JPH0322477B2 - - Google Patents
Info
- Publication number
- JPH0322477B2 JPH0322477B2 JP63045343A JP4534388A JPH0322477B2 JP H0322477 B2 JPH0322477 B2 JP H0322477B2 JP 63045343 A JP63045343 A JP 63045343A JP 4534388 A JP4534388 A JP 4534388A JP H0322477 B2 JPH0322477 B2 JP H0322477B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- zinc
- plating film
- nickel
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 72
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 41
- -1 amino acid salt Chemical class 0.000 claims description 25
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 13
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 150000001413 amino acids Chemical class 0.000 claims description 10
- 150000001414 amino alcohols Chemical class 0.000 claims description 10
- 229910001854 alkali hydroxide Inorganic materials 0.000 claims description 7
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 7
- 239000008139 complexing agent Substances 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 15
- 235000001014 amino acid Nutrition 0.000 description 14
- 229940024606 amino acid Drugs 0.000 description 14
- 229910052759 nickel Inorganic materials 0.000 description 13
- 150000002500 ions Chemical class 0.000 description 11
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000011701 zinc Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 6
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 5
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 5
- 229960004441 tyrosine Drugs 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 241000894007 species Species 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 229940051269 1,3-dichloro-2-propanol Drugs 0.000 description 2
- DEWLEGDTCGBNGU-UHFFFAOYSA-N 1,3-dichloropropan-2-ol Chemical compound ClCC(O)CCl DEWLEGDTCGBNGU-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- CUYKNJBYIJFRCU-UHFFFAOYSA-N 3-aminopyridine Chemical compound NC1=CC=CN=C1 CUYKNJBYIJFRCU-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000080590 Niso Species 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- DNKPFCQEGBJJTE-UHFFFAOYSA-N diiodohydroxypropane Chemical compound ICC(O)CI DNKPFCQEGBJJTE-UHFFFAOYSA-N 0.000 description 2
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VEAZEPMQWHPHAG-UHFFFAOYSA-N n,n,n',n'-tetramethylbutane-1,4-diamine Chemical compound CN(C)CCCCN(C)C VEAZEPMQWHPHAG-UHFFFAOYSA-N 0.000 description 2
- DMQSHEKGGUOYJS-UHFFFAOYSA-N n,n,n',n'-tetramethylpropane-1,3-diamine Chemical compound CN(C)CCCN(C)C DMQSHEKGGUOYJS-UHFFFAOYSA-N 0.000 description 2
- ZRSNZINYAWTAHE-UHFFFAOYSA-N p-methoxybenzaldehyde Chemical compound COC1=CC=C(C=O)C=C1 ZRSNZINYAWTAHE-UHFFFAOYSA-N 0.000 description 2
- 159000000001 potassium salts Chemical class 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 description 1
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical compound O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- NYPYHUZRZVSYKL-UHFFFAOYSA-N -3,5-Diiodotyrosine Natural products OC(=O)C(N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-UHFFFAOYSA-N 0.000 description 1
- IHGHFMVCCDYILJ-UHFFFAOYSA-N 1,1-dibromopropan-2-ol Chemical compound CC(O)C(Br)Br IHGHFMVCCDYILJ-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- KWMLJOLKUYYJFJ-UHFFFAOYSA-N 2,3,4,5,6,7-Hexahydroxyheptanoic acid Chemical compound OCC(O)C(O)C(O)C(O)C(O)C(O)=O KWMLJOLKUYYJFJ-UHFFFAOYSA-N 0.000 description 1
- ZXCYIJGIGSDJQQ-UHFFFAOYSA-N 2,3-dichloropropan-1-ol Chemical compound OCC(Cl)CCl ZXCYIJGIGSDJQQ-UHFFFAOYSA-N 0.000 description 1
- GHKSKVKCKMGRDU-UHFFFAOYSA-N 2-(3-aminopropylamino)ethanol Chemical compound NCCCNCCO GHKSKVKCKMGRDU-UHFFFAOYSA-N 0.000 description 1
- AGIBHMPYXXPGAX-UHFFFAOYSA-N 2-(iodomethyl)oxirane Chemical compound ICC1CO1 AGIBHMPYXXPGAX-UHFFFAOYSA-N 0.000 description 1
- UTIMIHJZXIJZKZ-UHFFFAOYSA-N 2-amino-3-(2,4-dihydroxyphenyl)propanoic acid Chemical compound OC(=O)C(N)CC1=CC=C(O)C=C1O UTIMIHJZXIJZKZ-UHFFFAOYSA-N 0.000 description 1
- CJNRGSHEMCMUOE-UHFFFAOYSA-N 2-piperidin-1-ylethanamine Chemical compound NCCN1CCCCC1 CJNRGSHEMCMUOE-UHFFFAOYSA-N 0.000 description 1
- NYPYHUZRZVSYKL-ZETCQYMHSA-N 3,5-diiodo-L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC(I)=C(O)C(I)=C1 NYPYHUZRZVSYKL-ZETCQYMHSA-N 0.000 description 1
- UIKUBYKUYUSRSM-UHFFFAOYSA-N 3-morpholinopropylamine Chemical compound NCCCN1CCOCC1 UIKUBYKUYUSRSM-UHFFFAOYSA-N 0.000 description 1
- ROEWEIJJGJGZJM-UHFFFAOYSA-N 3-n,3-n,3-trimethylbutane-1,3-diamine Chemical compound CN(C)C(C)(C)CCN ROEWEIJJGJGZJM-UHFFFAOYSA-N 0.000 description 1
- JJKVMNNUINFIRK-UHFFFAOYSA-N 4-amino-n-(4-methoxyphenyl)benzamide Chemical compound C1=CC(OC)=CC=C1NC(=O)C1=CC=C(N)C=C1 JJKVMNNUINFIRK-UHFFFAOYSA-N 0.000 description 1
- NUKYPUAOHBNCPY-UHFFFAOYSA-N 4-aminopyridine Chemical compound NC1=CC=NC=C1 NUKYPUAOHBNCPY-UHFFFAOYSA-N 0.000 description 1
- RJWLLQWLBMJCFD-UHFFFAOYSA-N 4-methylpiperazin-1-amine Chemical compound CN1CCN(N)CC1 RJWLLQWLBMJCFD-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004475 Arginine Substances 0.000 description 1
- BWHOZHOGCMHOBV-UHFFFAOYSA-N Benzalacetone Natural products CC(=O)C=CC1=CC=CC=C1 BWHOZHOGCMHOBV-UHFFFAOYSA-N 0.000 description 1
- 229910000669 Chrome steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- SNDPXSYFESPGGJ-BYPYZUCNSA-N L-2-aminopentanoic acid Chemical compound CCC[C@H](N)C(O)=O SNDPXSYFESPGGJ-BYPYZUCNSA-N 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- AHLPHDHHMVZTML-BYPYZUCNSA-N L-Ornithine Chemical compound NCCC[C@H](N)C(O)=O AHLPHDHHMVZTML-BYPYZUCNSA-N 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- RHGKLRLOHDJJDR-BYPYZUCNSA-N L-citrulline Chemical compound NC(=O)NCCC[C@H]([NH3+])C([O-])=O RHGKLRLOHDJJDR-BYPYZUCNSA-N 0.000 description 1
- LEVWYRKDKASIDU-IMJSIDKUSA-N L-cystine Chemical compound [O-]C(=O)[C@@H]([NH3+])CSSC[C@H]([NH3+])C([O-])=O LEVWYRKDKASIDU-IMJSIDKUSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 description 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- SNDPXSYFESPGGJ-UHFFFAOYSA-N L-norVal-OH Natural products CCCC(N)C(O)=O SNDPXSYFESPGGJ-UHFFFAOYSA-N 0.000 description 1
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- RHGKLRLOHDJJDR-UHFFFAOYSA-N Ndelta-carbamoyl-DL-ornithine Natural products OC(=O)C(N)CCCNC(N)=O RHGKLRLOHDJJDR-UHFFFAOYSA-N 0.000 description 1
- AHLPHDHHMVZTML-UHFFFAOYSA-N Orn-delta-NH2 Natural products NCCCC(N)C(O)=O AHLPHDHHMVZTML-UHFFFAOYSA-N 0.000 description 1
- UTJLXEIPEHZYQJ-UHFFFAOYSA-N Ornithine Natural products OC(=O)C(C)CCCN UTJLXEIPEHZYQJ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 1
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 description 1
- 239000004473 Threonine Substances 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229940124277 aminobutyric acid Drugs 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- DAPUDVOJPZKTSI-UHFFFAOYSA-L ammonium nickel sulfate Chemical compound [NH4+].[NH4+].[Ni+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DAPUDVOJPZKTSI-UHFFFAOYSA-L 0.000 description 1
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 1
- 235000009697 arginine Nutrition 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- VNTLIPZTSJSULJ-UHFFFAOYSA-N chromium molybdenum Chemical compound [Cr].[Mo] VNTLIPZTSJSULJ-UHFFFAOYSA-N 0.000 description 1
- 229940117916 cinnamic aldehyde Drugs 0.000 description 1
- KJPRLNWUNMBNBZ-UHFFFAOYSA-N cinnamic aldehyde Natural products O=CC=CC1=CC=CC=C1 KJPRLNWUNMBNBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013477 citrulline Nutrition 0.000 description 1
- 229960002173 citrulline Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000018417 cysteine Nutrition 0.000 description 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 1
- 229960003067 cystine Drugs 0.000 description 1
- TXGQALXWGNPMKD-UHFFFAOYSA-L diazanium;zinc;disulfate;hexahydrate Chemical compound [NH4+].[NH4+].O.O.O.O.O.O.[Zn+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O TXGQALXWGNPMKD-UHFFFAOYSA-L 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229960000415 diiodotyrosine Drugs 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 229960004979 fampridine Drugs 0.000 description 1
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 description 1
- 229960000310 isoleucine Drugs 0.000 description 1
- 229960003136 leucine Drugs 0.000 description 1
- 235000018977 lysine Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- 235000016337 monopotassium tartrate Nutrition 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- 229960003104 ornithine Drugs 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- 229960005190 phenylalanine Drugs 0.000 description 1
- KYKNRZGSIGMXFH-ZVGUSBNCSA-M potassium bitartrate Chemical compound [K+].OC(=O)[C@H](O)[C@@H](O)C([O-])=O KYKNRZGSIGMXFH-ZVGUSBNCSA-M 0.000 description 1
- 229940086065 potassium hydrogentartrate Drugs 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- WTWSHHITWMVLBX-DKWTVANSSA-M sodium;(2s)-2-aminobutanedioate;hydron Chemical compound [Na+].[O-]C(=O)[C@@H](N)CC(O)=O WTWSHHITWMVLBX-DKWTVANSSA-M 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- 229940043825 zinc carbonate Drugs 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229960001296 zinc oxide Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
産業上の利用分野
本発明は、亜鉛−ニツケル合金めつき浴に関す
る。
従来の技術とその課題
亜鉛−ニツケル合金めつき皮膜は、亜鉛めつき
皮膜よりも防食性能に優れていることは良く知ら
れており、近年、例えば自動車部品等の防食性能
を一層向上させるために使用されつつある。
従来亜鉛−ニツケル合金めつき法としては、例
えば、塩化物を含む酸性浴を用いて電気めつきす
る方法が提案されている(特公昭60−12343号)。
しかしながら、この方法によつて、耐食上必要と
される膜厚5μm程度のめつき皮膜を形成した場
合、該めつき皮膜は柔軟性が乏しいため、被めつ
き部品を取付ける時にかかる応力でクラツクが発
生する。このような場合には、亜鉛−ニツケル合
金めつき皮膜は、鉄素地に対する犠性防食作用が
亜鉛めつき皮膜よりも小さいこともあり、亜鉛め
つき皮膜よりも耐食性が劣ることになる。一方、
めつき膜厚が薄ければ取り付け時のクラツクの発
生はなくなるが、十分な耐食性が得られない。ま
た、電解の際、被めつき品に電流密度分布の不均
一を生じることは避けられないため、めつき膜厚
が部分的に不均一となる。例えば、電流密度のよ
り高い所には、必要以上の膜厚のめつきがつき、
取付け時のクラツクの発生を一層助長する。しか
も、めつき浴中に腐蝕性の強い塩化物が多量に含
まれているので、めつき設備が腐食し易くなる。
課題を解決するための手段
本発明者は、上記従来技術の課題に鑑みて鋭意
研究を重ねて来た。その結果、Znイオン、Niイ
オン、水酸化アルカリ、Ni錯化剤、アミノアル
コールポリマー等を含む浴にアミノ酸若しくはア
ミノ酸塩を添加した電解めつき浴を用いる場合に
は、得られる亜鉛−ニツケル合金めつき皮膜の耐
食性及び柔軟性、めつき膜厚の均一性等が著るし
く改善されることを見出し、本発明を完成した。
即ち本発明は、
Znイオン 3〜30g/、
Niイオン 0.2〜20g/、
水酸化アルカリ 20〜300g/、
アミノアルコールポリマー 0.5〜10g/
Niイオン1モルに対してNi錯化剤 1〜20モル
及び
アミノ酸又はアミノ酸塩 0.01〜20g/
を含み且つPHが11以上であることを特徴とする亜
鉛−ニツケル合金めつき浴に係る。
本発明電解亜鉛−ニツケル合金めつき浴によれ
ば、耐食性及び柔軟性に優れた亜鉛−ニツケル合
金めつき皮膜が得られるので、5μm以上めつきを
施しても、被めつき部品を取り付ける時の応力に
よつてクラツクを生じることもなく、しかも良好
な耐食性が維持される。また、本発明めつき浴を
用いると、電流密度が不均一になつた場合、例え
ば、高電流密度になつた場合には、それにともな
つて電流効率が低下するので、めつき膜厚の均一
性が維持される。従つて、電流密度分布の広い複
雑な形状の物品のめつきにも適している。更に、
めつき設備に対する腐蝕性が少なくなつて、めつ
き設備の防食に必要なコストが軽減される。
本発明では、Znイオン源として、Znの酸化物、
水酸化物、無機酸塩、有機酸塩等が使用できる。
その具体例としては、例えば、酸化亜鉛、水酸化
亜鉛、硫酸亜鉛、炭酸亜鉛、硫酸亜鉛アンモニウ
ム、酢酸亜鉛、スルフアミン酸亜鉛等を挙げるこ
とができ、これらの1種又は2種以上を使用でき
る。Znイオン源の使用量は、Znイオンとして、
3〜30g/程度とするのがよい。3g/未満
では、めつきの電流効率が低下し、充分なめつき
膜厚が得られ難く、作業能率上不利であり、一方
30g/を越えると、高電流部と低電流部の電流
効率に著るしい差を生じ、均一なめつき膜厚が得
られ難くなる。
Niイオン源としては、Niの水酸化物、無機酸
塩、有機酸塩等が使用できる。その具体例として
は、例えば、水酸化ニツケル、硫酸ニツケル、炭
酸ニツケル、硫酸ニツケルアンモニウム、スルフ
アミン酸ニツケル、酢酸ニツケル、ギ酸ニツケル
等を挙げることができ、これらの1種又は2種以
上を使用できる。Ni塩の使用量は、Niイオンと
して、0.2〜20g/程度とするのがよい。0.2
g/未満では、めつき浴中のニツケル濃度の僅
かな変動でめつき皮膜中の合金比率が変化し、常
にほぼ一定の合金比率を有するめつき皮膜が得ら
れ難くなるので、浴管理が困難になる。一方20
g/を越えると、浴の汲み出しにより、亜鉛よ
りも高価なニツケルの損失が大きくなり、経済的
でない。
水酸化アルカリとしては公知のものが使用で
き、例えば、水酸化ナトリウム、水酸化カリウム
等を挙げることができる。前記水酸化アルカリの
1種又は2種以上を使用できる。水酸化アルカリ
の使用量は、20〜300g/程度とすればよい。
20g/未満では、めつき浴の電導性が悪くな
り、所定の電流を得るのに通常よりも高い電圧を
必要とし、電力の浪費を招く。一方300g/を
越えると、めつき終了後、次工程に移行する間
に、めつき皮膜の白色光沢が、一般にアルカリ焼
けと称される灰色半光沢乃至黒灰色無光沢に変化
し易くなり、良好なめつき外観が得られ難くな
る。
Niの錯化剤としては公知のものが使用でき、
例えば、クエン酸、酒石酸、ヘプトン酸、グルコ
ン酸等のオキシカルボン酸又はそれらのナトリウ
ム塩若しくはカリウム塩、エチレンジアミン、ジ
エチレントリアミン、トリエチレンテトラミン、
アミノエチルエタノールアミン、2−ヒドロキシ
エチルアミノプロピルアミン、N,N−ジメチル
1,3−ジアミノプロパン、1−アミノ−4−メ
チルピペラジン等のアミノ化合物等を挙げること
ができ、これらの1種又は2種以上を使用でき
る。Ni錯化剤の使用量は、Niイオン1モルに対
し、1〜20モル程度とすればよい。1モル未満で
は、めつき浴中のニツケルの溶解性が不充分とな
り、合金めつきに必要なニツケル濃度が維持でき
ない。一方20モルを越えると、めつき皮膜中のニ
ツケル析出量が著るしく減少し、充分な耐食性を
有するめつき皮膜が得られ難くなる。
アミノアルコールポリマーとしては公知のもの
が使用でき、例えば、少なくとも1種のアミノ化
合物とエピハロヒドリン若しくはグリセロールハ
ロヒドリンとの共重合物(重合度10〜10000程度)
等を挙げることができる。共重合は、例えば、特
公昭50−825号、特開昭50−87934号、金属表面技
術協会・第50回学術構演大会要旨集第12〜13頁
(1974年)等に記載の公知の方法に従つて、以下
のようにして行なわれる。即ち、0.05〜20部程度
の水に、0.1〜10部程度のアミノ化合物を溶解し、
20〜100℃程度の間の適当な温度下に、エピハロ
ヒドリン若しくはグリセロールハロヒドリンを滴
下して重合させればよい。
共重合の際のアミノ化合物とエピハロヒドリン
若しくはグリセロールハロヒドリンとの使用割合
は特に制限されないが、通常アミノ化合物1モル
に対して、エピハロヒドリン若しくはグリセロー
ルハロヒドリンを0.9〜2モル程度使用すればよ
い。アミノ化合物としては、例えば、ジメチルア
ミン、N,N,N′,N′−テトラメチル−1,3
−ジアミノプロパン、N,N−ジメチル−1,3
−ジアミノプロパン、N,N,N′,N′−テトラ
メチル−1,4−ジアミノブタン、イミダゾー
ル、2−メチルイミダゾール、2−アミノピリジ
ン、3−アミノピリジン、4−アミノピリジン、
ピペラジン、1−アミノエチルピペラジン、N−
アミノプロピルモルホリン、N−アミノエチルピ
ペリジン、2−アミノエタノール、ジエタノール
アミン等を挙げることができる。エピハロヒドリ
ンとしては、例えば、エピクロルヒドリン、エピ
ブロモヒドリン、エピヨードヒドリン等を挙げる
ことができ、グリセロールハロヒドリンとして
は、例えば、1,2−ジクロル−3−プロパノー
ル、1,3−ジヨード−2−プロパノール、1,
3−ジブロモ−2−プロパノール、1,3−ジク
ロル−2−プロパノール等を挙げることができ
る。前記アミノアルコールポリマーの1種又は2
種以上を使用できる。アミノアルコールポリマー
の使用量は、0.05〜10g/程度とすればよい。
0.05g/未満では、光沢の鈍い粗雑なめつきに
なり、一方10g/を越えると、素材とめつき皮
膜との密着性が低下する。
アミノ酸としては公知のものが使用でき、例え
ば、アラニン、セリン、アミノ酪酸、トレオニ
ン、バリン、ノルバリン、ロイシン、イソロイシ
ン、シトルリン、フエニルアラニン、チロシン、
ジヨードチロシン、ジオキシフエニルアラニン、
ジブロムチロシン、プロリン、オキシプロリン、
トリプトフアン、システイン、シスチン、メチオ
ニン等の中性アミノ酸、アスパラギン酸、グルタ
ミン酸等の酸性アミノ酸、アルギニン、リジン、
オキシリジン、オルニチン、カナバミン、ヒスチ
ジン等の塩基性アミノ酸等を挙げることができ
る。またアミノ酸塩としては、例えば、前記例示
アミノ酸のナトリウム塩、カリウム塩等を挙げる
ことができる。前記アミノ酸又はアミノ酸塩の1
種又は2種以上を使用できる。アミノ酸及び/又
はアミノ酸塩の使用量は、0.01〜20g/程度と
すればよい。0.01g/未満では、充分な添加効
果が得られず、めつき皮膜の光沢も不充分であ
る。一方、20g/を越えても特に問題はない
が、一層優れた効果が得られず、経済的に無益で
ある。
本発明はめつき浴には、上記必須成分の他に、
芳香族アルデヒド、シンナムアルデヒド等のアル
デヒド類を添加して、めつき皮膜の光沢、レベリ
ング等を一層向上させてもよい。前記アルデヒド
類の使用量は特に制限されないが、通常0.01〜2
g/程度とすればよい。
本発明めつき浴は、常法に従つて、上記各成分
の所定量を水に添加することにより製造できる。
かくして得られる本発明めつき浴のPHは、水酸化
アルカリを所定量含有することにより、11以上と
なつている。11未満では、亜鉛酸塩が不安定にな
り、めつき浴中の亜鉛濃度を所定の範囲に維持で
きなくなる。
本発明めつき浴を用いて電気めつきを行なうに
当つては、公知の電気めつき方法が採用できる。
また、電気めつき条件は特に制限されず、適宜選
沢すればよいが、通常、めつき温度15〜45℃程
度、平均電流密度0.5〜10A/dm2程度とすれば
よい。
本発明めつき浴は、亜鉛−ニツケル合金を施し
得る実質的に全ての素材に使用できる。その具体
例としては、例えば、軟鋼、バネ鋼、クロム鋼、
クロムモリブデン鋼、銅、七三黄銅、六四黄銅等
を挙げることができる。
発明の効果
本発明電解亜鉛−ニツケル合金めつき浴によれ
ば、耐食性及び柔軟性に優れた亜鉛−ニツケル合
金めつき皮膜が得られるので、5μm以上めつきを
施しても、被めつき部品を取り付ける時の応力に
よつてクラツクを生じることもなく、しかも良好
な耐食性が維持される。また、本発明めつき浴を
用いると、電流密度が不均一になつた場合、例え
ば、高電流密度になつた場合には、それにともな
つて電流効率が低下するので、めつき膜厚の均一
性が維持される。従つて、電流密度分布の広い複
雑な形状の物品のめつきにも適している。更に、
めつき設備に対する腐蝕性が少なくなつて、めつ
き設備の防食に必要なコストが軽減される。
実施例
以下に実施例及び比較例を挙げ、本発明をより
一層明瞭なものとする。
実施例 1
ZnO 13g/
NiSO4・6H2O 5.2g/
NaOH 140g/
ジエチレントリアミン 3.8g/
アミノアルコールポリマーA 1.2g/
チロシン 0.72g/
アミノアルコールポリマーAとしては、N,
N,N′,N′−テトラメチル−1,3−ジアミノ
プロパンの1モルとエピクロルヒドリン1モルと
の反応重合物(平均重合度500)を用いた。
50×50×0.5mmの軟鋼板に、上記組成のめつき
浴(PH12.8)を用い、めつき温度30℃、電流密度
1A/dm2、4A/dm2又は10A/dm2で10分間電
気めつきを行なつた。得られためつき皮膜は、良
好な光沢を有していた。めつき皮膜の膜厚(μm)
及びめつき皮膜中のニツケル含有率(重量%)を
第1表に示す。
次いで、上記と同じ条件で、0.5mm厚の軟鋼板
に、めつき皮膜の膜厚が5μmになるまで電気めつ
きした。得られた被めつき鋼板に以下のようにし
て応力を負荷した後、耐食性試験(JIS−Z−
2371に規定する塩水噴霧試験)に供した。即ち、
めつきを施された鋼板を90゜折り曲げて水平に戻
し、次いで前記と同じ折り曲げ位置で反対に90゜
折り曲げて水平に戻した後、めつきが施されてい
る面に塩水を噴霧し、鋼板に赤錆が発生するまで
の時間を調べた。結果を第1表に示す。
INDUSTRIAL APPLICATION FIELD OF THE INVENTION The present invention relates to a zinc-nickel alloy plating bath. Conventional technology and its challenges It is well known that zinc-nickel alloy plating films have better anti-corrosion performance than galvanized films. It is being used. As a conventional zinc-nickel alloy plating method, for example, a method of electroplating using an acidic bath containing chloride has been proposed (Japanese Patent Publication No. 12343/1983).
However, when a plating film with a thickness of about 5 μm, which is required for corrosion resistance, is formed using this method, the plating film has poor flexibility and may crack due to the stress applied when attaching the plated parts. Occur. In such a case, the zinc-nickel alloy plating film may have a smaller sacrificial anticorrosion effect on the iron substrate than the galvanized film, resulting in inferior corrosion resistance than the galvanized film. on the other hand,
If the plating film is thin, cracks will not occur during installation, but sufficient corrosion resistance will not be achieved. Furthermore, during electrolysis, it is unavoidable that the current density distribution becomes non-uniform in the plated product, so that the plating film thickness becomes partially non-uniform. For example, in areas where the current density is higher, the plating layer may be thicker than necessary.
This further promotes the occurrence of cracks during installation. Furthermore, since the plating bath contains a large amount of highly corrosive chloride, the plating equipment becomes susceptible to corrosion. Means for Solving the Problems The present inventor has conducted extensive research in view of the problems of the prior art described above. As a result, when using an electrolytic plating bath in which amino acids or amino acid salts are added to a bath containing Zn ions, Ni ions, alkali hydroxide, Ni complexing agents, amino alcohol polymers, etc., the resulting zinc-nickel alloy It was discovered that the corrosion resistance and flexibility of the plating film, the uniformity of the plating film thickness, etc. were significantly improved, and the present invention was completed. That is, in the present invention, Zn ion 3 to 30 g/, Ni ion 0.2 to 20 g/, alkali hydroxide 20 to 300 g/, amino alcohol polymer 0.5 to 10 g/Ni complexing agent 1 to 20 mol per mol of Ni ion, and The present invention relates to a zinc-nickel alloy plating bath characterized by containing 0.01 to 20 g/amino acid or amino acid salt and having a pH of 11 or more. According to the electrolytic zinc-nickel alloy plating bath of the present invention, a zinc-nickel alloy plating film with excellent corrosion resistance and flexibility can be obtained. Cracks do not occur due to stress, and good corrosion resistance is maintained. Furthermore, when using the plating bath of the present invention, if the current density becomes non-uniform, for example, if the current density becomes high, the current efficiency will decrease accordingly, so that the plating film thickness will be uniform. gender is maintained. Therefore, it is also suitable for plating articles with complex shapes that have a wide current density distribution. Furthermore,
Corrosivity to plating equipment is reduced, reducing the cost required for corrosion protection of plating equipment. In the present invention, as a Zn ion source, Zn oxide,
Hydroxides, inorganic acid salts, organic acid salts, etc. can be used.
Specific examples include zinc oxide, zinc hydroxide, zinc sulfate, zinc carbonate, zinc ammonium sulfate, zinc acetate, zinc sulfamate, etc., and one or more of these can be used. The amount of Zn ion source used is as Zn ions.
The amount is preferably about 3 to 30 g/approximately. If it is less than 3g/, the current efficiency of plating decreases and it is difficult to obtain a sufficient plating film thickness, which is disadvantageous in terms of work efficiency.
If it exceeds 30g/, there will be a significant difference in current efficiency between the high current part and the low current part, making it difficult to obtain a uniform plating film thickness. As the Ni ion source, Ni hydroxide, inorganic acid salts, organic acid salts, etc. can be used. Specific examples thereof include nickel hydroxide, nickel sulfate, nickel carbonate, ammonium nickel sulfate, nickel sulfamate, nickel acetate, and nickel formate, and one or more of these can be used. The amount of Ni salt used is preferably about 0.2 to 20 g/Ni ion. 0.2
If the temperature is less than 1 g/g, the alloy ratio in the plating film will change due to slight fluctuations in the nickel concentration in the plating bath, making it difficult to obtain a plating film with an almost constant alloy ratio, making bath management difficult. become. while 20
If the amount exceeds 1 g/g, the loss of nickel, which is more expensive than zinc, will be large due to pumping out the bath, making it uneconomical. Known alkali hydroxides can be used, such as sodium hydroxide, potassium hydroxide, and the like. One or more of the above alkali hydroxides can be used. The amount of alkali hydroxide to be used may be about 20 to 300 g/approx.
If it is less than 20g/2, the conductivity of the plating bath will be poor, requiring a higher voltage than usual to obtain a given current, resulting in wasted power. On the other hand, if it exceeds 300g/, the white gloss of the plating film tends to change from gray semi-gloss to black-gray matte, which is generally referred to as alkali burn, during the transition to the next process after plating is completed, and it is not good. It becomes difficult to obtain a tanned appearance. Known complexing agents for Ni can be used.
For example, oxycarboxylic acids such as citric acid, tartaric acid, heptonic acid, gluconic acid, or their sodium or potassium salts, ethylenediamine, diethylenetriamine, triethylenetetramine,
Examples include amino compounds such as aminoethylethanolamine, 2-hydroxyethylaminopropylamine, N,N-dimethyl 1,3-diaminopropane, and 1-amino-4-methylpiperazine, and one or two of these More than one species can be used. The amount of the Ni complexing agent used may be approximately 1 to 20 moles per mole of Ni ions. If it is less than 1 mol, the solubility of nickel in the plating bath will be insufficient and the nickel concentration required for alloy plating cannot be maintained. On the other hand, if it exceeds 20 moles, the amount of nickel precipitated in the plating film will be significantly reduced, making it difficult to obtain a plating film with sufficient corrosion resistance. Known amino alcohol polymers can be used, such as copolymers of at least one amino compound and epihalohydrin or glycerol halohydrin (degree of polymerization of about 10 to 10,000).
etc. can be mentioned. Copolymerization can be carried out using known methods such as those described in Japanese Patent Publication No. 50-825, Japanese Patent Application Laid-Open No. 50-87934, Abstracts of the 50th Academic Conference of the Metal Surface Technology Association, pages 12-13 (1974), etc. According to the method, it is carried out as follows. That is, about 0.1 to 10 parts of an amino compound is dissolved in about 0.05 to 20 parts of water,
Epihalohydrin or glycerol halohydrin may be added dropwise at an appropriate temperature of about 20 to 100°C to polymerize. The ratio of the amino compound and epihalohydrin or glycerol halohydrin used during copolymerization is not particularly limited, but usually about 0.9 to 2 moles of epihalohydrin or glycerol halohydrin may be used per 1 mole of the amino compound. Examples of amino compounds include dimethylamine, N,N,N',N'-tetramethyl-1,3
-diaminopropane, N,N-dimethyl-1,3
-diaminopropane, N,N,N',N'-tetramethyl-1,4-diaminobutane, imidazole, 2-methylimidazole, 2-aminopyridine, 3-aminopyridine, 4-aminopyridine,
piperazine, 1-aminoethylpiperazine, N-
Examples include aminopropylmorpholine, N-aminoethylpiperidine, 2-aminoethanol, diethanolamine, and the like. Examples of epihalohydrin include epichlorohydrin, epibromohydrin, epiiodohydrin, etc., and examples of glycerol halohydrin include 1,2-dichloro-3-propanol, 1,3-diiodo-2 -propanol, 1,
Examples include 3-dibromo-2-propanol and 1,3-dichloro-2-propanol. One or two of the above amino alcohol polymers
More than one species can be used. The amount of amino alcohol polymer to be used may be about 0.05 to 10 g/approx.
If it is less than 0.05 g/l, the plating will be dull and rough, while if it exceeds 10 g/l, the adhesion between the material and the plating film will decrease. Known amino acids can be used, such as alanine, serine, aminobutyric acid, threonine, valine, norvaline, leucine, isoleucine, citrulline, phenylalanine, tyrosine,
diiodotyrosine, dioxyphenylalanine,
dibromtyrosine, proline, oxyproline,
Tryptophan, cysteine, cystine, neutral amino acids such as methionine, acidic amino acids such as aspartic acid, glutamic acid, arginine, lysine,
Examples include basic amino acids such as oxylysine, ornithine, canabamine, and histidine. Examples of amino acid salts include sodium salts and potassium salts of the above-mentioned exemplified amino acids. 1 of the above amino acids or amino acid salts
A species or two or more species can be used. The amount of amino acid and/or amino acid salt to be used may be about 0.01 to 20 g/approx. If the amount is less than 0.01 g, sufficient addition effects cannot be obtained and the gloss of the plating film is also insufficient. On the other hand, if it exceeds 20 g/min, there is no particular problem, but even better effects cannot be obtained and it is economically useless. In addition to the above-mentioned essential ingredients, the plating bath of the present invention includes:
Aldehydes such as aromatic aldehyde and cinnamaldehyde may be added to further improve the gloss, leveling, etc. of the plating film. The amount of the aldehyde used is not particularly limited, but is usually 0.01 to 2.
It may be about g/g. The plating bath of the present invention can be produced by adding predetermined amounts of each of the above components to water according to a conventional method.
The pH of the plating bath of the present invention thus obtained is 11 or more by containing a predetermined amount of alkali hydroxide. If it is less than 11, the zincate becomes unstable and the zinc concentration in the plating bath cannot be maintained within a predetermined range. When performing electroplating using the plating bath of the present invention, known electroplating methods can be employed.
Further, the electroplating conditions are not particularly limited and may be selected as appropriate, but usually the plating temperature is about 15 to 45°C and the average current density is about 0.5 to 10 A/dm2. The plating bath of the present invention can be used on virtually all materials to which zinc-nickel alloy can be applied. Specific examples include mild steel, spring steel, chrome steel,
Examples include chromium molybdenum steel, copper, 73 brass, 64 brass, and the like. Effects of the Invention According to the electrolytic zinc-nickel alloy plating bath of the present invention, a zinc-nickel alloy plating film with excellent corrosion resistance and flexibility can be obtained, so even if plating is applied to a thickness of 5 μm or more, the plated parts will remain intact. Cracks do not occur due to stress during installation, and good corrosion resistance is maintained. Furthermore, when using the plating bath of the present invention, if the current density becomes non-uniform, for example, if the current density becomes high, the current efficiency will decrease accordingly, so that the plating film thickness will be uniform. gender is maintained. Therefore, it is also suitable for plating articles with complex shapes that have a wide current density distribution. Furthermore,
Corrosivity to plating equipment is reduced, reducing the cost required for corrosion protection of plating equipment. Examples Examples and comparative examples are given below to further clarify the present invention. Example 1 ZnO 13g / NiSO 4 6H 2 O 5.2g / NaOH 140g / Diethylenetriamine 3.8g / Amino alcohol polymer A 1.2 g / Tyrosine 0.72 g / Amino alcohol polymer A includes N,
A reaction polymer (average degree of polymerization of 500) of 1 mol of N,N',N'-tetramethyl-1,3-diaminopropane and 1 mol of epichlorohydrin was used. A plating bath (PH12.8) with the above composition was used on a 50 x 50 x 0.5 mm mild steel plate at a plating temperature of 30°C and a current density.
Electroplating was carried out at 1 A/dm 2 , 4 A/dm 2 or 10 A/dm 2 for 10 minutes. The resulting dazzling film had good gloss. Thickness of plating film (μm)
Table 1 shows the nickel content (% by weight) in the plating film. Next, under the same conditions as above, a 0.5 mm thick mild steel plate was electroplated until the thickness of the plating film reached 5 μm. After applying stress to the obtained coated steel plate as follows, a corrosion resistance test (JIS-Z-
2371). That is,
The plated steel plate is bent 90 degrees and returned to the horizontal position, then reversely bent 90 degrees at the same bending position as above and returned to the horizontal position.The plated surface is then sprayed with salt water and the steel plate is The time taken for red rust to appear was investigated. The results are shown in Table 1.
【表】
実施例 2
チロシンに代えてアスパラギン酸ナトリウムを
10g/添加する以外は、実施例1と同様の操作
を行なつたところ、良好な光沢を有するめつき皮
膜が得られた。めつき皮膜の膜厚、ニツケル含有
率及び赤錆発生時間を第2表に示す。[Table] Example 2 Sodium aspartate instead of tyrosine
When the same operation as in Example 1 was carried out except that 10 g/g was added, a plated film with good gloss was obtained. Table 2 shows the thickness of the plating film, the nickel content, and the red rust generation time.
【表】
実施例 3
チロシンに代えてオキシリジンを0.03g/添
加する以外は、実施例1と同様の操作を行なつた
ところ、良好な光沢を有するめつき皮膜が得られ
た。めつき皮膜の膜厚、ニツケル含有率及び赤錆
発生時間を第3表に示す。[Table] Example 3 The same operation as in Example 1 was carried out except that 0.03 g of oxylysine was added instead of tyrosine, and a plated film with good gloss was obtained. Table 3 shows the thickness of the plating film, nickel content, and red rust generation time.
【表】
実施例 4
実施例1のめつき浴に、更にアニスアルデヒド
を0.03g/添加し、実施例1と同様の操作を行
なつたところ、良好な鏡面光沢を有するめつき皮
膜が得られた。めつき皮膜の膜厚、ニツケル含有
率及び赤錆発生時間を第4表に示す。[Table] Example 4 When 0.03 g/anisaldehyde was further added to the plating bath of Example 1 and the same operation as in Example 1 was performed, a plating film with good specular gloss was obtained. Ta. Table 4 shows the thickness of the plating film, the nickel content, and the red rust generation time.
【表】
実施例 5
ZnO 25g/
NiSO4・6H2O 35.9g/
NaOH 180g/
酒石酸水素カリウム 26.3g/
エチレンジアミン 21.9g/
アミノアルコールポリマーB 0.75g/
ヒスチジン 0.02g/
グリシン 2.8g/
アミノアルコールポリマーBとしては、2−メ
チルイミダゾールの0.5モル、N,N,N′,N′−
テトラメチル−1,3−ジアミノプロパンの1.5
モルと1,3−ジクロル−2−プロパノールの2
モルとの反応重合物(平均重合度2300)を用い
た。
上記浴(PH13.5)を使用する以外は、実施例1
と同様の操作を行なつたところ、良好な光沢を有
するめつき皮膜が得られた。めつき皮膜の膜厚、
ニツケル含有率及び赤錆発生時間を第5表に示
す。[Table] Example 5 ZnO 25g / NiSO 4 6H 2 O 35.9g / NaOH 180g / Potassium hydrogen tartrate 26.3g / Ethylenediamine 21.9g / Amino alcohol polymer B 0.75g / Histidine 0.02g / Glycine 2.8g / Amino alcohol polymer B is 0.5 mole of 2-methylimidazole, N,N,N',N'-
1.5 of tetramethyl-1,3-diaminopropane
moles and 2 of 1,3-dichloro-2-propanol
A reaction polymer (average degree of polymerization 2300) with moles was used. Example 1 except for using the above bath (PH13.5)
When the same operation as above was carried out, a plated film with good gloss was obtained. Thickness of plating film,
The nickel content and red rust generation time are shown in Table 5.
【表】
比較例 1
特公昭60−12343号公報に記載された、下記組
成のめつき浴を使用し、めつき温度を35℃とする
以外は、実施例1と同様に操作して電気めつきを
行なつた。
ZnCl2 100g/
NiCl2・6H2O 130g/
NH4Cl 200g/
ポリオキシエチレンアルキルエーテル
1.5g/
ベンザルアセトン 0.08g/
(25%水酸化アンモニウムでPH5.7に調整)
得られためつき皮膜は、いずれの電流密度にお
いても良好な光沢を示したが、電流密度の変化に
対し、めつき皮膜の膜厚及びニツケル含有率が大
きく変動し、耐食性も著るしく劣つていた。結果
を第6表に示す。[Table] Comparative Example 1 An electric lamp was produced in the same manner as in Example 1, except that the plating bath with the following composition and the plating temperature as described in Japanese Patent Publication No. 60-12343 was used, and the plating temperature was set at 35°C. I conducted a search. ZnCl 2 100g/ NiCl 2・6H 2 O 130g/ NH 4 Cl 200g/ Polyoxyethylene alkyl ether
1.5g/ Benzalacetone 0.08g/ (adjusted to PH5.7 with 25% ammonium hydroxide) The resulting matte film showed good gloss at any current density, but The thickness and nickel content of the plating film varied greatly, and the corrosion resistance was also significantly inferior. The results are shown in Table 6.
【表】
比較例 2
チロシンを添加しない以外は、実施例1と同様
に操作して電気めつきを行なつた。得られためつ
き皮膜は、1A/dm2の電流密度で灰色無光沢で
あり、4及び10A/dm2では非常に弱い光沢しか
示さず、いずれも実用に供し難い外観であつた。
めつき皮膜の膜厚、ニツケル含有率及び赤錆発生
時間を第7表に示す。[Table] Comparative Example 2 Electroplating was carried out in the same manner as in Example 1 except that tyrosine was not added. The resulting dazzling film was gray and matte at a current density of 1 A/dm 2 and exhibited only very weak gloss at current densities of 4 and 10 A/dm 2 , both of which had an appearance that was difficult to put to practical use.
Table 7 shows the thickness of the plating film, the nickel content, and the red rust generation time.
【表】
第1表乃至第7表から、本発明のめつき浴を用
いた場合には、イ)電流密度の変化に対して、め
つき皮膜の膜厚及びニツケル含有率の変動が少な
いこと、並びに、ロ)従来の亜鉛−ニツケル合金
皮膜に比して、著るしく優れた応力負荷後の耐食
性を有するめつき皮膜が得られることが判る。[Table] From Tables 1 to 7, when the plating bath of the present invention is used, a) there is little variation in the thickness and nickel content of the plating film with respect to changes in current density; and (b) it can be seen that a plated film having significantly superior corrosion resistance after stress loading can be obtained compared to conventional zinc-nickel alloy films.
Claims (1)
鉛−ニツケル合金めつき浴。[Claims] 1 Zn ion 3 to 30 g/, Ni ion 0.2 to 20 g/, alkali hydroxide 20 to 300 g/, amino alcohol polymer 0.05 to 10 g/, Ni complexing agent 1 to 20 per mole of Ni ion. A zinc-nickel alloy plating bath characterized by containing 0.01 to 20 g/mole of an amino acid or an amino acid salt and having a pH of 11 or more.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63045343A JPH01219188A (en) | 1988-02-26 | 1988-02-26 | Zinc-nickel alloy plating bath |
US07/313,124 US4861442A (en) | 1988-02-26 | 1989-02-21 | Zinc-nickel alloy plating bath and plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63045343A JPH01219188A (en) | 1988-02-26 | 1988-02-26 | Zinc-nickel alloy plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01219188A JPH01219188A (en) | 1989-09-01 |
JPH0322477B2 true JPH0322477B2 (en) | 1991-03-26 |
Family
ID=12716642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63045343A Granted JPH01219188A (en) | 1988-02-26 | 1988-02-26 | Zinc-nickel alloy plating bath |
Country Status (2)
Country | Link |
---|---|
US (1) | US4861442A (en) |
JP (1) | JPH01219188A (en) |
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US5266182A (en) * | 1988-03-16 | 1993-11-30 | Kawasaki Steel Corporation | Method for producing Zn-Ni alloy plated steel plate having superior press formability |
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JP6047702B2 (en) | 2013-03-27 | 2016-12-21 | 日本表面化学株式会社 | Zinc-nickel alloy plating solution and plating method |
US10156020B2 (en) * | 2015-07-22 | 2018-12-18 | Dipsol Chemicals Co., Ltd. | Zinc alloy plating method |
WO2019088917A1 (en) * | 2017-11-01 | 2019-05-09 | Agency For Science, Technology And Research | Imidazolium-quaternary ammonium copolymers as novel antibacterial and antifungal materials |
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---|---|---|---|---|
SU524866A1 (en) * | 1975-04-10 | 1976-08-15 | Предприятие П/Я А-7697 | Electrolyte for deposition of zinc-nickel alloys |
US4388160A (en) * | 1980-02-20 | 1983-06-14 | Rynne George B | Zinc-nickel alloy electroplating process |
US4765871A (en) * | 1981-12-28 | 1988-08-23 | The Boeing Company | Zinc-nickel electroplated article and method for producing the same |
JPS62240788A (en) * | 1986-04-14 | 1987-10-21 | Deitsupusoole Kk | Zinc-nickel alloy plating bath |
JP2769614B2 (en) * | 1986-06-04 | 1998-06-25 | ディップソール 株式会社 | Zinc-nickel alloy plating bath |
JPS6353285A (en) * | 1986-08-22 | 1988-03-07 | Nippon Hyomen Kagaku Kk | Zinc-nickel alloy plating solution |
-
1988
- 1988-02-26 JP JP63045343A patent/JPH01219188A/en active Granted
-
1989
- 1989-02-21 US US07/313,124 patent/US4861442A/en not_active Expired - Lifetime
Cited By (2)
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EP2130855A1 (en) | 2008-05-15 | 2009-12-09 | Fujifilm Corporation | Cellulose ester film, retardation film, polarizing plate and liquid crystal display device |
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Also Published As
Publication number | Publication date |
---|---|
JPH01219188A (en) | 1989-09-01 |
US4861442A (en) | 1989-08-29 |
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