrier 2, and the electronic circuit components 5 can be mounted on the side surface 2b of the chip carrier 2. It was not possible to keep circuit components mounted.

Therefore, in view of the above circumstances, the present invention provides a method for transporting a chip carrier without damaging the electronic circuit components mounted on the chip carrier, even if the chip carrier has electronic circuit components mounted on multiple sides. - The purpose is to provide a chip carrier tray that can be stored, etc.

[Means to solve the problem]

To achieve the above-mentioned object, the chip carrier tray according to the present invention has a recess formed on its surface for receiving the chip carrier, and a recess formed on the surface thereof and having a pair of opposing slopes that are inclined with respect to the surface and intersect with each other at the bottom thereof. It has a structure with surfaces.

[Effect]

By doing so, it becomes possible to store the chip carrier in the recess while being inclined with respect to the surface of the chip carrier tray. Therefore, the two upwardly facing surfaces of the chip carrier housed in the recess are no longer in contact with either surface of the recess.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a sectional view showing one embodiment of a chip carrier tray according to the present invention, showing a state in which a chip carrier is housed in a recessed portion of the chip carrier tray. In the illustrated chip carrier tray 11, its surface 1
A plurality of recesses 13 in which chip carriers 12 are housed
is formed. The recess 13 has a pair of inclined surfaces 13a inclined with respect to the surface 11a of the chip carrier tray 11.
and a side surface 13b perpendicular to the surface 11a. The pair of inclined surfaces 13b face each other and intersect with each other at the bottom of the recess 13.

When the rectangular parallelepiped chip carrier 12 is placed in the recess 13, the chip carrier 12 is placed in an inclined state with respect to the surface 11a of the chip carrier tray 11, as shown. In this way, of the surfaces of the chip carrier 12 housed in the recess 13, the two adjacent surfaces 12a facing upward do not come into contact with any surface of the recess 13. Therefore, if the chip carrier 12 has electronic circuit components 15 such as semiconductor chips mounted on these two surfaces 12a, the chip carrier 12 can be moved to the tray without damaging these electronic circuit components 15 due to contact with the tray 11. 11 for transportation, storage, etc.

〔Effect of the invention〕

As explained above, according to the present invention, two adjacent
If the chip carrier has electronic circuit components mounted on one side, the chip carrier can be transported and stored by mounting it on the chip carrier tray without damaging these electronic circuit components due to contact with the chip carrier tray. It becomes possible to do so.

Furthermore, since the plurality of surfaces of the chip carrier can be effectively used as mounting space for electronic circuit components, the packaging density of electronic circuit components can be improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of a chip carrier tray according to the present invention, FIG. 2 is a sectional view showing an embodiment of a chip carrier tray according to the present invention, and FIG. 3 is a diagram showing a conventional chip carrier tray. FIG. DESCRIPTION OF SYMBOLS 11... Chip carrier tray, 12... Chip carrier, 13... Recessed part, 13a... Inclined surface, 13b
... Side, 15... Electronic circuit parts.

Claims (1)

[Scope of Claims] A tray on which a rectangular parallelepiped chip carrier on which electronic circuit components are mounted is mounted, the tray having a recess for receiving the chip carrier on its surface, and the recess being inclined with respect to the surface. A chip carrier tray comprising a pair of opposing inclined surfaces that intersect with each other at the bottom of the tray.